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1. 发明申请

US20110248372A1 EPITAXIAL SUBSTRATE FOR SOLID-STATE IMAGING DEVICE WITH GETTERING SINK, SEMICONDUCTOR DEVICE, BACK ILLUMINATED SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：用于固态摄像装置的外部衬底，半导体器件，背面照明的固态成像装置及其制造方法
公开(公告)号：US20110248372A1
公开(公告)日：2011-10-13
申请号：US13124578
申请日：2009-10-16
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L31/02 , H01L21/26
CPC分类号： H01L21/268 , C30B29/06 , H01L21/322 , H01L27/14603 , H01L27/14698 , Y10S117/904
摘要： A semiconductor wafer is set in a laser irradiation apparatus, and laser beam irradiation is performed while the semiconductor wafer is moved. At this time, a laser beam emitted from a laser generating apparatus is condensed by a condensing lens so that the condensing point (focal point) is positioned at a depth of several tens of gm or so from one surface of the semiconductor wafer. Thereby, the crystal structure of the semiconductor wafer in the position having such a depth is modified, and a gettering sink is formed.
摘要翻译：将半导体晶片设置在激光照射装置中，并且在半导体晶片移动的同时进行激光束照射。此时，从激光发生装置发射的激光束被聚光透镜冷凝，使得聚光点（焦点）位于半导体晶片的一个表面的几十μm左右的深度。由此，改变了具有这样深度的位置的半导体晶片的晶体结构，形成了吸杂槽。

2. 发明申请

US20110049664A1 EPITAXIAL SUBSTRATE FOR BACK-ILLUMINATED IMAGE SENSOR AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：用于后照明图像传感器的外延基板及其制造方法
公开(公告)号：US20110049664A1
公开(公告)日：2011-03-03
申请号：US12872674
申请日：2010-08-31
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L27/146 , H01L21/322 , H01L31/08
CPC分类号： H01L21/02381 , H01L21/02378 , H01L21/0245 , H01L21/02532 , H01L21/02573 , H01L21/02658 , H01L21/3225 , H01L27/146 , H01L27/1464
摘要： Provided is an epitaxial substrate for a back-illuminated image sensor and a manufacturing method thereof that is capable of suppressing metal contaminations and reducing occurrence of a white spot defect of the image sensor, by maintaining a sufficient gettering performance in a device process. The present invention includes forming a gettering sink immediately below a surface of a high-oxygen silicon substrate, forming a first epitaxial layer on the surface of the high-oxygen silicon substrate, and forming a second epitaxial layer on the first epitaxial layer, in which the step of forming the gettering sink includes forming an oxygen precipitate region by applying a long-time heat treatment at a temperature of 650-1150° C. to the high-oxygen silicon substrate.
摘要翻译：本发明提供一种背照式图像传感器的外延基板及其制造方法，其能够通过在器件工艺中保持充分的吸杂性能来抑制金属污染并减少图像传感器的白斑缺陷的发生。本发明包括在高氧硅衬底的表面的正下方形成吸气槽，在高氧硅衬底的表面上形成第一外延层，在第一外延层上形成第二外延层，其中形成吸气槽的步骤包括通过在650-1150℃的温度下对高氧硅衬底进行长时间热处理来形成氧沉淀区域。

3. 发明申请

US20100311199A1 METHOD OF PRODUCING EPITAXIAL SUBSTRATE FOR SOLID-STATE IMAGING DEVICE, AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE 有权
标题翻译：用于固态成像装置的外延基板的制造方法以及制造固态成像装置的方法
公开(公告)号：US20100311199A1
公开(公告)日：2010-12-09
申请号：US12789649
申请日：2010-05-28
申请人： Kazunari KURITA
发明人： Kazunari KURITA
IPC分类号： H01L21/322 , H01L31/18 , H01L21/26
CPC分类号： H01L21/268 , H01L21/3225 , H01L27/14601 , H01L27/14683
摘要： A method of producing an epitaxial substrate for a solid-state imaging device, comprising: forming a gettering sink by injecting laser beam to a semiconductor substrate through one surface thereof, condensing the laser beam to an arbitrarily selected portion of the semiconductor substrate, thereby causing multi-photon absorption process to occur in the portion, and forming a gettering sink having a modified crystal structure; and epitaxially growing at least two epitaxial layers on the semiconductor substrate in which the gettering sink is formed.
摘要翻译：一种制造用于固态成像装置的外延衬底的方法，包括：通过将激光束通过其一个表面注入激光束而形成吸气槽，将激光束聚焦到半导体衬底的任意选择的部分，从而引起在该部分发生多光子吸收过程，并形成具有改性晶体结构的吸气槽; 并在其上形成吸气槽的半导体衬底上外延生长至少两个外延层。

