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1. 发明授权

US07829995B2 Semiconductor device and method of fabrication 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07829995B2
公开(公告)日：2010-11-09
申请号：US12425682
申请日：2009-04-17
申请人： Kazuhiko Matsumura
发明人： Kazuhiko Matsumura
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/49503 , H01L23/49513 , H01L23/49551 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/75 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/05599 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/85 , H01L2224/85399 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a sealing resin made of a first resin material, sealing the first die pad, the first semiconductor chip, the second die pad and the second semiconductor chip. A lower surface of the first semiconductor chip is connected to the first die pad. A first portion of a lower surface of the second semiconductor chip is connected to the second die pad, and a second portion not connected to the second die pad of the lower surface of the second semiconductor chip is connected to an upper surface of the first semiconductor chip via a second resin material different from the first resin material.
摘要翻译：半导体器件包括第一管芯焊盘，设置在第一裸片焊盘上的第一半导体芯片，第二裸片焊盘，设置在第二裸片焊盘上的第二半导体芯片，以及由第一树脂材料制成的密封树脂，芯片焊盘，第一半导体芯片，第二裸片焊盘和第二半导体芯片。第一半导体芯片的下表面连接到第一管芯焊盘。第二半导体芯片的下表面的第一部分连接到第二管芯焊盘，并且未连接到第二半导体芯片的下表面的第二管芯焊盘的第二部分连接到第一半导体芯片的上表面通过与第一树脂材料不同的第二树脂材料芯片。

2. 发明申请

US20060120726A1 Remote control device and display device 审中-公开
标题翻译：遥控装置和显示装置
公开(公告)号：US20060120726A1
公开(公告)日：2006-06-08
申请号：US11288420
申请日：2005-11-29
申请人： Kohji Yoshifusa , Kohji Hisakawa , Kazuhiko Matsumura , Hajime Kashida , Fumihiko Aoki
发明人： Kohji Yoshifusa , Kohji Hisakawa , Kazuhiko Matsumura , Hajime Kashida , Fumihiko Aoki
IPC分类号： H04B10/00
CPC分类号： G08C23/04 , H04B10/1141
摘要： In an embodiment of the present invention, a remote control device is provided with an optical indicator device and a light-receiving device. A display device is provided with a display portion that displays a pointer and a frame portion that accommodates the light-receiving device. By displacing a light-emitting element sequencially to a plurality of displacement positions, supplying a light emission signal to the light-emitting element at each displacement position and to cause the light-emitting element to emit as output a position detection light signal, then sequencially detecting light-reception signals that are received as input by a position detection light-receiving element of the light-receiving device, and performing arithmetic processing as appropriate on the detected light-reception signals, a displacement state of a reference axis displacement angle is detected. Movement of a pointer is controlled by using the displacement state of the reference axis displacement angle as an indicating signal for the pointer.
摘要翻译：在本发明的实施例中，遥控装置设置有光学指示装置和光接收装置。显示装置设置有显示指示器的显示部分和容纳光接收装置的框架部分。通过将发光元件顺序地移位到多个位移位置，在每个位移位置向发光元件提供发光信号，并使发光元件作为位置检测光信号的输出发射，然后顺序地检测由光接收装置的位置检测光接收元件作为输入接收的光接收信号，并且对检测到的光接收信号进行适当的算术处理，检测基准轴位移角的位移状态。通过使用参考轴位移角度的位移状态作为指针的指示信号来控制指针的移动。

