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    • 2. 发明授权
    • Resistance change element and semiconductor device including the same
    • 电阻变化元件和包括其的半导体器件
    • US08362456B2
    • 2013-01-29
    • US12595662
    • 2008-03-21
    • Kimihiko ItoHiroshi SunamuraYuko Yabe
    • Kimihiko ItoHiroshi SunamuraYuko Yabe
    • H01L47/00
    • H01L27/101H01L27/2436H01L45/04H01L45/1233H01L45/146H01L45/1625
    • To use a resistance change element having an MIM structure, which is obtained by stacking a metal, a metal oxide, and a metal, as a switching element, it is necessary to achieve OFF resistance higher than that required in a memory element by a factor of at least 1000. On the other hand, when a resistance change element is used as a memory element and when the difference between the ON resistance and the OFF resistance is a large value, high performance, for example, a short readout time, can be achieved. The present invention therefore provides a resistance change element capable of maintaining low ON resistance and achieving high OFF resistance. High OFF resistance can be achieved while low ON resistance is maintained by adding a second metal that is not contained in a metal oxide, which is a resistance change material, the second metal being capable of charge-compensating for metal deficiency or oxygen deficiency.
    • 为了使用通过堆叠金属,金属氧化物和金属作为开关元件获得的具有MIM结构的电阻变化元件,需要通过一个因子实现比存储元件中要求的OFF电阻高的OFF电阻 至少为1000.另一方面,当使用电阻变化元件作为存储元件时,并且当导通电阻和截止电阻之间的差值大时,高性能(例如,短的读出时间)可以 实现。 因此,本发明提供能够保持低导通电阻并实现高关断电阻的电阻变化元件。 通过添加作为电阻变化材料的金属氧化物中不含有的第二金属,能够进行电荷补偿金属缺乏或氧缺乏的第二金属,可以保持低导通电阻。
    • 4. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20100078615A1
    • 2010-04-01
    • US12527681
    • 2008-02-18
    • Kimihiko Ito
    • Kimihiko Ito
    • H01L45/00H01L21/02H01L49/00
    • H01L27/101G11C13/0007H01L27/2436H01L45/04H01L45/122H01L45/1226H01L45/1233H01L45/1246H01L45/146H01L45/1658
    • A semiconductor memory device includes a variable resistance element including a first electrode, a current path forming region, and a second electrode. The current path forming region includes a first region made of a variable resistance material whose resistivity changes by applying voltage, and a second region formed by doping a metal element to the variable resistance material such that a resistivity of the second region is higher than that of the first region and is not changed by applying a voltage used to change the resistivity of the first region. The first region is in contact with the first electrode and the second electrode, and extends from one electrode side to the other electrode side. The second region is provided outside the first region in at least part of the current path forming region in direction extending from one electrode side to the other electrode side.
    • 半导体存储器件包括可变电阻元件,其包括第一电极,电流路径形成区域和第二电极。 电流路径形成区域包括由可变电阻材料制成的第一区域,其电阻率通过施加电压而变化;以及第二区域,其通过将金属元素掺杂到可变电阻材料而形成,使得第二区域的电阻率高于 第一区域并且不通过施加用于改变第一区域的电阻率的电压而改变。 第一区域与第一电极和第二电极接触,并且从一个电极侧延伸到另一个电极侧。 在从一个电极侧延伸到另一个电极侧的方向上,在电流路径形成区域的至少一部分中,将第二区域设置在第一区域的外侧。
    • 7. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08946668B2
    • 2015-02-03
    • US13574405
    • 2011-01-21
    • Yukishige SaitoKimihiko ItoHiromitsu Hada
    • Yukishige SaitoKimihiko ItoHiromitsu Hada
    • H01L29/02H01L47/00H01L23/522H01L45/00
    • H01L23/5228H01L45/04H01L45/1233H01L45/145H01L45/1675H01L2924/0002H01L2924/00
    • Disclosed is a semiconductor device including a resistive change element between a first wiring and a second wiring, which are arranged in a vertical direction so as to be adjacent to each other, with an interlayer insulation film being interposed on a semiconductor substrate. The resistive change element includes a lower electrode, a resistive change element film made of a metal oxide and an upper electrode. Since the upper electrode on the resistive change element film is formed as part of a plug for the second wiring, a structure in which a side surface of the upper electrode is not in direct contact with the side surface of the metal oxide or the lower electrode is provided so that it is possible to realize excellent device characteristics, even when a byproduct is adhered to the side wall of the metal oxide or the lower electrode in the etching thereof.
