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    • 2. 发明授权
    • Light source device for laser beam printer
    • 激光束打印机光源装置
    • US06711198B1
    • 2004-03-23
    • US09549552
    • 2000-04-14
    • Jun IchiharaHisayoshi KitajimaTetsuhiro TanabeKen NakaharaHaruo Tanaka
    • Jun IchiharaHisayoshi KitajimaTetsuhiro TanabeKen NakaharaHaruo Tanaka
    • H01S500
    • H01S5/2231H01S5/06216H01S5/221H01S5/2219
    • A light source device for a laser beam printer in which a semiconductor laser is driven with a pulse current having a minimum pulse width at the ON time on the order of milliseconds or less is provided, wherein the semiconductor laser is formed so that either the rate of change at the rise portion of the pulse current becomes ±8% or less or the semiconductor laser is excited in a multiple mode in the vicinity of the threshold value of the oscillation, and the semiconductor laser oscillates in a single mode at a current separated from the threshold value, by adjusting of at least one of the width w of a stripe groove (7a) of the current block layer, the composition of clad layers (5), the distance d between the current block layer (7) and the active layer (4), the composition of the current block layer (7) and the formation of a light absorption layer into the current block layer (7). As a consequence, in the case where the light source device for the laser beam printer is driven with a short drive pulse on the order of several hundred micro seconds, the light source device becomes such that a transient phenomenon is not generated at the time of the rise of the pulse and a stable light output can be obtained.
    • 提供了一种激光束打印机的光源装置,其中半导体激光器以在几毫秒或更小的导通时间具有最小脉冲宽度的脉冲电流驱动,其中半导体激光器形成为使得速率 在脉冲电流的上升部分的变化量为±8%以下,或者半导体激光器在振荡阈值附近的多模式下被激发,半导体激光器以单一模式以分流的方式振荡 从阈值,通过调整当前阻挡层的条纹槽(7a)的宽度w,包层(5)的组成中的至少一个,当前阻挡层(7)和 有源层(4),当前阻挡层(7)的组成和在当前阻挡层(7)中形成光吸收层。 结果,在激光束打印机的光源装置以数百微秒的短驱动脉冲驱动的情况下,光源装置变为使得在不能产生瞬时现象的情况下 可以获得脉冲的上升和稳定的光输出。
    • 3. 发明授权
    • Method of manufacturing semiconductor laser
    • 制造半导体激光器的方法
    • US5814532A
    • 1998-09-29
    • US848677
    • 1997-04-29
    • Jun Ichihara
    • Jun Ichihara
    • H01L21/301H01S5/00H01S5/02H01L21/00
    • H01S5/0201H01S5/0202
    • Disclosed is a method of manufacturing a semiconductor laser. A wafer having a substrate having a semiconductor layer including a light-emitting forming portion epitaxially grown on a surface of the substrate is broken into laser chips having a light-emitting surface at an end face thereof. When breaking the wafer into the chips, the breaking at the light-emitting surface is carried out by first forming street grooves in the substrate and thereafter cleaving the light-emitting layer forming portion. By doing so, there is no necessity of thinning the substrate to a required extent, facilitating handling during the manufacture process. A roughened surface of the street groove is provided in the substrate underlying the light-emitting layer forming portion, which is convenient for irregular reflection of a return light beam often encountered in an optical disc pickup device.
    • 公开了半导体激光器的制造方法。 具有包含在基板表面外延生长的发光形成部的半导体层的基板的晶片被破碎成在其端面具有发光面的激光芯片。 当将晶片破碎成芯片时,通过首先在衬底中形成街道沟槽,然后分解发光层形成部分,来实现在发光表面处的断裂。 通过这样做,不需要将基板变薄到所需的程度,便于在制造过程中的处理。 在发光层形成部分下方的基板中设置有一个粗糙表面,这样便于在光盘拾取装置中经常遇到的返回光束的不规则反射。
    • 4. 发明授权
    • Surface light emitting type semiconductor laser having a vertical cavity
    • 具有垂直腔的表面发光型半导体激光器
    • US06856635B2
    • 2005-02-15
    • US10274950
    • 2002-10-22
    • Hironobu SaiJun Ichihara
    • Hironobu SaiJun Ichihara
    • G11B7/125H01S5/022H01S5/042H01S5/183H01S5/00
    • H01S5/18311H01S5/02248H01S5/02296H01S5/0683
    • A lower multilayer reflection film (2), a light emitting layer forming portion (6) and an upper multilayer reflection film (8) are sequentially formed on a substrate (1) to form a semiconductor laminated portion (9), and a current injection region A is formed at a part of the semiconductor laminated portion so as to emit light from the surface in the center thereof. And, according to the present invention, the current injection region A is formed so as to be deflected from a center of the substrate. As a result, there is provided a surface light emitting type semiconductor laser capable of monitoring a light emitting power correctly and controlling it automatically in order to achieve the constant light emitting power in a case where the surface light emitting type laser chip is used as a light source for a pickup or the like.
