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1. 外观设计

USD506508S1 Correction tape holder 失效
标题翻译：校正胶带架
公开(公告)号：USD506508S1
公开(公告)日：2005-06-21
申请号：US29200056
申请日：2004-02-23
申请人： Kazuhisa Shimizu , Kenji Kita
设计人： Kazuhisa Shimizu , Kenji Kita

2. 发明授权

US07517724B2 Dicing/die bonding sheet 有权
标题翻译：切片/切片粘合片
公开(公告)号：US07517724B2
公开(公告)日：2009-04-14
申请号：US10556535
申请日：2005-03-15
申请人： Keiichi Hatakeyama , Michio Uruno , Takayuki Matsuzaki , Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
发明人： Keiichi Hatakeyama , Michio Uruno , Takayuki Matsuzaki , Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
IPC分类号： H01L21/00
CPC分类号： C09J163/10 , C08L63/00 , C08L2666/02 , C08L2666/22 , C09J7/35 , C09J133/068 , C09J161/06 , C09J161/28 , C09J175/14 , C09J2201/36 , C09J2201/606 , C09J2203/326 , C09J2461/00 , C09J2463/00 , C09J2475/00 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/73265 , H01L2224/83191
摘要： The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).
摘要翻译：本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的作为芯片接合材料的粘合性。一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）：由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

3. 发明申请

US20070141330A1 Method of producing a semiconductor device, and wafer-processing tape 有权
标题翻译：半导体器件的制造方法以及晶片加工用带
公开(公告)号：US20070141330A1
公开(公告)日：2007-06-21
申请号：US11700142
申请日：2007-01-31
申请人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata , Takanori Yamakawa
发明人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata , Takanori Yamakawa
IPC分类号： B32B37/12 , B32B38/10 , B32B38/04 , B32B7/12 , B32B15/04
CPC分类号： H01L24/29 , C09J7/20 , C09J2201/36 , C09J2203/326 , C09J2433/00 , C09J2463/00 , C09J2479/08 , H01L21/561 , H01L21/563 , H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L24/90 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/1134 , H01L2224/16 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/73104 , H01L2224/73203 , H01L2224/81191 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , Y10T156/1052 , Y10T156/1062 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , H01L2224/13099 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
摘要： A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.
摘要翻译：一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

4. 发明申请

US20050249909A1 Wafer-adhering adhesive tape 审中-公开
标题翻译：胶粘胶带
公开(公告)号：US20050249909A1
公开(公告)日：2005-11-10
申请号：US11184001
申请日：2005-07-19
申请人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
发明人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
IPC分类号： C09J7/02 , H01L21/00 , H01L21/68 , B32B9/00
CPC分类号： H01L21/6836 , C09J7/385 , C09J2203/326 , H01L21/67132 , H01L2221/68327 , Y10T428/14 , Y10T428/1462 , Y10T428/24364 , Y10T428/24926 , Y10T428/28 , Y10T428/2809 , Y10T428/2852
摘要： A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
摘要翻译：一种晶片粘合胶带，其在基体的表面上具有可辐射固化的可去除的粘合剂层，并且如果需要，在顺序上具有芯片粘合粘合剂层，其中可辐射固化的可除去粘合剂层主要由在主链中分别具有至少可辐射固化的含碳 - 碳双键的基团，羟基和含有羧基的基团的丙烯酸系共聚物，并且所述可辐射固化的可除去粘合剂层具有凝胶 60％以上的分数。

5. 发明申请

US20050086210A1 Method for retrieving data, apparatus for retrieving data, program for retrieving data, and medium readable by machine 审中-公开
标题翻译：用于检索数据的方法，用于检索数据的装置，用于检索数据的程序和可由机器读取的介质
公开(公告)号：US20050086210A1
公开(公告)日：2005-04-21
申请号：US10811953
申请日：2004-03-30
申请人： Kenji Kita , Masami Shishibori , Shun'ichiro Oe
发明人： Kenji Kita , Masami Shishibori , Shun'ichiro Oe
IPC分类号： G06F17/30 , G06F7/00
CPC分类号： G06F16/2455 , G06F16/2264 , G06F16/41
摘要： A method for retrieving data from multidimensional data includes providing a plurality of vectors having feature values in the multidimensional data. A specified retrieving condition is transformed into a retrieving query vector having a dimension equal to a dimension of the multidimensional data. Distances between the retrieving query vector and potential vectors to be retrieved are calculated. The process is stopped and skips calculating a distance when a cumulative value is greater than a maximum value. The method also retains the distance calculated when the cumulative value is less than the maximum value. The maximum value is replaced with the distance calculated, when the distance is less than the maximum value. The method then outputs the retained multidimensional data after the retaining and replacing steps. An apparatus, computer program and machine readable medium related to the method are also discussed.
摘要翻译：用于从多维数据中检索数据的方法包括在多维数据中提供具有特征值的多个向量。指定的检索条件被转换成具有等于多维数据的维度的维度的检索查询向量。计算检索查询向量和要检索的潜在向量之间的距离。当累积值大于最大值时，该过程停止并跳过计算距离。该方法还保留当累积值小于最大值时计算出的距离。当距离小于最大值时，最大值被替换为计算的距离。然后，该方法在保留和替换步骤之后输出保留的多维数据。还讨论了与该方法相关的装置，计算机程序和机器可读介质。