    • 公开了一种半导体器件,其包括在第一布线和第二布线之间的电阻变化元件,它们在垂直方向上彼此相邻地布置,层间绝缘膜插入在半导体衬底上。 电阻变化元件包括下电极,由金属氧化物和上电极制成的电阻变化元件膜。 由于电阻变化元件膜上的上电极被形成为用于第二布线的插头的一部分,所以上电极的侧表面不与金属氧化物或下电极的侧表面直接接触的结构 即使在其蚀刻中副产物附着在金属氧化物或下电极的侧壁上时,也可以实现优异的器件特性。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20120286231A1
    • 2012-11-15
    • US13574405
    • 2011-01-21
    • Yukishige SaitoKimihiko ItoHiromitsu Hada
    • Yukishige SaitoKimihiko ItoHiromitsu Hada
    • H01L45/00H01L21/02
    • H01L23/5228H01L45/04H01L45/1233H01L45/145H01L45/1675H01L2924/0002H01L2924/00
    • Disclosed is a semiconductor device including a resistive change element between a first wiring and a second wiring, which are arranged in a vertical direction so as to be adjacent to each other, with an interlayer insulation film being interposed on a semiconductor substrate. The resistive change element includes a lower electrode, a resistive change element film made of a metal oxide and an upper electrode. Since the upper electrode on the resistive change element film is formed as part of a plug for the second wiring, a structure in which a side surface of the upper electrode is not in direct contact with the side surface of the metal oxide or the lower electrode is provided so that it is possible to realize excellent device characteristics, even when a byproduct is adhered to the side wall of the metal oxide or the lower electrode in the etching thereof.
    • 公开了一种半导体器件,其包括在第一布线和第二布线之间的电阻变化元件,它们在垂直方向上彼此相邻地布置,层间绝缘膜插入在半导体衬底上。 电阻变化元件包括下电极,由金属氧化物和上电极制成的电阻变化元件膜。 由于电阻变化元件膜上的上电极被形成为用于第二布线的插头的一部分,所以上电极的侧表面不与金属氧化物或下电极的侧表面直接接触的结构 即使在其蚀刻中副产物附着在金属氧化物或下电极的侧壁上时,也可以实现优异的器件特性。
    • 9. 发明申请
    • RESISTANCE CHANGE ELEMENT AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
    • 电阻变化元件和半导体器件包括它们
    • US20100059730A1
    • 2010-03-11
    • US12595662
    • 2008-03-21
    • Kimihiko ItoHiroshi SunamuraYuko Yabe
    • Kimihiko ItoHiroshi SunamuraYuko Yabe
    • H01L47/00
    • H01L27/101H01L27/2436H01L45/04H01L45/1233H01L45/146H01L45/1625
    • To use a resistance change element having an MIM structure, which is obtained by stacking a metal, a metal oxide, and a metal, as a switching element, it is necessary to achieve OFF resistance higher than that required in a memory element by a factor of at least 1000. On the other hand, when a resistance change element is used as a memory element and when the difference between the ON resistance and the OFF resistance is a large value, high performance, for example, a short readout time, can be achieved. The present invention therefore provides a resistance change element capable of maintaining low ON resistance and achieving high OFF resistance. High OFF resistance can be achieved while low ON resistance is maintained by adding a second metal that is not contained in a metal oxide, which is a resistance change material, the second metal being capable of charge-compensating for metal deficiency or oxygen deficiency.
    • 为了使用通过堆叠金属,金属氧化物和金属作为开关元件获得的具有MIM结构的电阻变化元件,需要通过一个因子实现比存储元件中要求的OFF电阻高的OFF电阻 至少为1000.另一方面,当使用电阻变化元件作为存储元件时,并且当导通电阻和截止电阻之间的差值大时,高性能(例如,短的读出时间)可以 实现。 因此,本发明提供能够保持低导通电阻并实现高关断电阻的电阻变化元件。 通过添加作为电阻变化材料的金属氧化物中不含有的第二金属,第二金属能够进行电荷补偿金属缺乏或缺氧,可以保持低导通电阻。