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1. 发明授权

US06076256A Method for manufacturing magneto-optical data storage system 失效
标题翻译：磁光数据存储系统的制造方法
公开(公告)号：US06076256A
公开(公告)日：2000-06-20
申请号：US191516
申请日：1998-11-13
申请人： Joseph D. Drake , John H. Jerman , John D. Grade , Kathy J. Jackson
发明人： Joseph D. Drake , John H. Jerman , John D. Grade , Kathy J. Jackson
IPC分类号： G02B26/08 , G11B7/085 , G11B7/09 , G11B7/12 , G11B7/135 , G11B7/22 , G11B11/105 , H01R43/00
CPC分类号： B82Y30/00 , G02B26/0816 , G02B26/0866 , G11B11/10543 , G11B11/1058 , G11B7/08564 , G11B7/122 , G11B7/1362 , G11B7/22 , G11B11/10554 , G11B7/0901 , Y10T29/49117 , Y10T29/49789 , Y10T29/49796
摘要： A method for manufacturing a magneto-optical data storage system. The method includes the steps of providing a support surface and rotatably mounting a magneto-optical disk having a planar storage surface with a plurality of concentrically disposed data tracks onto the support surface. A proximal extremity of an arm is pivotably mounted on the support surface so that a distal extremity of the arm pivots between first and second positions relative to the storage surface. An optical light emitter and receiver emitting a laser beam is carried by the distal extremity of the arm. A flying magneto-optical head is mounted on the distal extremity of the arm. A mirror assembly is attached to the head. The mirror of the mirror assembly can be rocked between first and second positions for reflecting the laser beam between the optical light emitter and receiver and the storage surface of the magneto-optical disk so as to permit the optical recording and/or reading of information on the storage surface.
摘要翻译：一种制造磁光数据存储系统的方法。该方法包括以下步骤：提供支撑表面并将具有平面存储表面的磁光盘可旋转地安装到具有多个同心设置的数据轨迹到支撑表面上。臂的近端被可枢转地安装在支撑表面上，使得臂的远端相对于存储表面在第一和第二位置之间枢转。发射激光束的光发射器和接收器由臂的远端承载。飞行磁光头安装在臂的远端上。镜组件附接到头部。反射镜组件的反射镜可以在第一和第二位置之间摆动，用于将光束发射器和接收器之间的激光束与磁光盘的存储表面反射，以便允许光学记录和/或读取信息存储表面。

2. 发明授权

US08871109B2 Method for preparing a donor surface for reuse 有权
标题翻译：制备供体表面再利用的方法
公开(公告)号：US08871109B2
公开(公告)日：2014-10-28
申请号：US12557379
申请日：2009-09-10
申请人： Gopal Prabhu , Kathy J. Jackson , Orion Leland , Aditya Agarwal
发明人： Gopal Prabhu , Kathy J. Jackson , Orion Leland , Aditya Agarwal
IPC分类号： C03C15/00 , C03C25/68 , H01L21/302 , H01L21/461
CPC分类号： H01L31/1896 , Y02E10/50
摘要： A donor wafer, for example of silicon, has an irregular surface following cleaving of a lamina from the surface, for example by exfoliation following implant of hydrogen and/or helium ions to define a cleave plane. Pinholes in the lamina leave column asperities at the exfoliated surface of the donor wafer, and the beveled edge may leave an edge asperity which fails to exfoliate. To prepare the surface of the donor wafer for reuse, mechanical grinding removes the column and edge asperities, and minimal additional thickness. Following cleaning, growth and removal of an oxide layer at the surface rounds remaining peaks. The smoothed surface is well adapted to bonding to a receiver element and exfoliation of a new lamina. A variety of devices may be fabricated from the lamina, for example a photovoltaic cell.
摘要翻译：供体晶片，例如硅，在从表面切割层之后具有不规则表面，例如通过在氢和/或氦离子注入之后通过剥离来限定解理面。晶片中的针孔在施主晶片的剥离表面处留下柱的粗糙度，并且斜边缘可能留下边缘粗糙，其不能脱落。为了制备供体晶片的表面以便重新使用，机械研磨去除了柱和边缘粗糙度以及最小的附加厚度。在清洁之后，在表面处生长和除去氧化物层留下剩余的峰。平滑的表面很好地适应于接合元件的粘合和新的层的剥离。可以从薄片制造各种装置，例如光伏电池。

