专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07281339B2 Encoder system 失效
标题翻译：编码器系统
公开(公告)号：US07281339B2
公开(公告)日：2007-10-16
申请号：US10840769
申请日：2004-05-06
申请人： Michael D. Snyder , Koen A. Gieskes
发明人： Michael D. Snyder , Koen A. Gieskes
IPC分类号： G01D5/347
CPC分类号： G01D11/30 , G01D5/24442 , G01D5/34707 , G01D5/34753 , G01D11/10
摘要： A structure and associated method to accurately read an encoder tape in an encoder system. The encoder system comprises, a read head, a shoe structure adjacent the read head, and an encoder tape. The encoder tape is adapted to be read by the read head. The shoe structure is adapted to locally support the encoder tape and locally dampen a vibration of the encoder tape as the encoder tape is read by the read head.
摘要翻译：一种在编码器系统中精确读取编码器带的结构和相关方法。编码器系统包括读头，与读头相邻的鞋结构和编码器带。编码器磁带适于被读头读取。鞋结构适于在读取头读取编码器带时局部地支撑编码器带并且局部地抑制编码器带的振动。

2. 发明授权

US5739846A Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch 失效
标题翻译：检查要组装的批次的每个第一选定电路板的元件放置精度的方法
公开(公告)号：US5739846A
公开(公告)日：1998-04-14
申请号：US596499
申请日：1996-02-05
申请人： Koen A. Gieskes
发明人： Koen A. Gieskes
IPC分类号： G01R31/28 , G01R31/309 , H04N7/18
CPC分类号： G01R31/2813 , G01R31/309
摘要： An improved method for inspecting assembled circuit boards utilizes an existing programmable placement machine having an associated downward looking camera, illumination source, and monitor. After assembling a first circuit board of a series with electrical components according to a program which is particular to that series, and prior to removing the assembled board from the machine, an inspection is performed by: (i) automatically repositioning the relative position of the camera and the assembled circuit board, according to a portion of that same particular program, in order to address each placement position in turn; (ii) automatically acquiring an image of each placement position when it is addressed, and furnishing the image to the monitor in order to provide a magnified image on the monitor screen; (iii) visually inspecting the magnified image on the monitor screen in order to ascertain the presence or absence of the component at each placement position, the deviation in X, Y, and .theta. of the component relative to the desired placement position and/or the accuracy of connection of component leads to their respective lands on the circuit board; and (iv) providing for human control of the time expended at each placement position during the inspecting and correcting the program with any ascertained deviation.
摘要翻译：用于检查组装电路板的改进方法利用具有相关联的向下观察的相机，照明源和监视器的现有的可编程放置机。在根据该系列特有的程序组装串联的电路板的第一电路板之后，并且在从机器移除组装的板之前，通过以下步骤执行检查：（i）自动重新定位相对位置照相机和组装电路板，根据相同的特定程序的一部分，以依次对每个放置位置进行处理; （ii）在寻址时自动获取每个放置位置的图像，并将图像提供给监视器，以便在监视器屏幕上提供放大图像; （iii）目视检查监视器屏幕上的放大图像，以便确定每个放置位置处的部件的存在或不存在，部件相对于期望的放置位置的X，Y和θ的偏差和/或组件的连接精度导致电路板上各自的焊盘; 以及（iv）在任何确定的偏差的检查和纠正程序期间，提供人力控制在每个安置位置消耗的时间。

3. 发明授权

US5649356A Method and apparatus for supplying and placing components 失效
标题翻译：用于供应和放置部件的方法和装置
公开(公告)号：US5649356A
公开(公告)日：1997-07-22
申请号：US532145
申请日：1995-09-22
申请人： Koen A. Gieskes
发明人： Koen A. Gieskes
IPC分类号： B23P19/00 , H05K13/02 , H05K3/30 , H05K13/04
CPC分类号： H05K13/028 , Y10T29/49131 , Y10T29/49133 , Y10T29/53043 , Y10T29/53178 , Y10T29/53191
摘要： A method and apparatus for automatically supplying surface mount chip components from a bulk feeder and placing the chip components on a substrate. The apparatus includes a base frame, a substrate feeding mechanism, a placement head, and a placement head positioning system. The substrate feeding mechanism delivers substrates to a component receiving position on the base frame. The placement head is translationally movable with respect to the base frame and includes a component supplying and placing mechanism, to supply components and place components on a substrate in a desired location. The component supplying and placing mechanism includes a component transfer mechanism, a component feeder, and a vacuum spindle. The transfer mechanism includes a rotatable wheel with a plurality of component holding compartments, a plurality of angularly disposed stations, and a drive mechanism for sequentially moving the compartments to at least a component receiving station and a component delivery station. The feeder receives a plurality of components from a container and feeds the components in a desired orientation to the receiving station of the transfer mechanism. The vacuum spindle is disposed above the delivery station of the transfer mechanism, and is vertically movable with respect to the delivery station for controlling and placing a component at the delivery station onto the substrate.
摘要翻译：一种用于从批量进料器自动提供表面贴装芯片部件并将芯片部件放置在基板上的方法和装置。该装置包括基架，基板供给机构，放置头和放置头定位系统。基板供给机构将基板输送到基架上的部件接收位置。放置头可相对于底座平移移动并且包括元件供应和放置机构，以将元件供应到所需位置的基板上。部件供给和放置机构包括部件传送机构，部件供给部和真空轴。传送机构包括具有多个部件保持隔间的可旋转轮，多个角度设置的台，以及用于顺序地将隔间移动到至少部件接收站和部件传送站的驱动机构。进料器从容器接收多个部件，并以期望的方向将部件供给到传送机构的接收站。真空主轴设置在传送机构的传送台上方，并且可相对于传送站垂直移动，用于控制和将传送站处的部件放置在基板上。

