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1. 发明授权

US6146918A Method of fabricating a semiconductor package 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US6146918A
公开(公告)日：2000-11-14
申请号：US195996
申请日：1998-11-20
申请人： Ju-Hwa Lee
发明人： Ju-Hwa Lee
IPC分类号： H01L23/12 , H01L23/13 , H01L23/495 , H01L23/498 , H01L23/50 , H01L21/44
CPC分类号： H01L23/49805 , H01L23/13 , H01L23/4951 , H01L2224/05599 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/181
摘要： A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.
摘要翻译：一种半导体封装，包括：半导体封装基板，具有框架型绝缘体，该框型绝缘体在基板的中心部分具有穿透部分，以及暴露于绝缘体的上表面和下表面的多个引线棒，半切割器封装基板上的半导体芯片，半导体芯片的上表面附接到引线条，半导体芯片的上表面的中心部分上的多个焊盘，分别将焊盘与引线条的上表面连接的多条焊丝，以及上盖保护电线，焊盘和半导体芯片的上表面。

2. 发明授权

US08508850B2 Multi-layered light diffusion plate and liquid crystal display device comprising the same 有权
标题翻译：多层光漫射板和包括其的液晶显示装置
公开(公告)号：US08508850B2
公开(公告)日：2013-08-13
申请号：US12084223
申请日：2007-04-13
申请人： Hyun-Seok Yang , Bong-Keun Lee , Seo-Hwa Kim , Jae-Chan Park , Ju-Hwa Lee
发明人： Hyun-Seok Yang , Bong-Keun Lee , Seo-Hwa Kim , Jae-Chan Park , Ju-Hwa Lee
IPC分类号： G02B13/20 , G02B5/02
CPC分类号： G02F1/133606 , G02B5/02 , G02B5/0242 , G02B5/0268 , G02B5/0278 , G02B13/20
摘要： Disclosed herein is a multi-layered light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.
摘要翻译：本发明公开了一种多层光漫射板，其中通过共挤出包含非晶形透明热塑性树脂的透明层和包含非晶态透明热塑性树脂和透明颗粒的光扩散层制造多层光扩散板，使得其制造工艺简单有效，并且具有优异的透光率和光扩散性，高亮度和高亮度均匀性，从而改善视角特性，以及包括该光学透镜的液晶显示装置。

3. 发明授权

US06525411B1 Semiconductor package and method of fabricating the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US06525411B1
公开(公告)日：2003-02-25
申请号：US09661440
申请日：2000-09-13
申请人： Ju-Hwa Lee
发明人： Ju-Hwa Lee
IPC分类号： H01L2302
CPC分类号： H01L23/49805 , H01L23/13 , H01L23/4951 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.
摘要翻译：一种半导体封装，包括：半导体封装基板，具有框架型绝缘体，该框型绝缘体在基板的中心部分具有穿透部分，以及暴露于绝缘体的上表面和下表面的多个引线棒，半切割器封装基板上的半导体芯片，半导体芯片的上表面附接到引线条，半导体芯片的上表面的中心部分上的多个焊盘，分别将焊盘与引线条的上表面连接的多条焊丝，以及上盖保护电线，焊盘和半导体芯片的上表面。

4. 发明授权

US06201294B1 Ball grid array semiconductor package comprised of two lead frames 失效
标题翻译：球栅阵列半导体封装由两个引线框组成
公开(公告)号：US06201294B1
公开(公告)日：2001-03-13
申请号：US08985959
申请日：1997-12-05
申请人： Ju-Hwa Lee
发明人： Ju-Hwa Lee
IPC分类号： H01L2348
CPC分类号： H01L23/49537 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A ball grid array (BGA) semiconductor package includes a paddle, a semiconductor chip on the paddle, a plurality of first leads around a periphery of the paddle, a plurality of second leads attached to a lower surface of each of the first leads, a plurality of conductive wires electrically connecting the semiconductor chip and the first leads, a molding unit sealing the paddle, the semiconductor chip, the first leads, the second leads, and the conductive wires, except for a lower portion of the second leads, and a plurality of solder balls attached to the lower portion of the second leads. A method of fabricating a ball grid array (BGA) semiconductor package having first and second frames includes the steps of attaching a semiconductor chip to a paddle located on the first frame, electrically connecting a plurality of first leads to the semiconductor chip, electrically connecting a plurality of second leads to the plurality of first leads, aligning a first junction unit of the first frame with a second junction unit of the second frame, attaching the first frame to the second frame, molding the first and second frames, and attaching a plurality of solder balls to each of the plurality of second leads.
摘要翻译：球栅阵列（BGA）半导体封装包括桨，桨上的半导体芯片，围绕桨的周边的多个第一引线，附接到每个第一引线的下表面的多个第二引线，电连接半导体芯片和第一引线的多个导线，除了第二引线的下部以外的密封桨，半导体芯片，第一引线，第二引线和导线的模制单元，以及多个焊球附接到第二引线的下部。制造具有第一和第二框架的球栅阵列（BGA）半导体封装的方法包括以下步骤：将半导体芯片附接到位于第一框架上的焊盘，将多个第一引线电连接到半导体芯片，电连接多个第二引线到多个第一引线，将第一框架的第一接合单元与第二框架的第二接合单元对准，将第一框架连接到第二框架，模制第一和第二框架，并且附接多个的焊球到多个第二引线中的每一个。

