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    • 2. 发明授权
    • Bonding method and adhesive useful for the method
    • US4950701A
    • 1990-08-21
    • US229458
    • 1988-08-08
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • C08L35/04C08L83/04C09J5/04
    • C09J5/04C08L35/04C08L83/04C09J2483/00
    • A method for bonding two objects by means of the following two adhesives:(A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound of the formula: ##STR1## wherein R is an alkyl group having from 1 to 16 carbon atoms, an alkoxyalkyl group having 2 to 16 carbon atoms, a haloalkyl group having from 1 to 16 carbon atoms, a cyanoalkyl group having from 2 to 16 carbon atoms, an aralkyl group having from 6 to 12 atoms, an acyloxyalkyl group having from 2 to 16 carbon atoms, a cycloalkyl group having from 3 to 16 carbon atoms, an alkenyl group having from 2 to 16 carbon atoms or an aryl group having from 6 to 12 carbon atoms, and a 1,1-disubstituted diene compound of the formula: ##STR2## wherein each of R.sup.1 and R.sup.2 which may be the same or different, is a hydrogen atom, an alkyl group having from 1 to 5 carbon atoms, an aryl group, an aralkyl group having from 6 to 12 carbon atoms or a halogen atom, R.sup.3 is a hydrogen atom or a methyl group, each of X and Y which may be the same or different, is a cyano group, a carboxylic acid ester group having from 2 to 12 carbon atoms, an ethylsulfone group, a phenylsulfone group, a formyl group, an acetyl group, a benzoyl group, an amide group, a diethyl sulfonyl group, or a phenyl group; and(B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
    • 5. 发明授权
    • Bonding method and adhesive useful for the method
    • 粘合方法和粘合剂对该方法有用
    • US4793886A
    • 1988-12-27
    • US69187
    • 1987-07-02
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • Naomi OkamuraHiroshi AokiJunzo MakinoHajime YagiYasuo AraiTakashi Yamanaka
    • C08L35/04C08L83/04C09J5/04C09J5/02
    • C09J5/04C08L35/04C08L83/04C09J2483/00Y10T428/31536
    • A method for bonding two objects by means of the following two adhesives:(A) a moisture-inducible room temperature anion polymerization curing adhesive composed essentially of at least one anion polymerizable compound selected from the group consisting of an .alpha.-cyanoacrylate compound, and a 1,1-disubstituted diene compound;and(B) a room temperature self-curing adhesive containing from 0.05 to 50% by weight of an anion polymerization accelerator, said self-curing adhesive being selected from the group consisting of (1) a room temperature moisture-curing adhesive, (2) a room temperature curing two-part type epoxy resin adhesive, and (3) a room temperature curing synthetic resin aqueous emulsion adhesive, which comprises applying said two adhesives (A) and (B) at the bonding interface of the objects so that they do not contact each other and pressing the objects to each other to bring the two adhesives in contact with each other.
    • 一种通过以下两种粘合剂粘结两个物体的方法:(A)一种水分诱导型室温阴离子聚合固化粘合剂,其基本上由至少一种选自由α-氰基丙烯酸酯化合物组成的组的阴离子可聚合化合物和 1,1-二取代二烯化合物; 和(B)含有0.05〜50重量%阴离子聚合促进剂的室温自固化粘合剂,所述自固化粘合剂选自(1)室温湿固化粘合剂,(2) )室温固化二部分型环氧树脂粘合剂,和(3)室温固化合成树脂水乳液粘合剂,其包括在物体的粘合界面处施加所述两种粘合剂(A)和(B),使得它们 不要彼此接触并且彼此按压物体以使两个粘合剂彼此接触。