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1. 发明授权

US06423812B1 Process of preparing polycarbonates 有权
标题翻译：制备聚碳酸酯的方法
公开(公告)号：US06423812B1
公开(公告)日：2002-07-23
申请号：US09901727
申请日：2001-07-11
申请人： Young Chan Ko , Il Seok Choi , Cheol-Hyun Kim , Kwang Soo Yoon , Seung-Joo Kim , Kil-Yeong Choi , Jae Heung Lee , Kyong Soon Lee
发明人： Young Chan Ko , Il Seok Choi , Cheol-Hyun Kim , Kwang Soo Yoon , Seung-Joo Kim , Kil-Yeong Choi , Jae Heung Lee , Kyong Soon Lee
IPC分类号： C08G6400
CPC分类号： C08G64/307
摘要： The present invention relates to a process of preparing polycarbonates and more particularly, to the process of preparing polycarbonates through a melt polymerization reaction of dihydroxyaryl compounds with diarylcarbonate, wherein said melt polymerization is performed in the presence of a mixed catalyst composed of an oxygen (O) or sulfur (S) containing compound having lone-pair electrons and an alkali metal or alkaline earth metal salt in an appropriate ratio at a reduced temperature by accelerating a reaction rate to obtain high quality polycarbonates with higher than 15,000 g/mole of a viscosity average molecular weight and improved color.
摘要翻译：本发明涉及一种制备聚碳酸酯的方法，更具体地说，涉及通过二羟基芳基化合物与碳酸二芳基酯的熔融聚合反应制备聚碳酸酯的方法，其中所述熔融聚合在由氧（O ）或含硫（S）的化合物，具有单对电子的碱金属或碱土金属盐，碱金属或碱土金属盐在降低的温度下通过加速反应速率以适当的比例获得高质量的聚碳酸酯，其粘度高于15,000g / 平均分子量和颜色改善。

2. 发明授权

US6018055A Polyarylether containing N-substituted imide groups and process for producing the same 失效
标题翻译：含有N-取代的酰亚胺基团的聚芳醚基及其制备方法
公开(公告)号：US6018055A
公开(公告)日：2000-01-25
申请号：US892707
申请日：1997-07-15
申请人： Kil-Yeong Choi , Dong-Hack Suh , Young-Taik Hong , Eun-Young Chung
发明人： Kil-Yeong Choi , Dong-Hack Suh , Young-Taik Hong , Eun-Young Chung
IPC分类号： C07D487/04 , C08G65/40 , C08G73/06 , C07D487/02
CPC分类号： C07D487/04 , C08G73/0672
摘要： A polyarylether of the formula (VIII) ##STR1## wherein wherein Z' is 1-3 optionally substituted rings selected from the group consisting of an aromatic ring, a hetero aromatic ring or an aliphatic ring.A is --R.sub.1 --Z--Y in which R.sub.1 is H, C.sub.1 -C.sub.30 -alkyl or -aralkyl or phenyl, Z is a direct bond or CH.sub.2, S, O or NH, Y is CH.sub.3, OR.sub.3, SR.sub.3, NHR.sub.3, N(R.sub.3).sub.2, COOR.sub.3, COOM, SO.sub.3 R.sub.3 or SO.sub.3 M in which R.sub.3 is C.sub.1 -C.sub.30 alkyl and M is alkali metal,produced from 3,6-dihalogen- or -dintro-1,2,4,5-diimide having an N,N-substituent and which is suitable for use as a monomer for high temperature structural and functional polymers, and a process for producing the same are disclosed.
摘要翻译：式（VIII）的聚芳醚，其中Z'为1-3个选自芳香环，杂芳环或脂族环的任选取代的环。 A是-R1-ZY，其中R1是H，C1-C30 - 烷基或 - 烷基或苯基，Z是直接键或CH2，S，O或NH，Y是CH3，OR3，SR3，NHR3，N ）2，CO 3，COOM，SO 3 R 3或SO 3 M，其中R 3为C 1 -C 30烷基且M为碱金属，由具有N，N的3,6-二卤代 - 或二苯并1,2,4,5-二酰亚胺并且其适合用作高温结构和功能性聚合物的单体，并且公开了其制备方法。