3. 发明申请

US20060118706A1 Remote control device, electronic device, display device, and game machine control device 审中-公开
标题翻译：遥控装置，电子装置，显示装置和游戏机控制装置
公开(公告)号：US20060118706A1
公开(公告)日：2006-06-08
申请号：US11285214
申请日：2005-11-23
申请人： Kohji Hisakawa , Kohji Yoshifusa , Kazuhiko Matsumura , Hajime Kashida , Fumihiko Aoki
发明人： Kohji Hisakawa , Kohji Yoshifusa , Kazuhiko Matsumura , Hajime Kashida , Fumihiko Aoki
IPC分类号： G06M7/00
CPC分类号： H04N5/4403 , A63F13/06 , A63F13/213 , G06F3/0304 , G06F3/0346 , G06F3/038 , H04N21/42222 , H04N2005/4428 , H04N2005/4432
摘要： A remote control device provided with a means for receiving light from a light-emitting element 21 at a light-receiving element 3 and detecting from a signal thereof a movement amount of a mark 16 on a screen 2a of a display device 2 so as to cause movement of the mark such as a pointer on the screen of the display device in response to a movement amount of a light emission point H of the light-emitting element, wherein the light-receiving element is provided with a semiconductor position detection element, and moreover, is configured to be capable of detecting movement of the light emission point in a horizontal direction and a vertical direction, and causes the mark on the screen of the display device to move due to the signal from the light-receiving element.
摘要翻译：一种遥控装置，设置有用于在光接收元件3处接收来自发光元件21的光的装置，并从其信号检测显示装置2的屏幕2a上的标记16的移动量，以便响应于发光元件的发光点H的移动量使得诸如指示器的指示器在显示装置的屏幕上的移动，其中光接收元件设置有半导体位置检测元件而且被配置为能够检测发光点在水平方向和垂直方向上的移动，并且使得显示装置的屏幕上的标记由于来自光接收元件的信号而移动。

4. 发明授权

US07015348B2 Method for producing an optically active β-amino acid 有权
标题翻译：光学活性β-氨基酸的制造方法
公开(公告)号：US07015348B2
公开(公告)日：2006-03-21
申请号：US10628394
申请日：2003-07-29
申请人： Kazuhiko Matsumura , Xiaoyong Zhang , Takao Saito
发明人： Kazuhiko Matsumura , Xiaoyong Zhang , Takao Saito
IPC分类号： C07C229/00
CPC分类号： C07C227/16 , C07B2200/07 , C07C227/32 , C07C2601/08 , C07D333/24 , Y02P20/55 , C07C229/08 , C07C229/34 , C07C229/48 , C07C229/22
摘要： To provide a producing method of an optically active β-amino acid useful as intermediate for the production of medicines, agricultural chemicals and physiologically active substances, by means of a catalytic and asymmetric synthesis method of high performance and a high enantiomeric excess, without requiring additional procedures such as introduction and removal of protecting group and so on.A producing method of an optically active β-amino acids which comprises subjecting an enamine to an asymmetric hydrogenation.
摘要翻译：为了提供可用作药物，农药和生理活性物质生产中间体的光学活性β-氨基酸的制备方法，通过高性能和高对映体过量的催化和不对称合成方法，而不需要额外的程序如引入和去除保护基等。一种光学活性β-氨基酸的制备方法，其包括使烯胺进行不对称氢化。