4. 发明申请

US20100304552A1 METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE DEDICATED TO SEMICONDUCTOR DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的半导体衬底的方法和装置以及制造半导体器件的方法和装置
公开(公告)号：US20100304552A1
公开(公告)日：2010-12-02
申请号：US12787750
申请日：2010-05-26
申请人： Kazunari KURITA
发明人： Kazunari KURITA
IPC分类号： H01L21/322 , B23K26/00
CPC分类号： H01L21/3225 , B23K26/0006 , B23K26/0624 , B23K2103/56 , H01L21/268
摘要： A method for manufacturing a semiconductor substrate dedicated to a semiconductor device, in which multi-photon absorption is generated in a micro-region inside the semiconductor substrate by condensing laser beams in any micro-region inside the semiconductor substrate, and a gettering sink is formed by changing the crystal structure of only the micro-region.
摘要翻译：制造专用于半导体器件的半导体衬底的方法，其中通过在半导体衬底内的任何微区域聚焦激光束和吸气槽来形成在半导体衬底内的微区域中产生多光子吸收的方法通过改变仅微区的晶体结构。

5. 发明申请

US20100224968A1 HIGH RESISTIVITY SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：高电阻硅波及其制造方法
公开(公告)号：US20100224968A1
公开(公告)日：2010-09-09
申请号：US12714659
申请日：2010-03-01
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L29/36 , H01L21/322
CPC分类号： H01L21/3225 , C30B15/00 , C30B29/06 , H01L21/324 , H01L29/864 , H01L29/868
摘要： This method for manufacturing a high resistivity silicon wafer includes pulling a single crystal such that the single crystal has a p-type dopant concentration at which a wafer surface resistivity becomes in a range of 0.1 to 10 kΩcm, an oxygen concentration Oi of 5.0×1017 to 20×1017 atoms/cm3 (ASTM F-121, 1979), and either one of a nitrogen concentration of 1.0×1013 to 10×1013 atoms/cm3 (ASTM F-121, 1979) and a carbon concentration of 0.5×1016 to 10×1016 atoms/cm3 or 0.5×1016 to 50×1016 atoms/cm3 (ASTM F-123, 1981) by using a Czochralski method, processing the single crystal into wafers by slicing the single crystal, and subjecting the wafer to an oxygen out-diffusion heat treatment process in a non-oxidizing atmosphere. A peak position of a resistivity serving as a boundary between a p-type region of a wafer surface side and a p/n conversion region of an inner side of a thickness direction is adjusted by the nitrogen concentration or the carbon concentration such that the peak position is set to a boundary depth in a range of 10 to 70 μm from the wafer surface.
摘要翻译：这种制造高电阻率硅晶片的方法包括拉制单晶，使得单晶具有p型掺杂剂浓度，晶片表面电阻率变为0.1至10kΩ/ cm 2，氧浓度Oi为5.0 ×1017〜20×1017原子/ cm3（ASTM F-121,1979），氮浓度为1.0×1013〜10×1013原子/ cm3（ASTM F-121,1979），碳浓度为0.5 ×1016〜10×1016原子/ cm3或0.5×1016〜50×1016原子/ cm3（ASTM F-123,1981），通过切割单晶将单晶加工成晶片，涉及在非氧化性气氛中的氧扩散热处理工艺。作为晶片表面侧的p型区域和厚度方向内侧的ap / n转换区域之间的边界的电阻率的峰值位置通过氮浓度或碳浓度来调节，使得峰值位置被设定为距晶片表面10〜70μm范围内的边界深度。

6. 发明申请

US20100148297A1 SEMICONDUCTOR SUBSTRATE FOR SOLID-STATE IMAGE SENSING DEVICE AS WELL AS SOLID-STATE IMAGE SENSING DEVICE AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：用作固态图像感测装置的固态图像感测装置的半导体衬底及其制造方法
公开(公告)号：US20100148297A1
公开(公告)日：2010-06-17
申请号：US11996925
申请日：2007-09-07
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L31/14 , H01L31/0352 , H01L31/0256 , H01L31/18
CPC分类号： H01L31/186 , C30B15/04 , C30B29/06 , C30B33/02 , H01L21/3221 , H01L27/14603 , Y02E10/50 , Y02P70/521
摘要： There is provided a semiconductor substrate for solid-state image sensing device in which the production cost is lower than that of a gettering method through a carbon ion implantation and problems such as occurrence of particles at a device production step and the like are solved.Silicon substrate contains solid-soluted carbon having a concentration of 1×1016-1×1017 atoms/cm3 and solid-soluted oxygen having a concentration of 1.4×1018-1.6×1018 atoms/cm3.
摘要翻译：提供了一种用于固体摄像装置的半导体衬底，其中生产成本低于通过碳离子注入的吸气方法的生产成本，并且解决了在器件制造步骤等处发生颗粒的问题。硅衬底含有浓度为1×1016-1×1017原子/ cm3的固溶碳，浓度为1.4×1018-1.6×1018原子/ cm3的固溶氧。