3. 发明授权

US6013760A Soluble polyimide resin for liquid crystal alignment layer and process of preparation of the same 失效
标题翻译：用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法
公开(公告)号：US6013760A
公开(公告)日：2000-01-11
申请号：US86385
申请日：1998-05-29
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Dae-Woo Ihm , Jae-Min Oh
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Dae-Woo Ihm , Jae-Min Oh
IPC分类号： C08G73/10 , G02F1/1337 , C08G69/28
CPC分类号： C08G73/10 , G02F1/133723 , Y10T428/31721
摘要： The invention herein relates to a soluble polyimide resin for a liquid crystal alignment layer and the process of preparation of the same, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having the amide group are used to yield a novel form of a polyimide resin having superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance, solubility, liquid crystal alignment property, and high pretilt angle, which is prepared by means of jointly using the aromatic diamine, used for the preparation of the conventional polyimide resin, and the aromatic diamine having a long alkyl chain with a substituted amide group, and reacting the same with various types of carboxylic dianhydride.
摘要翻译：本发明涉及用于液晶取向层的可溶性聚酰亚胺树脂及其制备方法，其中使用具有酰胺基的脂族四羧酸二酐和芳族二胺以产生具有优异的耐热性的聚酰亚胺树脂的新型，电阻，溶解度，透明度和液晶取向能力。更具体地说，本发明涉及一种新型的聚酰亚胺树脂，其具有优异的耐热性，溶解性，液晶取向性和高预倾角，这是通过共同使用芳族二胺制备的，用于制备常规聚酰亚胺树脂和具有取代酰胺基的长烷基链的芳族二胺，并使其与各种羧酸二酐反应。

4. 发明授权

US5955568A Process for preparing polyamideimide resins by direct polymerization 失效
标题翻译：通过直接聚合制备聚酰胺酰亚胺树脂的方法
公开(公告)号：US5955568A
公开(公告)日：1999-09-21
申请号：US956923
申请日：1997-10-23
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Moon-Young Jin
IPC分类号： C08G73/14 , C08G69/28
CPC分类号： C08G73/14
摘要： The disclosure describes a process for preparing a polyamideimide resin having high molecular weight in a simple manner wherein major problems of the prior processes such as low heat resistance and low melt flowability are improved. The process comprises condensation of an aromatic tricarboxylic acid anhydride and an aromatic diamine in a polar solvent, subjecting the resulting diimidedicarboxylic acid to acyl halogenating agent treatment to give an intermediate having good reactivity at low temperature, and then subjecting the latter to direct polymerization by using diamine as a nucleophilic agent to give a polyamideimide resin having high molecular weight. The polyamideimide resin prepared by the present invention can be used as major heat resistant structural material in advanced industries and as paint, sheet, adhesives, sliding material, fiber and film having heat resistance.
摘要翻译：本公开内容描述了以简单的方式制备具有高分子量的聚酰胺酰亚胺树脂的方法，其中诸如低耐热性和低熔融流动性的现有方法的主要问题得到改善。该方法包括在极性溶剂中将芳族三羧酸酐和芳族二胺缩合，将所得二酰亚胺二羧酸进行酰卤处理，得到在低温下具有良好反应性的中间体，然后使用后者通过使用二胺作为亲核剂，得到具有高分子量的聚酰胺酰亚胺树脂。本发明制备的聚酰胺酰亚胺树脂可用作先进工业中的主要耐热结构材料，可用作具有耐热性的油漆，片材，粘合剂，滑动材料，纤维和薄膜。

5. 发明授权

US5532334A Process for preparing polyamideimide resins having high molecular weight 失效
标题翻译：制备高分子量聚酰胺酰亚胺树脂的方法
公开(公告)号：US5532334A
公开(公告)日：1996-07-02
申请号：US339391
申请日：1994-11-14
申请人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
发明人： Kil-Yeong Choi , Dong-Hack Suh , Mi-Hie Yi , Young-Taik Hong , Jong-Chan Won
IPC分类号： C08G73/14 , H01B3/30 , C08G69/26
CPC分类号： C08G73/14 , H01B3/303
摘要： A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.3 P wherein R is an aliphatic or aromatic substituent, or a compound which is phosphoric acid, pyrophosphoric acid, phosphorous pentaoxide or phosphorous pentachloride as a second catalyst at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours.
摘要翻译：制备如上所述的具有高分子量的聚酰胺酰亚胺树脂的方法，其中提高了诸如低耐热性和低熔融流动性的现有技术方法的主要问题。通过在30℃下以0.5g / dl的浓度作为溶剂的二甲基乙酰胺溶液测定的特性粘度为0.4至1.50dl / g的聚酰胺酰亚胺树脂通过芳族三羧酸酐与芳族二胺在N-甲基吡咯烷酮溶剂中，在50℃至130℃的温度下，在选自亚硫酰氯，对甲苯磺酰氯，磺酰氯，氰尿酰氯和三氯化磷的第一催化剂存在下，在时间为1至5小时，并且在第二催化剂存在下进一步反应，所述第二催化剂是式（RO）3P的化合物，其中R是脂族或芳族取代基，或者是磷酸化合物，焦磷酸，五氧化二磷或五氯化磷作为第二催化剂，温度为50〜130℃，时间为1〜5小时。