6. 发明授权

US6058365A Speech processing using an expanded left to right parser 失效
标题翻译：使用扩展的从左到右解析器的语音处理
公开(公告)号：US6058365A
公开(公告)日：2000-05-02
申请号：US86569
申请日：1993-07-06
申请人： Akito Nagai , Kenji Kita , Shigeki Sagayama
发明人： Akito Nagai , Kenji Kita , Shigeki Sagayama
IPC分类号： G10L15/14 , G10L15/18 , G10L5/06
CPC分类号： G10L15/187 , G10L15/142
摘要： Continuous speech is recognized by selecting among hypotheses, consisting of candidates of symbol strings obtained by connecting phonemes corresponding to a Hidden Markov Model (HMM) having the highest probability, by referring to a phoneme context dependent type HMM from input speech using a HMM phoneme verification portion. A phoneme context dependent type LR (Left-Right) parser portion predicts a subsequent phoneme by referring to an action specifying item stored in an LR (Left to Right) parsing table to predict a phoneme context around the predicted phoneme using an action specifying item of the LR table.
摘要翻译：通过选择由通过使用HMM音素验证参考来自输入语音的音素上下文相关类型HMM来连接具有最高概率的隐马尔可夫模型（HMM）的音素而获得的符号串的候选的假设来识别连续语音。一部分。音素上下文相关型LR（左右）解析器部分通过参考存储在LR（从左到右）解析表中的动作指定项来预测随后的音素，以使用动作指定项目来预测围绕预测音素的音素上下文 LR表。

7. 发明授权

US08722184B2 Wafer-adhering adhesive tape 有权
标题翻译：胶粘胶带
公开(公告)号：US08722184B2
公开(公告)日：2014-05-13
申请号：US12058170
申请日：2008-03-28
申请人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
发明人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H01L21/6836 , C09J7/385 , C09J2203/326 , H01L21/67132 , H01L2221/68327 , Y10T428/14 , Y10T428/1462 , Y10T428/24364 , Y10T428/24926 , Y10T428/28 , Y10T428/2809 , Y10T428/2852
摘要： A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
摘要翻译：一种晶片粘合胶带，其在基体的表面上具有可辐射固化的可去除的粘合剂层，并且如果需要，在顺序上具有芯片粘合粘合剂层，其中可辐射固化的可除去粘合剂层主要由在主链中分别具有至少可辐射固化的含碳 - 碳双键的基团，羟基和含有羧基的基团的丙烯酸系共聚物，并且所述可辐射固化的可除去粘合剂层具有凝胶 60％以上的分数。

8. 发明授权

US08545979B2 Wafer-processing tape and method of producing the same 有权
标题翻译：晶圆加工带及其制造方法
公开(公告)号：US08545979B2
公开(公告)日：2013-10-01
申请号：US11370835
申请日：2006-03-09
申请人： Kenji Kita , Yasumasa Morishima , Shinichi Ishiwata
发明人： Kenji Kita , Yasumasa Morishima , Shinichi Ishiwata
IPC分类号： B32B7/12 , B32B7/10
CPC分类号： H01L24/29 , C09J7/38 , C09J2201/28 , C09J2201/36 , C09J2203/326 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01055 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , Y10T428/28 , Y10T428/2809 , Y10T428/2848 , Y10T428/287 , Y10T428/2891 , Y10T428/298 , H01L2924/00
摘要： A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.
摘要翻译：一种晶片加工带，其具有形成在基膜的表面上的粘合剂层和可除去的粘合剂层，并且其具有B> A的区域和A> B的区域，其中，基底膜和粘合剂层被指定为A，将待粘合的目标物和粘合剂层之间以及待接合的靶材与可除去的粘合剂层之间的剥离力指定为B，其中粘合剂层转移到芯片上在B> A的区域中的拾取过程中，在剥离带子时，在A> B的区域中不能将可移除的粘合剂层转印到待粘合的目标物上。

9. 发明授权

US08043698B2 Method of producing a semiconductor device, and wafer-processing tape 有权
标题翻译：半导体器件的制造方法以及晶片加工用带
公开(公告)号：US08043698B2
公开(公告)日：2011-10-25
申请号：US11700142
申请日：2007-01-31
申请人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata , Takanori Yamakawa
发明人： Yasumasa Morishima , Kenji Kita , Shinichi Ishiwata , Takanori Yamakawa
IPC分类号： B32B7/12 , B32B15/04
CPC分类号： H01L24/29 , C09J7/20 , C09J2201/36 , C09J2203/326 , C09J2433/00 , C09J2463/00 , C09J2479/08 , H01L21/561 , H01L21/563 , H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/83 , H01L24/90 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/1134 , H01L2224/16 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/73104 , H01L2224/73203 , H01L2224/81191 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , Y10T156/1052 , Y10T156/1062 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , H01L2224/13099 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
摘要： A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.
摘要翻译：一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

10. 发明申请

US20080299345A1 WAFER-ADHERING ADHESIVE TAPE 有权
标题翻译：胶带贴胶带
公开(公告)号：US20080299345A1
公开(公告)日：2008-12-04
申请号：US12058170
申请日：2008-03-28
申请人： Yasumasa MORISHIMA , Kenji Kita , Shinichi Ishiwata
发明人： Yasumasa MORISHIMA , Kenji Kita , Shinichi Ishiwata
IPC分类号： B32B33/00 , H01L21/304
CPC分类号： H01L21/6836 , C09J7/385 , C09J2203/326 , H01L21/67132 , H01L2221/68327 , Y10T428/14 , Y10T428/1462 , Y10T428/24364 , Y10T428/24926 , Y10T428/28 , Y10T428/2809 , Y10T428/2852
摘要： A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
摘要翻译：一种晶片粘合胶带，其在基体的表面上具有可辐射固化的可去除的粘合剂层，并且如果需要，在顺序上具有芯片粘合粘合剂层，其中可辐射固化的可除去粘合剂层主要由在主链中分别具有至少可辐射固化的含碳 - 碳双键的基团，羟基和含有羧基的基团的丙烯酸系共聚物，并且所述可辐射固化的可除去粘合剂层具有凝胶 60％以上的分数。

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