3. 发明授权

US07839722B2 Microfabricated acoustic transducer with a multilayer electrode 有权
标题翻译：具有多层电极的微型声学换能器
公开(公告)号：US07839722B2
公开(公告)日：2010-11-23
申请号：US11903329
申请日：2007-09-20
申请人： Paul A. Wagner , Igal Ladabaum , Kathy J. Jackson
发明人： Paul A. Wagner , Igal Ladabaum , Kathy J. Jackson
IPC分类号： H04R19/00
CPC分类号： B81B3/0021 , B06B1/0292 , B81B2201/0257 , Y10T29/43 , Y10T29/49005
摘要： In a capacitive membrane ultrasound transducer, one or more electrodes include multiple layers of conductive or semiconductive material. The layers may be positioned adjacent an insulator or cavity in an arrangement to reduce electrical degradation. For example, a conductive layer with less work function and less resistivity is spaced from an insulator by a conductive layer with more work function and more resistivity. The different layers of electrode material may provide for less electrical degradation due to the type of material used and relative location.
摘要翻译：在电容膜超声换能器中，一个或多个电极包括多层导电或半导体材料。层可以在布置中邻近绝缘体或空腔定位以减少电气劣化。例如，具有较小功函数和较小电阻率的导电层通过具有更多功函数和更大电阻率的导电层与绝缘体隔开。电极材料的不同层可以由于所用材料的类型和相对位置而提供更少的电气降解。

4. 发明申请

US20120220068A1 Method to Form a Device by Constructing a Support Element on a Thin Semiconductor Lamina 失效
标题翻译：通过在薄型半导体层上构造支撑元件来形成器件的方法
公开(公告)号：US20120220068A1
公开(公告)日：2012-08-30
申请号：US13450414
申请日：2012-04-18
申请人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
发明人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
IPC分类号： H01L31/0376 , H01L31/18
CPC分类号： H01L31/1892 , H01L31/0747 , H01L31/1864 , Y02E10/50
摘要： A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved.Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal.
摘要翻译：描述了半导体组件，其中在半导体层的表面上构造支撑元件。形成厚度约为50微米或更小的薄层之后，例如通过镀覆或通过施加前体和原位固化来形成支撑元件，得到支撑元件，其可以用于例如，金属，陶瓷，聚合物等。这与预先形成的支撑元件形成对比，该预制形成的支撑元件在其形成之后固定到层板上，或者与施加器晶片相接触，该晶片随后被切割。原位制造支撑元件可以避免使用粘合剂将薄片附着到永久支撑元件上。在一些实施例中，该工艺流程允许薄层在高温下退火，然后在该退火之后具有在层的每个表面上形成的非晶硅层。

5. 发明授权

US08173452B1 Method to form a device by constructing a support element on a thin semiconductor lamina 有权
标题翻译：通过在薄半导体层上构造支撑元件来形成器件的方法
公开(公告)号：US08173452B1
公开(公告)日：2012-05-08
申请号：US12980424
申请日：2010-12-29
申请人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
发明人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
IPC分类号： H01L21/00
CPC分类号： H01L31/1892 , H01L31/0747 , H01L31/1864 , Y02E10/50
摘要： A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to a rigid or semi-rigid pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved. Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element; such adhesives may be unable to tolerate processing temperatures and conditions required to complete the device. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal. A device may be formed which comprises the lamina, such as a photovoltaic cell.
摘要翻译：描述了半导体组件，其中在半导体层的表面上构造支撑元件。形成厚度约为50微米或更小的薄层之后，例如通过镀覆或通过施加前体和原位固化来形成支撑元件，得到支撑元件，其可以用于例如，金属，陶瓷，聚合物等。这与刚性或半刚性的预成形支撑元件形成对比，该刚性或半刚性的预成型支撑元件在其形成之后固定到层板上，或者与施加器晶片相接触，其中层板随后被切割。原位制造支撑元件可以避免使用粘合剂将薄片附着到永久支撑元件上; 这种粘合剂可能不能容忍完成装置所需的加工温度和条件。在一些实施例中，该工艺流程允许薄层在高温下退火，然后在该退火之后具有在层的每个表面上形成的非晶硅层。可以形成包括层的器件，例如光伏电池。