6. 发明授权

US5457163A Phosphonic acid chelating resins for uranyl ion adsorption 失效
标题翻译：用于铀酰离子吸附的膦酸螯合树脂
公开(公告)号：US5457163A
公开(公告)日：1995-10-10
申请号：US160128
申请日：1993-11-30
申请人： In Hwan Park , Kil-Yeong Choi , Jin-Chul Jung , Jae-Oh Joo
发明人： In Hwan Park , Kil-Yeong Choi , Jin-Chul Jung , Jae-Oh Joo
IPC分类号： C08F8/12 , C08F8/42 , C08F30/02
CPC分类号： C08F8/42 , C08F2810/20
摘要： This invention relates to a process of manufacturing phosphoric acid-type chelate resins as uranyl ion adsorbents having enhanced chelation and re-utilizing ability by introducing plenty of phosphoric acid groups both on main- and side-chain of the copolymer skeleton. The resin is prepared by both the radical suspension copolymerization of vinyl monomers such as styrene, divinylbenzene, and bis-(2-chloroethyl) vinylphosphonate and the additional introduction of phosphono group onto the copolymer.
摘要翻译：本发明涉及通过在共聚物骨架的主链和侧链上引入大量的磷酸基来制备磷酸型螯合树脂作为铀离子吸附剂的方法，其具有增强的螯合和再利用能力。树脂通过乙烯基单体如苯乙烯，二乙烯基苯和双 - （2-氯乙基）乙烯基膦酸酯的自由基悬浮共聚和在共聚物上另外引入膦酰基来制备。

7. 发明授权

US5243010A Aromatic polyamide containing pendant silyl groups 失效
标题翻译：芳香族聚酰胺含有助剂SILYL组合物
公开(公告)号：US5243010A
公开(公告)日：1993-09-07
申请号：US852075
申请日：1992-03-13
申请人： Kil-Yeong Choi , Mi Hie Yi
发明人： Kil-Yeong Choi , Mi Hie Yi
IPC分类号： C08G69/32 , C08G69/42
CPC分类号： C08G69/42 , C08G69/32
摘要： This invention relates to the aromatic polyamide resin of the following general formula(I) having pendant silyl groups characterized in that the said polyamide resin has excellent solubility for the films to be easily prepared by solvent casting as well as useful as coating materials, can be used at higher temperature than the reported polyamides because of the excellent heat stability, and also has excellent adhesive strength in the blend with glass fiber. ##STR1##
摘要翻译：本发明涉及具有侧壁甲硅烷基的以下通式（I）的芳族聚酰胺树脂，其特征在于所述聚酰胺树脂对通过溶剂浇铸容易制备的膜具有优异的溶解性，并且可用作涂料，可以是由于具有优异的热稳定性，因此在比报道的聚酰胺更高的温度下使用，并且在与玻璃纤维的共混物中也具有优异的粘合强度。（一）

8. 发明申请

US20110239748A1 QUANTITATIVE EVALUATION OF SCRATCH-INDUCED DAMAGES ON POLYMERIC AND COATING MATERIALS 有权
标题翻译：对聚合物和涂料材料的切割诱导性损伤的定量评估
公开(公告)号：US20110239748A1
公开(公告)日：2011-10-06
申请号：US12845388
申请日：2010-07-28
申请人： Jong Il WEON , Si Yong SONG , Jong Bae LEE , Kil Yeong CHOI , Sung Goo LEE , Jae Heung LEE
发明人： Jong Il WEON , Si Yong SONG , Jong Bae LEE , Kil Yeong CHOI , Sung Goo LEE , Jae Heung LEE
IPC分类号： G01N3/48
CPC分类号： G01N3/46
摘要： Provided is a method for quantitative evaluation of mar- and scratch-induced surface damage on polymeric and coating materials. The method for quantitative evaluation of scratch-induced damage on polymeric and coating materials includes: preparing a test specimen of polymeric and coating materials; inducing a scratch damage on the surface of the test specimen; representing the scratch damage formed on the test specimen as corresponding color coordinates; and calculating a quantitated scratch damage index from a combination of a load applied to the surface of the test specimen and the color coordinates corresponding to the scratch damage.
摘要翻译：提供了一种用于定量评估聚合物和涂层材料上的划痕和划痕表面损伤的方法。用于定量评估聚合物和涂层材料上的划痕损伤的方法包括：制备聚合物和涂层材料的试样; 在试样的表面引起划痕损伤; 代表在试样上形成的划痕损伤作为相应的颜色坐标; 以及从施加到测试样本表面的负载和对应于划痕损伤的颜色坐标的组合计算定量的划痕损伤指数。

