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1. 发明申请

US20120261705A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：发光器件封装及其制造方法
公开(公告)号：US20120261705A1
公开(公告)日：2012-10-18
申请号：US13530880
申请日：2012-06-22
申请人： Geun Ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
发明人： Geun Ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L24/97 , H01L33/486 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/81 , H01L2224/0401
摘要： A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
摘要翻译：公开了能够发出均匀的白光的发光器件封装及其制造方法。发光器件封装包括封装主体，形成在封装主体的至少一个表面上的电极，安装在封装主体上的发光器件以及围绕发光器件的发光器件周围均匀的荧光体层发光装置。

2. 发明申请

US20100187556A1 Light Emitting Device Package And Method For Manufacturing The Same 有权
标题翻译：发光装置封装及其制造方法
公开(公告)号：US20100187556A1
公开(公告)日：2010-07-29
申请号：US12755822
申请日：2010-04-07
申请人： Geun ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
发明人： Geun ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L24/97 , H01L33/486 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/81 , H01L2224/0401
摘要： A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
摘要翻译：公开了能够发出均匀的白光的发光器件封装及其制造方法。发光器件封装包括封装主体，形成在封装主体的至少一个表面上的电极，安装在封装主体上的发光器件以及围绕发光器件的发光器件周围均匀的荧光体层发光装置。

3. 发明申请

US20080290820A1 LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF AND LIGHT EMITTING SYSTEM USING THE SAME 有权
标题翻译：发光装置及其制造方法及使用该发光装置的发光系统
公开(公告)号：US20080290820A1
公开(公告)日：2008-11-27
申请号：US12165282
申请日：2008-06-30
申请人： Geun-Ho Kim , Ki-Chang Song
发明人： Geun-Ho Kim , Ki-Chang Song
IPC分类号： G09G3/32 , H01L33/00
CPC分类号： H01L33/62 , H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/3011 , H01S5/02212 , H01S5/0224 , H01S5/02248 , H01S5/02272 , H01S5/06825 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.
摘要翻译：发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以有效地排放到外部。另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

4. 发明申请

US20050274959A1 High power LED package 审中-公开
标题翻译：大功率LED封装
公开(公告)号：US20050274959A1
公开(公告)日：2005-12-15
申请号：US11147468
申请日：2005-06-08
申请人： Geun-Ho Kim , Chil-Keun Park , Ki-Chang Song
发明人： Geun-Ho Kim , Chil-Keun Park , Ki-Chang Song
IPC分类号： H01L33/46 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L27/15
CPC分类号： H01L33/642 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/10253 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.
摘要翻译：公开了一种大功率LED封装，包括LED; 一个硅衬底，LED被倒装在芯片上; 反射膜，形成在硅基座上并电连接到LED以提高LED的发光效率; 连接到反射膜的电线将LED连接到外部电路; 形成在硅基座下方的绝缘体; 在绝缘体下形成的散热器; 形成在散热器上的绝缘基板; 以及形成在绝缘基板上并连接到电线的金属线。在LED封装中，由于具有与其结合的LED倒装芯片的硅基座直接连接到散热器，所以可以有效地辐射LED工作时产生的热量。此外，LED封装具有简单的结构，从而大大降低了制造成本。大功率LED可以应用于LCD或一般照明灯具的背光单元，以及用于键盘的常规PCS电话或LED封装的背光单元，因此增加了LED的光特性。特别地，LED封装具有两个或更多个具有与其结合的LED倒装芯片的基座的阵列，因此可以应用于用于LCD的背光单元的模块，从而显着降低制造成本。

5. 发明申请

US20050230692A1 Light emitting device and fabrication method thereof and light emitting system using the same 有权
标题翻译：发光元件及其制造方法以及使用其的发光系统
公开(公告)号：US20050230692A1
公开(公告)日：2005-10-20
申请号：US11106188
申请日：2005-04-13
申请人： Geun-Ho Kim , Ki-Chang Song
发明人： Geun-Ho Kim , Ki-Chang Song
IPC分类号： H01L25/16 , H01L33/62 , H01L33/64 , H01S5/02 , H01S5/022 , H01L27/15 , H01L21/00
CPC分类号： H01L33/62 , H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/3011 , H01S5/02212 , H01S5/0224 , H01S5/02248 , H01S5/02272 , H01S5/06825 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.
摘要翻译：发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以有效地排放到外部。另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