7. 发明申请

US20090289283A1 Wafer For Backside Illumination Type Solid Imaging Device, Production Method Thereof And Backside Illumination Solid Imaging Device 审中-公开
标题翻译：背面照明型晶片固体成像装置及其制造方法及背面照明固体成像装置
公开(公告)号：US20090289283A1
公开(公告)日：2009-11-26
申请号：US12469505
申请日：2009-05-20
申请人： Kazunari Kurita , Shuichi Omote
发明人： Kazunari Kurita , Shuichi Omote
IPC分类号： H01L31/0392 , H01L31/18 , H01L21/30
CPC分类号： H01L27/14634 , H01L21/3226 , H01L27/1203 , H01L27/1464 , H01L27/1469
摘要： A wafer for backside illumination type solid imaging device has a plurality of pixels inclusive of a photoelectric conversion device and a charge transfer transistor at its front surface side and a light receiving surface at its back surface side, wherein said wafer is a SOI wafer obtained by forming a given active layer on a support substrate made of C-containing p-type semiconductor material through an insulating layer.
摘要翻译：背面照明型固体成像装置的晶片具有多个像素，包括其表面侧的光电转换装置和电荷转移晶体管及其后表面侧的光接收表面，其中所述晶片是由通过绝缘层在由含C的p型半导体材料制成的支撑衬底上形成给定的有源层。

8. 发明授权

US07560163B2 Silicon wafer and method for producing same 有权
标题翻译：硅晶片及其制造方法
公开(公告)号：US07560163B2
公开(公告)日：2009-07-14
申请号：US11699894
申请日：2007-01-29
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： B32B9/00
CPC分类号： C30B29/06 , C30B15/00 , C30B33/02
摘要： A silicon wafer that has a carbon concentration of 5×1015 to 5×1017 atoms/cm3, interstitial oxygen concentration of 6.5×1017 to 13.5×1017 atoms/cm3, and a resistivity of 100 Ωcm or more.
摘要翻译：碳浓度为5×10 15〜5×10 17原子/ cm 3的硅晶片，间隙氧浓度为6.5×10 17〜13.5×10 17原子/ cm 3，电阻率为100Ωm以上。

9. 发明申请

US20090117719A1 HIGH FREQUENCY DIODE AND METHOD FOR PRODUCING SAME 有权
标题翻译：高频二极管及其制造方法
公开(公告)号：US20090117719A1
公开(公告)日：2009-05-07
申请号：US12327715
申请日：2008-12-03
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L21/20
CPC分类号： H01L29/32 , H01L21/3225 , H01L29/864 , H01L29/868
摘要： A high frequency diode comprising: a P type region, a N type region, and an I layer as a high resistivity layer interposed between the P type region and the N type region, wherein the I layer is made of a silicon wafer that has a carbon concentration of 5×1015 to 5×1017 atoms/cm3 interstitial oxygen concentration of 6.5×1017 to 13.5×1017 atoms/cm3, and a resistivity of 100 Ωcm or more.
摘要翻译：一种高频二极管，包括：P型区域，N型区域和插入在P型区域和N型区域之间的作为高电阻率层的I层，其中I层由具有 5×10 15至5×10 17原子/ cm 3的间隙氧浓度的碳浓度为6.5×10 17至13.5×10 17原子/ cm 3，电阻率为100Ωm以上。

10. 发明申请

US20070207595A1 Method for producing silicon wafer 失效
标题翻译：硅晶片的制造方法
公开(公告)号：US20070207595A1
公开(公告)日：2007-09-06
申请号：US11706439
申请日：2007-02-14
申请人： Kazunari Kurita
发明人： Kazunari Kurita
IPC分类号： H01L21/322
CPC分类号： H01L21/3225 , H01L21/268
摘要： A method for producing a silicon wafer, comprising performing an activation of metallic impurities by irradiating laser light on the metallic impurities constituting contaminants in the silicon wafer, changing the electric charge of the contaminants, and activating the contaminants to a state such that the contaminants easily react with oxygen precipitation nuclei and are subjected to gettering.
摘要翻译：一种硅晶片的制造方法，其特征在于，通过对构成所述硅晶片中的污染物的金属杂质进行激光照射来激活金属杂质，改变污染物的电荷，使污染物活化，使污染物容易与氧沉淀核反应并进行吸气。

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