4. 发明授权

US07267382B2 Low maintenance vacuum generation 有权
标题翻译：低维护真空产生
公开(公告)号：US07267382B2
公开(公告)日：2007-09-11
申请号：US10982508
申请日：2004-11-05
申请人： Koen A. Gieskes , John D. Danek
发明人： Koen A. Gieskes , John D. Danek
IPC分类号： A47J45/00
CPC分类号： H05K13/0409 , Y10S29/044 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191 , Y10T409/309464
摘要： The present invention features a system to generate vacuum for picking up and holding a component in a component placement machine wherein the arrangement of the elements comprising the system prevents the flow of foreign matter back through the system. One arrangement locates a venturi between a valve and nozzle, thereby minimizing where vacuum exists within the system.
摘要翻译：本发明的特征在于一种产生真空的系统，用于拾取和保持组件放置机器中的部件，其中包括该系统的元件的布置防止异物流过系统。一个布置在文丘里管和喷嘴之间定位，从而最小化在系统内存在真空。

5. 发明授权

US5852869A Method and apparatus for supplying and placing components 失效
标题翻译：用于供应和放置部件的方法和装置
公开(公告)号：US5852869A
公开(公告)日：1998-12-29
申请号：US831007
申请日：1997-03-31
申请人： Koen A. Gieskes , Daniel Whitney Ackerman
发明人： Koen A. Gieskes , Daniel Whitney Ackerman
IPC分类号： B23P19/00 , H05K13/02 , H05K3/30
CPC分类号： H05K13/028 , Y10T29/49131 , Y10T29/49133 , Y10T29/53043 , Y10T29/53178 , Y10T29/53191
摘要： A method and apparatus for automatically supplying surface mount chip components from a bulk feeder and placing the chip components on a substrate. The apparatus includes a base frame, a substrate feeding mechanism, a placement head, and a placement head positioning system. The substrate feeding mechanism delivers substrates to a component receiving position on the base frame. The placement head is translationally movable with respect to the base frame and includes a component supplying and placing mechanism, to supply components and place components on a substrate in a desired location. The component supplying and placing mechanism includes a component transfer mechanism, a component feeder, and a vacuum spindle. The transfer mechanism includes a rotatable wheel with a plurality of component holding compartments, a plurality of angularly disposed stations, and a drive mechanism for sequentially moving the compartments to at least a component receiving station and a component delivery station. The feeder receives a plurality of components from a container and feeds the components in a desired orientation to the receiving station of the transfer mechanism. The vacuum spindle is disposed above the delivery station of the transfer mechanism, and is vertically movable with respect to the delivery station for controlling and placing a component at the delivery station onto the substrate.
摘要翻译：一种用于从批量进料器自动提供表面贴装芯片部件并将芯片部件放置在基板上的方法和装置。该装置包括基架，基板供给机构，放置头和放置头定位系统。基板供给机构将基板输送到基架上的部件接收位置。放置头可相对于底座平移移动并且包括元件供应和放置机构，以将元件供应到所需位置的基板上。部件供给和放置机构包括部件传送机构，部件供给部和真空轴。传送机构包括具有多个部件保持隔间的可旋转轮，多个角度设置的台，以及用于顺序地将隔间移动到至少部件接收站和部件传送站的驱动机构。进料器从容器接收多个部件，并以期望的方向将部件供给到传送机构的接收站。真空主轴设置在传送机构的传送台上方，并且可相对于传送站垂直移动，用于控制和将传送站处的部件放置在基板上。

6. 发明授权

US5031818A Soldering machine operating with a protective gas and provided with automatically operating lock doors 失效
标题翻译：焊机采用保护气体操作，并配有自动操作的锁门
公开(公告)号：US5031818A
公开(公告)日：1991-07-16
申请号：US541798
申请日：1990-06-21
申请人： Koen A. Gieskes
发明人： Koen A. Gieskes
IPC分类号： B23K1/008 , C23C2/00 , F27D1/18
CPC分类号： B23K1/008 , F27D1/1858
摘要： The present invention relates to a soldering machine, comprising: a soldering chamber wherein the soldering process is performed; a first lock chamber connecting to the soldering chamber; a second lock chamber connecting to the soldering chamber; two openings each arranged between a lock chamber and the soldering chamber; two openings each connecting a lock chamber to the outside wherein each opening is closable by a door; means for creating a vacuum in the lock chambers; means for transporting objects for soldering from the outside through the first lock chamber, the soldering chamber and the second lock chamber.
摘要翻译：焊接机技术领域本发明涉及一种焊接机，包括：焊接室，其中执行焊接工艺; 连接到焊接室的第一锁定室; 连接到焊接室的第二锁定室; 两个开口各自布置在锁定室和焊接室之间; 两个开口各自将锁定室连接到外部，其中每个开口可由门关闭; 用于在锁室中产生真空的装置; 用于通过第一锁定室，焊接室和第二锁定室从外部输送用于焊接的物体的装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式