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1. 发明授权

US08866056B2 Multi-component packaging system and apparatus 有权
标题翻译：多部件包装系统和装置
公开(公告)号：US08866056B2
公开(公告)日：2014-10-21
申请号：US12040641
申请日：2008-02-29
申请人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Katie M. Bartholomew , Lynda A. Deakin , Todd T. S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S. K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang
发明人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Katie M. Bartholomew , Lynda A. Deakin , Todd T. S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S. K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang
IPC分类号： H05B6/80 , B65D81/34 , B65D6/02 , B65D51/16 , B65D43/02 , B65D81/32 , B65D1/36 , B65D1/34
CPC分类号： B65D81/3205 , B65D1/34 , B65D1/36 , B65D43/0212 , B65D81/3453 , B65D2205/02 , B65D2231/025 , B65D2543/00046 , B65D2543/00074 , B65D2543/00296 , B65D2543/0037 , B65D2543/00537 , B65D2543/00611 , B65D2543/00685 , B65D2543/00731 , B65D2543/00796 , B65D2565/388
摘要： A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures.
摘要翻译：多部件包装系统包括下部容纳组件，上部容纳组件和盖子。下容纳组件限定适于接纳第一食物部件的内部空腔。上容纳组件限定适于接收第二食物部件的内部。上容纳组件适于与下容纳组件接合。盖与至少一个下部容纳组件和上部容纳组件接合。盖包括限定多个孔的通道部分。

2. 发明申请

US20100015293A1 MULTI-COMPONENT PACKAGING SYSTEM AND APPARATUS 审中-公开
标题翻译：多组分包装系统和装置
公开(公告)号：US20100015293A1
公开(公告)日：2010-01-21
申请号：US12471114
申请日：2009-05-22
申请人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Catherine M. Bartholomew , Lynda A. Deakin , Todd T.S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S.K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang , Prem S. Singh
发明人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Catherine M. Bartholomew , Lynda A. Deakin , Todd T.S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S.K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang , Prem S. Singh
IPC分类号： B65D81/34 , A23D9/00 , B65D21/02 , B65D85/30 , B65D85/72
CPC分类号： B65D81/3205 , A23V2002/00 , B65D1/34 , B65D1/36 , B65D1/40 , B65D21/0219 , B65D43/0212 , B65D51/20 , B65D77/245 , B65D81/3216 , B65D81/3453 , B65D81/3846 , B65D2203/00 , B65D2203/02 , B65D2205/02 , B65D2231/025 , B65D2543/00046 , B65D2543/00074 , B65D2543/00083 , B65D2543/00296 , B65D2543/0037 , B65D2543/00407 , B65D2543/00537 , B65D2543/00611 , B65D2543/00648 , B65D2543/00685 , B65D2543/00731 , B65D2543/0074 , B65D2543/00796 , B65D2543/00842 , B65D2565/388 , B65D2581/3466 , B65D2581/3472 , B65D2581/3478 , B65D2581/3479 , B65D2581/3494 , A23V2200/204
摘要： A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures. Anti-foam compositions for use in the multi-component packaging system and a multi-component packaging system containing the anti-foam compositions disposed on one or more interior surfaces of the packaging system are also disclosed.
摘要翻译：多部件包装系统包括下部容纳组件，上部容纳组件和盖子。下容纳组件限定适于接纳第一食物部件的内部空腔。上容纳组件限定适于接收第二食物部件的内部。上容纳组件适于与下容纳组件接合。盖与至少一个下部容纳组件和上部容纳组件接合。盖包括限定多个孔的通道部分。还公开了用于多组分包装系统的防沫组合物和包含设置在包装系统的一个或多个内表面上的防沫组合物的多组分包装系统。