    • 在基板(1)上依次形成下层多层反射膜(2),发光层形成部(6)和上层多层反射膜(8),形成半导体层叠部(9),电流注入 区域A形成在半导体层叠部分的一部分处以从其中心的表面发射光。 并且,根据本发明,电流注入区域A形成为从衬底的中心偏转。 结果,提供了一种表面发光型半导体激光器,其能够正确地监视发光功率并自动地进行控制,以便在使用表面发光型激光芯片作为其的情况下实现恒定的发光功率 用于拾取器的光源等。
    • 8. 发明授权
    • Optical connector employing an optical fiber connector plug
    • 光连接器采用光纤连接器插头
    • US06247851B1
    • 2001-06-19
    • US09433472
    • 1999-11-04
    • Jun Ichihara
    • Jun Ichihara
    • G02B638
    • G02B6/4292G02B6/3825G02B6/3893G02B6/421
    • An optical connector includes an elongate housing. A partition wall is formed integral with and within the housing. The partition wall is formed with a sleeve holder and an elongate hole. When an engagement member is inserted into the housing, its leg is inserted through the elongate hole. An optical module is accommodated in a case by a spring member, and the case is in turn inserted in the housing. A split sleeve of the optical module is inserted in the sleeve holder, and the engaging member is held by the partition wall and the case. When an optical fiber connector plug is inserted in the housing, a ferrule is inserted into the sleeve and coupled to a rod lens of the optical module.
    • 光学连接器包括细长壳体。 分隔壁与壳体内部和内部形成一体。 分隔壁形成有套筒保持器和细长孔。 当接合构件插入到壳体中时,其腿部通过细长孔插入。 光学模块通过弹簧构件容纳在壳体中,并且壳体又插入壳体中。 光学模块的开口套筒插入套筒保持器中,并且接合构件由分隔壁和壳体保持。 当光纤连接器插头插入壳体中时,将套圈插入套管中并与光学模块的棒状透镜耦合。
    • 10. 发明授权
    • Optical module and method for manufacturing the same
    • 光模块及其制造方法
    • US07376312B2
    • 2008-05-20
    • US10700457
    • 2003-11-05
    • Shuichi NawaeJun Ichihara
    • Shuichi NawaeJun Ichihara
    • G02B6/30
    • G02B6/4239G02B6/4238
    • An optical element and an optical transmission member are fixedly secured onto a substrate so as to be coupled to each other. In this substrate, a through hole is formed between an optical element secured portion and an optical transmission member secured portion. In an attempt to assemble these optical transmission member and optical element so as to make the coupling at an optimal position, first, the position of the optical transmission member is adjusted to an optimal position, and after measuring the position by a laser micrometer, the optical transmission member is fixedly secured thereto by using a soldering material. Thus, measurements are again carried out by the laser micrometer to detect an amount of deviation from the measured value before the securing process, and the secured portion is again fused so that the optical transmission member is shifted based on the amount of deviation, and again fixedly secured thereon.
    • 将光学元件和光学传输构件固定地固定到基板上以便彼此耦合。 在该基板中,在光学元件固定部和光传输元件固定部之间形成通孔。 为了组装这些光传输部件和光学元件以使耦合处于最佳位置,首先将光传输部件的位置调节到最佳位置,并且在用激光测微计测量位置之后, 光传输构件通过使用焊接材料固定地固定到其上。 因此,通过激光测微计再次进行测量,以检测在固定过程之前与测量值的偏差量,并且再次熔化固定部分,使得光传输部件基于偏差量而偏移,并且再次 固定在其上。