5. 发明授权

US5770888A Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package 失效
标题翻译：集成芯片封装，尺寸减小，引线从封装的顶部和底部暴露
公开(公告)号：US5770888A
公开(公告)日：1998-06-23
申请号：US701949
申请日：1996-08-23
申请人： Chi Jung Song , Ju-Hwa Lee
发明人： Chi Jung Song , Ju-Hwa Lee
IPC分类号： H01L23/28 , H01L23/31 , H01L23/495 , H01L23/50 , H01L23/52 , H01L25/10 , H01L25/11 , H01L25/18 , H01L23/48 , H01L23/02
CPC分类号： H01L23/4951 , H01L23/3107 , H01L23/49551 , H01L25/105 , H01L2224/32014 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2225/1029 , H01L2225/1041 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/181
摘要： An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip, is attached to a portion of the upper surface of the first connection lead. The chip and leads are molded such that the lower surface of the first connection leads and upper surface of the second connection leads are exposed.
摘要翻译：改进的包装更薄，增加了记忆容量和改善的散热效果。该封装包括多个引线，其中每个引线包括第一连接引线和具有上表面和下表面的第二连接引线。诸如半导体芯片的集成芯片附接到第一连接引线的上表面的一部分。芯片和引线被模制成使得第一连接引线的下表面和第二连接引线的上表面露出。

6. 发明申请

US20070123626A1 HEAT RESISTANT LIGHT DIFFUSION BLEND COMPOSITION 审中-公开
标题翻译：耐热光扩散混合组合物
公开(公告)号：US20070123626A1
公开(公告)日：2007-05-31
申请号：US11552314
申请日：2006-10-24
申请人： Seo-hwa KIM , Ju-hwa LEE , Bong-keun LEE , Jae-chan PARK , Hyun-seok YANG
发明人： Seo-hwa KIM , Ju-hwa LEE , Bong-keun LEE , Jae-chan PARK , Hyun-seok YANG
IPC分类号： C08K3/30
CPC分类号： C08L33/12 , C08L35/06 , C08L2666/04
摘要： The present invention relates to a heat resistant light diffusion blend composition, and more precisely, a heat resistant light diffusion blend composition which is composed of a substrate resin prepared by blending styrene-maleic anhydride copolymer resin and polymethylmethacrylate resin and a light-diffusing agent composed of acrylic organic particles with a mean diameter of 1˜20 μm alone or together with silicon organic particles with a mean diameter of 0.5˜20 μm. Therefore, the heat resistant light diffusion blend composition of the present invention not only has high diffusivity and brightness but also excellent heat resistance, dimensional stability and mechanical properties with a low water absorption rate, so that this composition can be effectively used as a light diffusion plate and also be applied to a backlight for LCDs, lighting apparatus, signboards or glass showcases.
摘要翻译：本发明涉及一种耐热光扩散共混组合物，更确切地说，涉及一种耐热光扩散共混组合物，其由通过共混苯乙烯 - 马来酸酐共聚物树脂和聚甲基丙烯酸甲酯树脂制备的基材树脂和由下列物质组成的光扩散剂的平均直径为1〜20μm的丙烯酸有机颗粒，或者与平均直径为0.5〜20μm的硅有机颗粒一起。因此，本发明的耐热光扩散共混组合物不仅具有高扩散性和亮度，而且具有优异的耐热性，尺寸稳定性和低吸水率的机械性能，使得该组合物可以有效地用作光扩散还可用于液晶显示器，照明装置，招牌或玻璃展示柜的背光源。

7. 发明申请

US20090161221A1 Multi-Layered Light Diffusion Plate and Liquid Crystal Display Device Comprising the Same 有权
标题翻译：多层光扩散板和包括其的液晶显示装置
公开(公告)号：US20090161221A1
公开(公告)日：2009-06-25
申请号：US12084223
申请日：2007-04-13
申请人： Hyun-Seok Yang , Bong-Keun Lee , Seo-Hwa Kim , Jae-Chan Park , Ju-Hwa Lee
发明人： Hyun-Seok Yang , Bong-Keun Lee , Seo-Hwa Kim , Jae-Chan Park , Ju-Hwa Lee
IPC分类号： G02B5/02
CPC分类号： G02F1/133606 , G02B5/02 , G02B5/0242 , G02B5/0268 , G02B5/0278 , G02B13/20
摘要： Disclosed herein is a multi-layerd light diffusion plate, in which the multi-layered light diffusion plate is manufactured by coextruding a transparent layer comprising an amorphous transparent thermoplastic resin and a light diffusion layer comprising an amorphous transparent thermoplastic resin and transparent particles, so that the manufacturing process thereof is simple and efficient, and which has excellent light transmissivity and light diffusivity, high brightness, and high brightness uniformity, thereby improving viewing angle characteristics, and to a liquid crystal display device comprising the same.
摘要翻译：本发明公开了一种多层光漫射板，其中通过共挤出包含非晶透明热塑性树脂的透明层和包含非晶透明热塑性树脂和透明颗粒的光扩散层制造多层光扩散板，使得其制造工艺简单有效，并且具有优异的透光率和光扩散性，高亮度和高亮度均匀性，从而改善视角特性，以及包括该光学透镜的液晶显示装置。

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