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1. 发明授权

US4093971A D-I-P On island 失效
标题翻译： D-I-P岛上
公开(公告)号：US4093971A
公开(公告)日：1978-06-06
申请号：US748837
申请日：1976-12-10
申请人： Bing-Lun Chu , Wunnava Venkata Subbarao , Jack Peale , Kent McCune , Marvin Elroy Steiner
发明人： Bing-Lun Chu , Wunnava Venkata Subbarao , Jack Peale , Kent McCune , Marvin Elroy Steiner
IPC分类号： H01L23/40 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L23/4006 , H01L23/433 , H05K7/20445 , H01L2023/405 , H01L2023/4062 , H01L2924/0002 , H01L2924/3011
摘要： A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type, including a cold bar which engages the DIPs and is thermally and mechanically connected at both ends to a cooling frame in which a serpentine tubing carries coolant throughout spaced-apart sections thereof. Clamping means clamp the DIPs tight against the cold bar so that heat generated by the DIPs is carried away through the cold bar into the frame sections where the coolant circulates. The cold bar is disposed so that discrete components may be disposed on the island in a manner to save lateral space, and a multiplicity of these DIPs, cold bars, etc. are mounted on the cooling frame to form a DIP island cooling frame and may include, for example, driver buffer logic, random access memories, as well as I/O logic. Each DIP island can be connected to a cooling frame having other types of integrated circuits and housed in the same console or housed along with similar DIP islands in a similar console, as desired.
摘要翻译：一种用于常规双列直插式（DIP）型集成电路封装的冷却系统，包括接合DIP的冷棒，并在两端热连接和机械连接到一个冷却框架，其中蛇形管道将冷却剂沿间隔其部分。夹紧装置将DIP紧固在冷杆上，使得DIP产生的热量通过冷却杆被带走到冷却剂循环的框架部分。冷棒被设置成使得分立的部件可以以节省横向空间的方式设置在岛上，并且多个这些DIP，冷棒等安装在冷却框架上以形成DIP岛冷却框架，并且可以包括例如驱动器缓冲器逻辑，随机存取存储器以及I / O逻辑。每个DIP岛可以连接到具有其他类型的集成电路的冷却框架，并且根据需要容纳在相同的控制台中或与类似的控制台中的类似DIP岛一起容纳。

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