9. 发明授权

US06162893A Soluble polyimide resin having a dialkyl substituent for a liquid crystal alignment layer, the monomers and manufacturing methods thereof 失效
标题翻译：具有用于液晶取向层的二烷基取代基的可溶性聚酰亚胺树脂，其单体及其制造方法
公开(公告)号：US06162893A
公开(公告)日：2000-12-19
申请号：US138377
申请日：1998-08-24
申请人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jae-Geun Park , Dae-Woo Ihm
发明人： Kil-Yeong Choi , Mi-Hie Yi , Moon-Young Jin , Jin-Tae Jung , Jae-Geun Park , Dae-Woo Ihm
IPC分类号： C08G73/10 , G02F1/1337 , A61K38/17
CPC分类号： C08G73/1078 , C08G73/1039 , C08G73/1067 , C08G73/1071 , G02F1/133723
摘要： The invention herein relates to a soluble polyimide resin having a dialkyl substituent for a liquid alignment layer, wherein aliphatic tetracarboxylic dianhydride and aromatic diamine having a dialkyl substituent are used to yield said soluble polyimide resin which has superior heat-resistance, solubility, transparency, and liquid crystal alignment capacity. According to the present invention, the soluble polyimide polymer having a dialkyl substituent, for a liquid crystal alignment layer, comprising the following a repetitive unit of formula 1: ##STR1## Consequently, the polyimide resin under the present invention not only has superior heat-resistance but also excellent solubility and transparency, which could be applicable as a liquid crystal alignment layer for the TFT-LCD requiring a low temperature processing. Further, the invention has the effects of providing a polyimide resin with superior physical property for heat-resistance structural material, and the monomer therein, in addition to the manufacturing methods thereof.
摘要翻译：本发明涉及具有用于液体取向层的二烷基取代基的可溶性聚酰亚胺树脂，其中使用具有二烷基取代基的脂族四羧酸二酐和芳族二胺，得到所述可溶性聚酰亚胺树脂，其具有优异的耐热性，溶解性，透明性和液晶对准能力。根据本发明，用于液晶取向层的具有二烷基取代基的可溶性聚酰亚胺聚合物包含以下式1的重复单元：因此，本发明的聚酰亚胺树脂不仅具有优异的耐热性，而且优异的溶解性和透明性，其可以用作需要低温加工的TFT-LCD的液晶取向层。此外，除了其制造方法之外，本发明还具有提供对耐热结构材料及其单体具有优异物理性质的聚酰亚胺树脂的效果。

10. 发明授权

US5241037A Nadimide-terminated polyarylates and cured polyarylate resins 失效
标题翻译： NADIM封端的多元醇酯和固化的聚氨酯树脂
公开(公告)号：US5241037A
公开(公告)日：1993-08-31
申请号：US909319
申请日：1992-07-06
申请人： Kil-Yeong Choi , Mi-Hie Yi , Sam-Kwon Choi
发明人： Kil-Yeong Choi , Mi-Hie Yi , Sam-Kwon Choi
IPC分类号： C08F299/04 , C08F290/00 , C08G63/19 , C08G63/195 , C08G63/20 , C08G63/52 , C08G63/685 , C08G63/88 , C08G63/91
CPC分类号： C08G63/88 , C08G63/20 , C08G63/6856
摘要： Nadimide-terminated polyarylate prepolymers having the formula (I) ##STR1## wherein n is an integer not less than 1, and cured polyarylate resins produced by thermal curing the prepolymers, and processes for producing them are disclosed.The cured polyarylate resins according to the present invention have excellent chemical resistance and high-temperature resistance as well as good mechanical properties and processability.
摘要翻译：公开了具有式（I）的N-酰亚胺封端的多芳基化合物预聚物，其中n是不小于1的整数，并且通过热固化预聚物制备的固化的聚芳酯树脂及其制备方法。根据本发明的固化的聚芳酯树脂具有优异的耐化学性和耐高温性以及良好的机械性能和加工性能。

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