3. 发明申请

US20080210686A1 Multi-Component Packaging System and Apparatus 有权
标题翻译：多部件包装系统和装置
公开(公告)号：US20080210686A1
公开(公告)日：2008-09-04
申请号：US12040641
申请日：2008-02-29
申请人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Katie M. Bartholomew , Lynda A. Deakin , Todd T.S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S.K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang
发明人： Catherine M. Shapiro , Corey L. Berends , Brian M. Degner , Jess C. Sweley , Stephanie L. Bills , Christopher M. Branda , Kim M. Folta , Robert Kim , Sue Lai , Pamela A. Poulis , Jesse Jay Spungin , Katie M. Bartholomew , Lynda A. Deakin , Todd T.S. Holscher , Grace J. Hwang , Mark M. Kavanagh , Michelle S.K. Lee , Adam M. Mack , Eleanor D. Morgan , John W. Smith , David C. Thomsen , Gabriel M. Trionfi , Ana T. Yuan Chang
IPC分类号： H05B6/80 , B65D6/02 , B65D21/02 , B65D6/04 , B65D51/16
CPC分类号： B65D81/3205 , B65D1/34 , B65D1/36 , B65D43/0212 , B65D81/3453 , B65D2205/02 , B65D2231/025 , B65D2543/00046 , B65D2543/00074 , B65D2543/00296 , B65D2543/0037 , B65D2543/00537 , B65D2543/00611 , B65D2543/00685 , B65D2543/00731 , B65D2543/00796 , B65D2565/388
摘要： A multi-component packaging system includes a lower containing assembly, an upper containing assembly, and a cover. The lower containing assembly defines an interior cavity that is adapted to receive a first food component. The upper containing assembly defines an interior that is adapted to receive a second food component. The upper containing assembly is adapted for engagement with the lower containing assembly. The cover is engaged with at least one of the lower containing assembly and the upper containing assembly. The cover includes a passage portion that defines a plurality of apertures.
摘要翻译：多部件包装系统包括下部容纳组件，上部容纳组件和盖子。下容纳组件限定适于接纳第一食物部件的内部空腔。上容纳组件限定适于接收第二食物部件的内部。上容纳组件适于与下容纳组件接合。盖与至少一个下部容纳组件和上部容纳组件接合。盖包括限定多个孔的通道部分。

4. 发明授权

US06491959B1 Production of crispy corn-based snacks having surface bubbles 有权
标题翻译：生产具有表面气泡的酥脆玉米基小吃
公开(公告)号：US06491959B1
公开(公告)日：2002-12-10
申请号：US09723377
申请日：2000-11-28
申请人： Bin-Yea Chiang , Lynn C. Haynes , Ronald J. Russell , Marta H. Gomez , Kim M. Folta , Anita Bryant-Ray , Christina M. Fileti , Julia M. Carey
发明人： Bin-Yea Chiang , Lynn C. Haynes , Ronald J. Russell , Marta H. Gomez , Kim M. Folta , Anita Bryant-Ray , Christina M. Fileti , Julia M. Carey
IPC分类号： A21D1300
CPC分类号： A23L7/117 , A21D13/42 , Y10S426/808
摘要： Baked, corn-based, chip-like snacks having a plurality of surface bubbles comprising air pockets extending both above and below the substantially unleavened, adjacent portions of the snack are obtained with a pregelatinized waxy starch, a pregelatinized corn flour and baker's bran. The pregelatinized waxy starch forms the skin of the bubble. The pregelatinized corn flour aids in production of bubbles during baking and enhances corn flavor in the baked snacks. The baker's bran provides the baked corn-based chip-like snack with a rough appearance characteristic of tortilla chips. The pregelatinized waxy maize starch may be used in an amount of from about 5% by weight to about 25% by weight, the pregelatinized corn flour may be used in an amount of from about 5% by weight to about 20% by weight, and the baker's bran may be used in an amount of from about 0.1% by weight to about 10% by weight each based upon the weight of a corn flour having a degree of gelatinization of less than about 60%. Reduced fat, low-fat, and no-fat baked products, as well as full-fatted baked products, may be produced with a bubbled surface, and a crispy, crunchy, non-mealy, chip-like texture, but with a corn tortilla flavor.
摘要翻译：通过预胶凝的蜡质淀粉，预胶化的玉米粉和面包的麸皮获得具有多个表面气泡的基于玉米的切片状小吃，其包括在小吃的基本上未发酵的相邻部分的上方和下方延伸的气囊。预胶化的蜡状淀粉形成气泡的皮肤。预胶化的玉米粉在烘烤过程中有助于生产气泡，并提高烘焙小吃中的玉米味。面包师的麸皮提供烤玉米片状的零食，具有玉米饼芯片的粗糙外观特征。预胶化蜡质玉米淀粉的用量可以为约5重量％至约25重量％，预胶化玉米粉的用量可以为约5重量％至约20重量％，和面包师的麸皮可以以基于糊化度小于约60％的玉米粉的重量计约0.1重量％至约10重量％的量使用。可以生产具有起泡表面的酥脂，低脂肪和无脂肪焙烤产品以及全脂肪焙烤产品，并且具有酥脆，松脆，非粉碎的片状纹理，但是具有玉米玉米饼风味。

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