6. 发明授权

US06594870B1 Panel fastener 失效
标题翻译：面板紧固件
公开(公告)号：US06594870B1
公开(公告)日：2003-07-22
申请号：US09767179
申请日：2001-01-22
申请人： Martin Lambrecht , Andrew Johnston , Kathy J. Jackson , Nicholas Jackson, Jr. , Shawn E. Roberts
发明人： Martin Lambrecht , Andrew Johnston , Kathy J. Jackson , Nicholas Jackson, Jr. , Shawn E. Roberts
IPC分类号： F16B2100
CPC分类号： F16B5/0628 , B60R13/0206 , F16B21/09 , Y10T24/309 , Y10T24/42 , Y10T24/44026
摘要： A fastener for coupling a trim panel to a support member includes a mounting grommet with a funnel-shaped receiver communicating with an aperture for receiving one end of a fastener pin having a plurality of spaced annular ratcheting grooves formed thereon. The opposite or second end of the pin includes a pointed end with a pair of resilient locking arms, which extend divergently outwardly and away from an apex of the second end of the pin at an acute angle and at a spacing of about 180°, for insertion into an aperture of a support structure. Interposed between the first and second ends of the fastening pin is a resilient, generally cup-shaped seal which engages a surface of the support structure opposite the locking arms for providing a seal surrounding the aperture in the support structure to which the fastening pin is inserted. The grommet includes an annular slot defined by a collar on one side and a shoulder of the funnel-shaped receiver on the other. The shoulder includes an outwardly extending, resilient, annular flange cooperating with the support structure secured to the trim panel for centering the grommet. A trim panel includes a support socket including a slotted aperture for receiving the shoulder of the grommet and a pair of resilient locking arms which extend to one edge of the aperture for engaging the edge of the collar of the grommet when inserted into the support socket to lock the grommet in place while allowing a slight lateral adjustment for final alignment.
摘要翻译：用于将装饰板连接到支撑构件的紧固件包括具有漏斗形接收器的安装索环，所述漏斗形接收器与用于接收形成有多个间隔开的环形棘轮槽的紧固销的一端的孔连通。销的相对或第二端包括具有一对弹性锁定臂的尖端，其以锐角和约180°的间隔从销的第二端的顶点向外并远离销的顶点延伸，用于插入到支撑结构的孔中。紧固销的第一和第二端之间的弹性的大致为杯形的密封件，其与支撑结构的与锁定臂相对的表面接合，以提供围绕固定销插入的支撑结构中的孔的密封。索环包括由一侧上的套环和另一个漏斗形接收器的肩部限定的环形槽。肩部包括向外延伸的，弹性的环形凸缘，其与固定到装饰板上的支撑结构配合，用于使索环居中。装饰板包括支撑插座，其包括用于接收护环的肩部的开槽孔和一对延伸到孔的一个边缘的弹性锁定臂，用于当插入到支撑插座中时接合护环的环的边缘将护环锁定在适当位置，同时允许轻微的侧向调整以进行最终对准。

7. 发明授权

US06200882B1 Method for processing a plurality of micro-machined mirror assemblies 失效
标题翻译：用于处理多个微加工镜组件的方法
公开(公告)号：US06200882B1
公开(公告)日：2001-03-13
申请号：US09191502
申请日：1998-11-13
申请人： Joseph D. Drake , John H. Jerman , Kathy J. Jackson
发明人： Joseph D. Drake , John H. Jerman , Kathy J. Jackson
IPC分类号： H01L2146
CPC分类号： G11B7/22 , B82Y30/00 , G02B26/0816 , G11B7/08564 , G11B11/10554 , G11B11/10576 , G11B11/1058
摘要： A method for processing a plurality of mirror assemblies formed together from a silicon wafer. The method includes the steps of exposing the mirror assemblies to an acid release etch to produce released mirror assemblies and rinsing the released mirror assemblies to produce washed mirror assemblies. The washed mirror assemblies are dried to produce dried mirror assemblies and the dried mirror assemblies are mounted onto a mounting tape to produce mounted mirror assemblies. The mounted mirror assemblies are diced or scribed to produce a plurality of separated mirror assemblies, which are separated from the mounting tape so as to produce a plurality of discrete mirror assemblies.
摘要翻译：一种用于处理从硅晶片一起形成的多个反射镜组件的方法。该方法包括以下步骤：将反射镜组件暴露于酸释放蚀刻以产生释放的反射镜组件并漂洗释放的反射镜组件以产生洗涤的反射镜组件。洗涤的镜组件被干燥以产生干镜组件，并且将干镜组件安装到安装带上以产生安装的镜组件。安装的反射镜组件被切割或刻划以产生多个分离的反射镜组件，它们与安装带分离，以便产生多个分立的反射镜组件。

