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    • 3. 发明授权
    • Preparation of polyaryleneetherketones
    • 聚乙二醇的制备
    • US5081215A
    • 1992-01-14
    • US393793
    • 1989-08-15
    • Juergen KochWolfgang StegmaierGerhard Heinz
    • Juergen KochWolfgang StegmaierGerhard Heinz
    • C08G65/40C08G61/12
    • C08G61/127
    • Polyaryleneetherketones are prepared by a quasicontinuous process, by Friedel-Crafts polycondensation of a reaction mixture containingA. a monomer system of(a)(1) an aromatic dicarboxylic acid chloride or phosgene and(2) a polynuclear aromatic having two exchangeable hydrogen atoms and/or(b) a polynuclear aromatic carboxylic acid chloride having one exchangeable hydrogen atom,B. a Lewis acid,C. if necessary, a Lewis base andD. an inert solvent.The reaction mixture is subjected to polycondensation in a first zone, with stirring, to a viscosity of not more than 2,000 mPa.s, then conveyed through a second, vertical, unstirred zone with plug flow by means of gas pressure, where the polycondensation is completed, and is finally discharged continuously.
    • 聚芳醚醚通过准连续法制备,通过Frieder-Crafts缩聚反应混合物,该反应混合物含有(a)(1)芳族二羧酰氯或光气的单体体系,和(2)具有两个可交换氢原子的多核芳烃和 /或(b)具有一个可交换氢原子的多核芳族羧酰氯,B.路易斯酸,C.如果需要,路易斯碱和D.惰性溶剂。 反应混合物在搅拌下在第一区域进行缩聚,粘度不大于2,000mPa.s,然后通过气体压力通过气流压力输送通过第二垂直的未搅拌区域,其中缩聚反应 完成,终于不停地出院。
    • 7. 发明授权
    • Stabilized polyaryl ether ketone molding compositions
    • 稳定的聚芳醚酮模塑组合物
    • US5334642A
    • 1994-08-02
    • US998730
    • 1992-12-30
    • Juergen KochGerhard Heinz
    • Juergen KochGerhard Heinz
    • C08K5/34C08K5/00C08K7/02C08L71/08C08L71/10C08K5/45C08K5/48
    • C08K5/005
    • Stabilized polyaryl ether ketone molding compositions containing as essential componentsA) from 50 to 99.99% by weight of a polyaryl ether ketone prepared by electrophilic polycondensation and composed to an extent of not less than 50 mol % of units of the formula I' ##STR1## where s and t are each 0, 1, 2 or 3, T and T' are each --O-- or --CO-- and Ar is meta-phenylene, paraphenylene or two aromatic rings linked to each other in the meta or para position by a chemical bond, or the ring-substituted C.sub.1 -C.sub.8 -alkyl, C.sub.6 -C.sub.20 -aryl or halogen derivatives thereof,B) from 0.01 to 4% by weight of at least one organic compound which has a base constant pk.sub.b within the range from 2 to 12 and a boiling point of higher than 300.degree. C.,C) from 0 to 50% by weight of a further thermoplastic other than A), andD) from 0 to 45% by weight of fibrous or particulate fillers or mixtures thereof.
    • 含有作为基本成分的稳定化的聚芳基醚酮成型组合物A)50〜99.99重量%的通过亲电缩聚反应制备的聚芳基醚酮,其量为不低于50摩尔%的式I'单元, 其中s和t各自为0,1,2或3,T和T'各自为-O-或-CO-,Ar为间位亚苯基,对亚苯基或两个在间位或对位相互连接的芳环, 化学键或环取代的C 1 -C 8 - 烷基,C 6 -C 20 - 芳基或其卤素衍生物,B)0.01至4重量%的至少一种有机化合物,其碱值常数pkb在 2至12,沸点高于300℃,C)0至50重量%的除A)以外的其它热塑性塑料,D)0至45重量%的纤维或颗粒填料或混合物 其中。
    • 10. 发明授权
    • Stabilized polyaryl ether ketone molding compositions
    • 稳定的聚醚醚酮模塑组合物
    • US5208278A
    • 1993-05-04
    • US677336
    • 1991-03-29
    • Juergen KochGerhard Heinz
    • Juergen KochGerhard Heinz
    • C08K5/34C08K5/00C08K7/02C08L71/08C08L71/10
    • C08K5/005
    • Stabilized polyaryl ether ketone molding compositions containing as essential componentsA) from 50 to 99.99% by weight of a polyaryl ether ketone prepared by electrophilic polycondensation and composed to an extent of not less than 50 mol % of units of the formula I' ##STR1## where s and t are each 0, 1, 2 or 3, T and T' are each --0-- or --CO-- and Ar is meta-phenylene, paraphenylene or two aromatic rings linked to each other in the meta or para position by a chemical bond, or the ring-substituted C.sub.1 -C.sub.8 -alkyl, C.sub.6 -C.sub.20 -aryl or halogen derivatives thereof,B) from 0.01 to 4% by weight of at least one organic compound which has a base constant pk.sub.b within the range from 2 to 12 and a boiling point of higher than 300.degree. C.,C) from 0 to 50% by weight of a further thermoplastic other than A), andD) from 0 to 45% by weight of fibrous or particulate fillers or mixtures thereof.
    • 含有作为基本成分的稳定化的聚芳基醚酮成型组合物A)50〜99.99重量%的通过亲电缩聚反应制备的聚芳基醚酮,其量为不低于50摩尔%的式I'单元, I'其中s和t各自为0,1,2或3,T和T'各自为-O-或-CO-,Ar为间亚苯基,对亚苯基或两个在元或对位中彼此连接的芳环。 或其环取代的C 1 -C 8 - 烷基,C 6 -C 20 - 芳基或其卤素衍生物,B)0.01至4重量%的至少一种有机化合物,所述有机化合物在 范围为2至12,沸点高于300℃,C)0至50重量%的除A)之外的另外的热塑性塑料,D)0至45重量%的纤维或颗粒填料 或其混合物。