5. 发明授权

US06184381B2 Process for preparing optically active compounds 有权
标题翻译：光学活性化合物的制备方法
公开(公告)号：US06184381B2
公开(公告)日：2001-02-06
申请号：US09077787
申请日：1998-09-29
申请人： Takao Ikariya , Shohei Hashiguchi , Jun Takehara , Nobuyuki Uematsu , Kazuhiko Matsumura , Ryoji Noyori , Akio Fujii
发明人： Takao Ikariya , Shohei Hashiguchi , Jun Takehara , Nobuyuki Uematsu , Kazuhiko Matsumura , Ryoji Noyori , Akio Fujii
IPC分类号： C07D45302
CPC分类号： B01J31/2295 , B01J31/0237 , B01J31/0239 , B01J31/0252 , B01J31/0267 , B01J31/0271 , B01J31/1805 , B01J2231/643 , B01J2531/821 , C07B2200/07 , C07C29/143 , C07C67/31 , C07C209/52 , C07C213/02 , C07C2601/14 , C07C2602/08 , C07C2602/10 , C07C211/27 , C07C211/30 , C07C211/40 , C07C217/84 , C07C35/32
摘要： This document describes a novel and practically excellent process for the preparation of optically active compounds, such as optically active alcohols or amines which are useful for various applications, for example, as synthetic intermediates of pharmaceuticals, liquid crystal materials, and reagents for optical resolution, wherein a hydrogen transfer type asymmetric reduction is carried out in the presence of both a transition metal complex and an optically active nitrogen compound or a transition metal complex having an optically active nitrogen compounds as an asymmetric ligand, and a hydrogen-donating organic or inorganic compound.
摘要翻译：该文献描述了用于制备光学活性化合物（例如可用于各种应用的光学活性醇或胺）的新颖且实际上优异的方法，例如用作药物，液晶材料和用于光学拆分的试剂的合成中间体，其中氢转移型不对称还原在过渡金属配合物和光学活性氮化合物或具有光学活性氮化合物作为不对称配体的过渡金属配合物和供氢有机或无机化合物的存在下进行。

6. 发明授权

US5734199A Semiconductor device having improved test electrodes 失效
标题翻译：具有改进的测试电极的半导体器件
公开(公告)号：US5734199A
公开(公告)日：1998-03-31
申请号：US767778
申请日：1996-12-17
申请人： Tetsuo Kawakita , Kazuhiko Matsumura , Ichiro Yamane
发明人： Tetsuo Kawakita , Kazuhiko Matsumura , Ichiro Yamane
IPC分类号： H01L21/66 , H01L21/98 , H01L23/58 , H01L25/065 , H01L23/52 , H01L23/48 , H05K3/34
CPC分类号： H01L25/50 , H01L22/20 , H01L22/32 , H01L24/14 , H01L24/81 , H01L25/0657 , H01L2224/13562 , H01L2224/13644 , H01L2224/16145 , H01L2224/32145 , H01L2224/73204 , H01L2224/75 , H01L2224/7525 , H01L2224/75301 , H01L2224/83192 , H01L2224/83224 , H01L2224/83859 , H01L2224/83874 , H01L2225/06513 , H01L2225/06582 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/381
摘要： The main surface of a first semiconductor chip having a first functional element is formed with first testing electrodes for testing the electrical characteristics of the first functional element and first connecting electrodes electrically connected to the first functional element. The main surface of a second semiconductor chip having a second functional element is formed with second testing electrodes for testing the electrical characteristics of the second functional element and second connecting electrodes electrically connected to the second functional element. The first semiconductor chip and the second semiconductor chip are integrated by using an insulating resin, with first bumps formed on the first connecting electrodes being bonded to third bumps formed on the second connecting electrodes.
摘要翻译：具有第一功能元件的第一半导体芯片的主表面形成有用于测试第一功能元件的电特性的第一测试电极和与第一功能元件电连接的第一连接电极。具有第二功能元件的第二半导体芯片的主表面形成有用于测试第二功能元件的电特性的第二测试电极和与第二功能元件电连接的第二连接电极。通过使用绝缘树脂将第一半导体芯片和第二半导体芯片集成在一起，形成在第一连接电极上的第一凸块与形成在第二连接电极上的第三凸块接合。

