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    • 7. 发明授权
    • Cooling device capable of contacting target with smaller urging force
    • 能够以较小的推动力接触目标的冷却装置
    • US06618251B2
    • 2003-09-09
    • US10073005
    • 2002-02-12
    • Junichi Ishimine
    • Junichi Ishimine
    • H05H720
    • H01L23/42H01L23/373H01L2224/16H01L2224/73253H01L2924/01046
    • A heat conductive fluid is interposed between an electronic component and a heat sink. The heat conductive fluid serves to enhance the contact between the surface of the electronic component and the opposed surface of the heat sink. The heat conductive fluid also exhibits the property of adsorption between a pair of surfaces based on the fluidity of the heat conductive fluid itself. Although the adsorption allows the slippage of the heat sink along the surface of the electronic component, the adsorption reliably restrains the heat sink from moving in the perpendicular direction perpendicular to the surface of the electronic component. The atmospheric pressure solely acts on the heat sink so as to urge the heat sink against the surface of the electronic component. No excessive urging force is applied to the electronic component. Since the slippage of the heat sink is restrained, the heat conductive fluid can be maintained enough between the heat sink and the electronic component over an enough extent, irrespective of inclination of the surface or vibration of the electronic component. The heat conductive fluid keeps the adsorption acting between the surface of the electronic component and the opposed surface of the heat sink.
    • 导电流体介于电子部件和散热器之间。 导热流体用于增强电子部件的表面与散热器的相对表面之间的接触。 基于导热流体本身的流动性,导热流体还表现出一对表面之间的吸附性能。 尽管吸附允许散热器沿着电子部件的表面滑动,但吸附可靠地限制散热器沿垂直于电子部件表面的垂直方向移动。 大气压力仅作用于散热器,以便将散热器推向电子部件的表面。 电子部件不施加过大的推压力。 由于抑制了散热器的滑动,所以不管表面的倾斜或电子部件的振动如何,热传导流体可以在散热器和电子部件之间足够大的程度保持足够的程度。 导热流体保持吸附作用在电子部件的表面和散热片的相对表面之间。