6. 发明申请

US20050145862A1 Light emitting device and manufacturing method thereof 审中-公开
标题翻译：发光元件及其制造方法
公开(公告)号：US20050145862A1
公开(公告)日：2005-07-07
申请号：US11023471
申请日：2004-12-29
申请人： Geun-Ho Kim , Ki-Chang Song
发明人： Geun-Ho Kim , Ki-Chang Song
IPC分类号： H01L33/12 , H01L33/14 , H01L33/42 , H01L33/00
CPC分类号： H01L33/24
摘要： Disclosed are a light emitting device and a manufacturing method thereof. A trench portion is formed on a substrate of a light emitting device, and a buffer layer, an n-contact layer, and an active layer are sequentially deposited on the trench portion thereby to increase a light emitting area of the active layer. According to this, a light emitting efficiency is increased, and light of a high brightness can be obtained with a substrate of the same size thereby to reduce a production cost.
摘要翻译：公开了一种发光器件及其制造方法。沟槽部分形成在发光器件的衬底上，缓冲层，n接触层和有源层依次沉积在沟槽部分上，从而增加有源层的发光面积。据此，发光效率提高，并且可以用相同尺寸的基板获得高亮度的光，从而降低制造成本。

7. 发明授权

US09166123B2 Light emitting device package and method for manufacturing the same 有权
标题翻译：发光器件封装及其制造方法
公开(公告)号：US09166123B2
公开(公告)日：2015-10-20
申请号：US12755822
申请日：2010-04-07
申请人： Geun ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
发明人： Geun ho Kim , Yu Ho Won , Chil Keun Park , Ki Chang Song
IPC分类号： H01L33/00 , H01L33/50 , H01L33/48 , H01L23/00
CPC分类号： H01L33/505 , H01L24/97 , H01L33/486 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/00 , H01L2224/81 , H01L2224/0401
摘要： A light emitting device package capable of emitting uniform white light and a method for manufacturing the same are disclosed. The light emitting device package includes a package body, an electrode formed on at least one surface of the package body, a light emitting device mounted on the package body, and a phosphor layer enclosing the light emitting device while having a uniform thickness around the light emitting device.
摘要翻译：公开了能够发出均匀的白光的发光器件封装及其制造方法。发光器件封装包括封装主体，形成在封装主体的至少一个表面上的电极，安装在封装主体上的发光器件以及围绕发光器件的发光器件周围均匀的荧光体层发光装置。

8. 发明授权

US07408203B2 Light emitting device and fabrication method thereof and light emitting system using the same 有权
标题翻译：发光元件及其制造方法以及使用其的发光系统
公开(公告)号：US07408203B2
公开(公告)日：2008-08-05
申请号：US11106188
申请日：2005-04-13
申请人： Geun-Ho Kim , Ki-Chang Song
发明人： Geun-Ho Kim , Ki-Chang Song
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4823 , H01L2224/73265 , H01L2924/10253 , H01L2924/12041 , H01L2924/3011 , H01S5/02212 , H01S5/0224 , H01S5/02248 , H01S5/02272 , H01S5/06825 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.
摘要翻译：发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以有效地排放到外部。另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

9. 发明授权

US5970114A X-ray mask and its fabrication method 失效
标题翻译： X射线掩模及其制造方法
公开(公告)号：US5970114A
公开(公告)日：1999-10-19
申请号：US919812
申请日：1997-08-29
申请人： Don-Hee Lee , Ki-Chang Song , Young-Sam Jeon , Chil-Keun Park
发明人： Don-Hee Lee , Ki-Chang Song , Young-Sam Jeon , Chil-Keun Park
IPC分类号： G03F1/22 , H01L21/027 , G21K5/00
CPC分类号： G03F1/22
摘要： Disclosed are X-ray masks exhibiting improved stability and reliability of the X-ray masks, and methods of making these masks. The X-ray masks include a membrane, an X-ray absorber pattern on the membrane, which is formed on a top side of a substrate, or an oxide layer between the membrane and the X-ray absorber pattern.
摘要翻译：公开了显示出提高X射线掩模的稳定性和可靠性的X射线掩模以及制造这些掩模的方法。 X射线掩模包括膜，膜上的X射线吸收体图案，其形成在衬底的顶侧，或膜与X射线吸收体图案之间的氧化物层。

10. 发明授权

US07411225B2 Light source apparatus 有权
标题翻译：光源装置
公开(公告)号：US07411225B2
公开(公告)日：2008-08-12
申请号：US11086186
申请日：2005-03-21
申请人： Geun-Ho Kim , Ki-Chang Song , Sun-Ho Kim
发明人： Geun-Ho Kim , Ki-Chang Song , Sun-Ho Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/64 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/12041 , H05K1/053 , H05K1/183 , H01L2224/0401
摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well as luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of the light source apparatus, reduce the process time and costs and increase reliability by directly connecting the sub-mount to the stem by the first electrode and the second electrode which pass through holes of the sub-mount, and extend a life span of the light emitting device because of the enhanced heat radiating effect.
摘要翻译：光源装置及其制造方法可以通过在副安装座中形成凹槽并将发光器件接合到凹槽中来防止彼此相邻的发光器件之间的光干涉，通过以下方式提高散热效果以及发光效率从发光装置侧发射的光朝向光源装置的前方收集，通过第一电极和第二电极直接连接到底座上，从而减少了处理时间和成本并提高了可靠性并且由于散热效果的提高，延长了发光装置的使用寿命。

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