7. 发明申请

US20100036149A1 METHOD FOR PRODUCING AN OPTICALLY ACTIVE TETRAHYDROQUINOLINE 有权
标题翻译：生产光学活性四氢喹啉的方法
公开(公告)号：US20100036149A1
公开(公告)日：2010-02-11
申请号：US12550948
申请日：2009-08-31
申请人： Takashi Moroi , Tsukasa Sotoguchi , Kazuhiko Matsumura , Motonobu Takenaka , Wataru Kuriyama , Toshiyuki Murayama , Hideki Nara , Tohru Yokozawa , Kenji Yagi
发明人： Takashi Moroi , Tsukasa Sotoguchi , Kazuhiko Matsumura , Motonobu Takenaka , Wataru Kuriyama , Toshiyuki Murayama , Hideki Nara , Tohru Yokozawa , Kenji Yagi
IPC分类号： C07C227/16
CPC分类号： C07C229/18 , C07C211/49 , C07C229/30 , C07D215/42
摘要： The present invention provides an industrially advantageous production method of optically active tetrahydroquinolines of formula (1), which comprises: 1) a step of reacting a β-ketoester of formula (2) with an amine of formula (3) to produce an enaminoester of formula (4); 2) a step of subjecting the enaminoester of formula (4) above obtained in 1) to asymmetric hydrogenation to produce an optically active β-amino acid derivative of formula (5); 3) a step of amidating the optically active β-amino acid derivative (5) above obtained in 2) to produce an amide of formula (6); 4) a step of alkoxycarbonylating the amide of formula (6) above obtained in 3) to produce a compound of formula (7); and 5) a step of subjecting the compound of formula (7) above to cyclization to produce the optically active tetrahydroquinoline of formula (1).
摘要翻译：本发明提供了一种工业上有利的式（1）的光学活性四氢喹啉的制备方法，其包括：1）使式（2）的β-酮酯与式（3）的胺反应以产生一种公式（4）; 2）使在1）中获得的上述式（4）的烯氨基酯进行不对称氢化以产生式（5）的光学活性β-氨基酸衍生物的步骤; 3）将2）中得到的光学活性β-氨基酸衍生物（5）酰胺化以制备式（6）的酰胺的步骤; 4）在3）中得到的上述式（6）的酰胺进行烷氧基羰基化以制备式（7）化合物的步骤; 和5）使上述式（7）化合物环化以制备式（1）的光学活性四氢喹啉的步骤。

8. 发明授权

US07635776B2 Ligands and complex compounds containing the same 失效
标题翻译：配体和含有相同的配合物
公开(公告)号：US07635776B2
公开(公告)日：2009-12-22
申请号：US10542659
申请日：2004-02-04
申请人： Kazushi Mashima , Koji Ohno , Kazuhiko Matsumura
发明人： Kazushi Mashima , Koji Ohno , Kazuhiko Matsumura
IPC分类号： C07C211/00 , C07F15/00
CPC分类号： B01J31/182 , B01J31/1805 , B01J31/2243 , B01J2231/641 , B01J2531/0244 , B01J2531/0258 , B01J2531/0288 , B01J2531/16 , B01J2531/17 , B01J2531/18 , B01J2531/26 , B01J2531/31 , B01J2531/37 , B01J2531/38 , B01J2531/42 , B01J2531/46 , B01J2531/48 , B01J2531/56 , B01J2531/74 , B01J2531/821 , B01J2531/822 , B01J2531/824 , B01J2531/827 , B01J2531/828 , B01J2531/842 , B01J2531/845 , B01J2531/847 , C07C215/50 , C07F5/003
摘要： A ligand represented by the formula (1): R1R2N-Q1-X-Q2-NR3R4 (1) wherein R1, R2, R3 and R4 are each the same or different and represent a group represented by the formula (2): wherein Q3 is an optionally substituted alkylene group, an optionally substituted cycloalkylene group, an optionally substituted arylene group, or an optionally substituted divalent heterocyclic group, R5 is an optionally substituted alkyl group, an optionally substituted aryl group or an optionally substituted heterocyclic group and R6 is a substituent which may coordinate or bind to a metal atom, or R5 and R6, taken together, may form a ring, Q1 and Q2 are each the same or different and represent an optionally substituted alkylene group or a single bond, and X is a divalent spacer.
摘要翻译：由式（1）表示的配体：R1R2N-Q1-X-Q2-NR3R4（1）其中R1，R2，R3和R4各自相同或不同，表示由式（2）表示的基团：其中Q3 是任选取代的亚烷基，任选取代的亚环烷基，任选取代的亚芳基或任选取代的二价杂环基，R 5是任选取代的烷基，任选取代的芳基或任选取代的杂环基，R 6是可以配位或结合金属原子的取代基，或者R 5和R 6一起形成环，Q1和Q2各自相同或不同，表示任选取代的亚烷基或单键，X是二价间隔