8. 发明授权

US08101451B1 Method to form a device including an annealed lamina and having amorphous silicon on opposing faces 有权
标题翻译：形成包括退火薄片并在相对面上具有非晶硅的器件的方法
公开(公告)号：US08101451B1
公开(公告)日：2012-01-24
申请号：US12980427
申请日：2010-12-29
申请人： Venkatesan Murali , Christopher J Petti , Theodore Smick , Mohamed M Hilali , Kathy J Jackson , Zhiyong Li , Gopalakrishna Prabhu
发明人： Venkatesan Murali , Christopher J Petti , Theodore Smick , Mohamed M Hilali , Kathy J Jackson , Zhiyong Li , Gopalakrishna Prabhu
IPC分类号： H01L21/00 , H01L31/00
CPC分类号： H01L21/187 , H01L31/072 , H01L31/0747 , H01L31/075 , H01L31/1824 , H01L31/1892 , H01L31/202 , Y02E10/545 , Y02E10/548
摘要： A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to a rigid or semi-rigid pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved. Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element; such adhesives may be unable to tolerate processing temperatures and conditions required to complete the device. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal. A device may be formed which comprises the lamina, such as a photovoltaic cell.
摘要翻译：描述了半导体组件，其中在半导体层的表面上构造支撑元件。形成厚度约为50微米或更小的薄层之后，例如通过镀覆或通过施加前体和原位固化来形成支撑元件，得到支撑元件，其可以用于例如，金属，陶瓷，聚合物等。这与刚性或半刚性的预成形支撑元件形成对比，该刚性或半刚性的预成型支撑元件在其形成之后固定到层板上，或者与施加器晶片相接触，其中层板随后被切割。原位制造支撑元件可以避免使用粘合剂将薄片附着到永久支撑元件上; 这种粘合剂可能不能容忍完成装置所需的加工温度和条件。在一些实施例中，该工艺流程允许薄层在高温下退火，然后在该退火之后具有在层的每个表面上形成的非晶硅层。可以形成包括层的器件，例如光伏电池。

9. 发明申请

US20100330731A1 METHOD TO FORM A THIN SEMICONDUCTOR LAMINA ADHERED TO A FLEXIBLE SUBSTRATE 审中-公开
标题翻译：形成附着于柔性基板的薄的半导体层的方法
公开(公告)号：US20100330731A1
公开(公告)日：2010-12-30
申请号：US12493195
申请日：2009-06-27
申请人： Aditya Agarwal , Kathy J. Jackson
发明人： Aditya Agarwal , Kathy J. Jackson
IPC分类号： H01L31/18 , H01L21/30
CPC分类号： H01L31/03921 , H01L31/02008 , H01L31/0236 , H01L31/028 , H01L31/0296 , H01L31/0304 , H01L31/03682 , H01L31/03685 , H01L31/03687 , H01L31/03762 , H01L31/056 , H01L31/075 , H01L31/1804 , H01L31/1896 , H01L31/202 , Y02E10/52 , Y02E10/544 , Y02E10/545 , Y02E10/546 , Y02E10/547 , Y02E10/548
摘要： A semiconductor donor body such as a wafer is implanted with ions to form a cleave plane. The donor wafer is affixed to a polyimide receiver element, for example by applying polyimide in liquid form to the donor wafer, then curing, or by affixing the donor wafer to a preformed polyimide sheet. Annealing causes a lamina to cleave from the donor wafer at the cleave plane. The resulting adhered lamina and polyimide body are not adhered to another rigid substrate and can be jointly flexed.
摘要翻译：用离子注入诸如晶片的半导体施主体以形成解理面。施主晶片固定到聚酰亚胺接收元件上，例如通过将液晶形式的聚酰亚胺施加到施主晶片，然后固化，或通过将施主晶片固定到预成型的聚酰亚胺片上。退火会导致薄层在分裂面上从施主晶片上裂开。所产生的粘附层和聚酰亚胺体不粘附到另一刚性基底上并且可以共同弯曲。

10. 发明授权

US08518724B2 Method to form a device by constructing a support element on a thin semiconductor lamina 失效
标题翻译：通过在薄半导体层上构造支撑元件来形成器件的方法
公开(公告)号：US08518724B2
公开(公告)日：2013-08-27
申请号：US13450414
申请日：2012-04-18
申请人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
发明人： Christopher J. Petti , Mohamed M. Hilali , Theodore Smick , Venkatesan Murali , Kathy J. Jackson , Zhiyong Li , Gopalakrishna Prabhu
IPC分类号： H01L21/00 , H01L31/00
CPC分类号： H01L31/1892 , H01L31/0747 , H01L31/1864 , Y02E10/50
摘要： A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved.Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal.
摘要翻译：描述了半导体组件，其中在半导体层的表面上构造支撑元件。形成厚度约为50微米或更小的薄层之后，例如通过镀覆或通过施加前体和原位固化来形成支撑元件，得到支撑元件，其可以用于例如，金属，陶瓷，聚合物等。这与预先形成的支撑元件形成对比，该预制形成的支撑元件在其形成之后固定到层板上，或者与施加器晶片相接触，该晶片随后被切割。原位制造支撑元件可以避免使用粘合剂将薄片附着到永久支撑元件上。在一些实施例中，该工艺流程允许薄层在高温下退火，然后在该退火之后具有在层的每个表面上形成的非晶硅层。

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