9. 发明申请

US20090278248A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090278248A1
公开(公告)日：2009-11-12
申请号：US12425682
申请日：2009-04-17
申请人： Kazuhiko MATSUMURA
发明人： Kazuhiko MATSUMURA
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L23/49575 , H01L23/49503 , H01L23/49513 , H01L23/49551 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/75 , H01L24/78 , H01L24/85 , H01L2224/05554 , H01L2224/05599 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73215 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/85 , H01L2224/85399 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01021 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip provided on the second die pad, and a sealing resin made of a first resin material, sealing the first die pad, the first semiconductor chip, the second die pad and the second semiconductor chip. A lower surface of the first semiconductor chip is connected to the first die pad. A first portion of a lower surface of the second semiconductor chip is connected to the second die pad, and a second portion not connected to the second die pad of the lower surface of the second semiconductor chip is connected to an upper surface of the first semiconductor chip via a second resin material different from the first resin material.
摘要翻译：半导体器件包括第一管芯焊盘，设置在第一裸片焊盘上的第一半导体芯片，第二裸片焊盘，设置在第二裸片焊盘上的第二半导体芯片，以及由第一树脂材料制成的密封树脂，芯片焊盘，第一半导体芯片，第二裸片焊盘和第二半导体芯片。第一半导体芯片的下表面连接到第一管芯焊盘。第二半导体芯片的下表面的第一部分连接到第二管芯焊盘，并且未连接到第二半导体芯片的下表面的第二管芯焊盘的第二部分连接到第一半导体芯片的上表面通过与第一树脂材料不同的第二树脂材料芯片。

10. 发明授权

US07382050B2 Semiconductor device and method for producing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07382050B2
公开(公告)日：2008-06-03
申请号：US11405060
申请日：2006-04-17
申请人： Kazuhiko Matsumura , Nozomi Shimoishizaka
发明人： Kazuhiko Matsumura , Nozomi Shimoishizaka
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , H01L23/49811 , H01L23/4985 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2223/54473 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/13012 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/75753 , H01L2224/759 , H01L2224/81121 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor device includes a tape carrier substrate having a flexible insulating film base, a plurality of conductor wirings provided on the film base, and wiring bumps respectively formed so as to cover an upper surface and both side surfaces of the conductor wirings, and a semiconductor chip mounted on the tape carrier substrate, wherein electrodes of the semiconductor chip are connected to the conductor wirings via the wiring bumps. Electrode bumps are formed on the electrodes of the semiconductor chip, the electrodes of the semiconductor chip are connected to the conductor wirings via a bonding between the wiring bumps and the electrode bumps, and the electrode bumps are harder than the wiring bumps. This structure can reduce bonding damages to the electrodes of the semiconductor chip caused by a process of connecting the electrodes and the conductor wirings via the bumps.
摘要翻译：半导体器件包括具有柔性绝缘膜基底的带状载体基板，设置在膜基底上的多个导体布线和分别形成为覆盖导体布线的上表面和两个侧表面的布线凸起，以及半导体芯片安装在带载基板上，其中半导体芯片的电极经由布线凸块连接到导体布线。电极凸点形成在半导体芯片的电极上，半导体芯片的电极通过布线凸块和电极凸块之间的接合而与导体布线连接，并且电极凸块比布线凸块更硬。这种结构可以通过经由凸块连接电极和导体布线的过程而减少对半导体芯片的电极的接合损伤。

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