专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100140239A1 METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES 有权
标题翻译：用于高速，精密微处理设备阵列的方法和系统
公开(公告)号：US20100140239A1
公开(公告)日：2010-06-10
申请号：US12644832
申请日：2009-12-22
申请人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
发明人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
IPC分类号： B23K26/00
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。光束扫描和偏转都用于将光束斑点分布到用于选择性处理的元件阵列的元件。偏转可用固态偏转器进行。

2. 发明授权

US07358157B2 Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby 有权
标题翻译：用于高速精密激光修整的方法和系统，用于其中的扫描透镜系统以及由此产生的电气装置
公开(公告)号：US07358157B2
公开(公告)日：2008-04-15
申请号：US11245282
申请日：2005-10-06
申请人： Bo Gu , Joseph V. Lento , Jonathan S. Ehrmann , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
发明人： Bo Gu , Joseph V. Lento , Jonathan S. Ehrmann , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
IPC分类号： H01L21/00
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/082
摘要： A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
摘要翻译：提供了一种方法，系统和扫描透镜系统，用于高速，基于激光的，精确的激光修剪至少一个电气元件。该方法包括以重复率产生具有一个或多个激光脉冲的脉冲激光输出。每个激光脉冲具有脉冲能量，激光波长范围内的激光波长和脉冲持续时间。所述方法还包括选择性地照射所述至少一个电气元件，所述一个或多个激光脉冲聚焦在沿着方向具有不均匀强度分布的至少一个点和小至约6微米至约15微米的光点直径上以使所述一个或多个激光脉冲从所述至少一个元件中选择性地去除材料，并激光修整所述至少一个元件，同时避免所述至少一个元件内的实质微裂纹。波长足够短以产生小斑点尺寸，紧度公差和高吸收性能所需的短波长益处，但不会如此短，从而导致微裂纹。

3. 发明授权

US08329600B2 Method and system for high-speed precise laser trimming and scan lens for use therein 有权
标题翻译：用于高速精密激光修整和扫描镜片的方法和系统
公开(公告)号：US08329600B2
公开(公告)日：2012-12-11
申请号：US12499123
申请日：2009-07-08
申请人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
发明人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
IPC分类号： H01L21/26
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/351 , B23K26/361
摘要： A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
摘要翻译：提供了一种用于其中的方法，系统和扫描透镜，用于沿着修剪路径的高速，基于激光的，精确的激光修整至少一个电气元件。该方法包括用激光产生脉冲激光输出，该输出具有一个或多个重复频率的激光脉冲。可以使用快速上升/下降时间，脉冲形q切换激光器或超快速激光器。光束成形光学元件可用于产生平顶光束轮廓。每个激光脉冲具有脉冲能量，激光波长范围内的激光波长和脉冲持续时间。波长足够短以产生所需的小光斑尺寸，紧密公差，高吸收以及沿着修剪路径减少或消除的热影响区（HAZ）的短波长益处，但不会如此短以致于引起微裂纹。以这种方式，减少了修整过程之后的电阻漂移。

4. 发明授权

US07666759B2 Method and system for high-speed, precise micromachining an array of devices 失效
标题翻译：用于高速，精确微加工器件阵列的方法和系统
公开(公告)号：US07666759B2
公开(公告)日：2010-02-23
申请号：US11415653
申请日：2006-05-02
申请人： Bruce L. Couch , Jonathan S. Ehrmann , Joseph V. Lento , Shepard D. Johnson
发明人： Bruce L. Couch , Jonathan S. Ehrmann , Joseph V. Lento , Shepard D. Johnson
IPC分类号： H01L21/20
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。使用非连续共线切割，使用斑点扇出平行切割和使用逆行扫描技术实现更快的共线切割，使用非测量切割来限制电阻测量的数量。非顺序切割也用于管理热效应，校准切割用于提高精度。控制测试电压以避免电阻损坏。

5. 发明申请

US20090321396A1 Method And System For High-Speed Precise Laser Trimming And Scan Lens For Use Therein 有权
标题翻译：用于高速精密激光修整和扫描镜头的方法和系统
公开(公告)号：US20090321396A1
公开(公告)日：2009-12-31
申请号：US12499123
申请日：2009-07-08
申请人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
发明人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
IPC分类号： B23K26/38 , G02B9/64
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/351 , B23K26/361
摘要： A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
摘要翻译：提供了一种用于其中的方法，系统和扫描透镜，用于沿着修剪路径的高速，基于激光的，精确的激光修整至少一个电气元件。该方法包括用激光产生脉冲激光输出，该输出具有一个或多个重复频率的激光脉冲。可以使用快速上升/下降时间，脉冲形q切换激光器或超快速激光器。光束成形光学元件可用于产生平顶光束轮廓。每个激光脉冲具有脉冲能量，激光波长范围内的激光波长和脉冲持续时间。波长足够短以产生所需的小光斑尺寸，紧密公差，高吸收以及沿着修剪路径减少或消除的热影响区（HAZ）的短波长益处，但不会如此短以致于引起微裂纹。以这种方式，减少了修整过程之后的电阻漂移。

6. 发明授权

US07407861B2 Method and system for high-speed, precise micromachining an array of devices 有权
标题翻译：用于高速，精确微加工器件阵列的方法和系统
公开(公告)号：US07407861B2
公开(公告)日：2008-08-05
申请号：US11131668
申请日：2005-05-18
申请人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
发明人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
IPC分类号： H01L21/20 , H01L21/301
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。使用非连续共线切割，使用斑点扇出平行切割和使用逆行扫描技术实现更快的共线切割，使用非测量切割来限制电阻测量的数量。非顺序切割也用于管理热效应，校准切割用于提高精度。控制测试电压以避免电阻损坏。

7. 发明申请

US20110108534A1 METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES 审中-公开
标题翻译：用于高速，精密微处理设备阵列的方法和系统
公开(公告)号：US20110108534A1
公开(公告)日：2011-05-12
申请号：US13004710
申请日：2011-01-11
申请人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
发明人： Bruce L. Couch , Jonathan S. Ehrmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
IPC分类号： B23K26/06
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。光束扫描和偏转都用于将光束斑点分布到用于选择性处理的元件阵列的元件。偏转可用固态偏转器进行。

8. 发明授权

US07871903B2 Method and system for high-speed, precise micromachining an array of devices 有权
标题翻译：用于高速，精确微加工器件阵列的方法和系统
公开(公告)号：US07871903B2
公开(公告)日：2011-01-18
申请号：US12644832
申请日：2009-12-22
申请人： Bruce L. Couch , Jonathan S. Erhmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
发明人： Bruce L. Couch , Jonathan S. Erhmann , Yun Fee Chu , Joseph V. Lento , Shepard D. Johnson
IPC分类号： H01L21/20
CPC分类号： H01L28/20 , B23K26/03 , B23K26/032 , B23K26/034 , B23K26/04 , B23K26/0622 , B23K26/064 , B23K26/0665 , B23K26/073 , B23K26/0736 , B23K26/082 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/361 , B23K26/40 , B23K2101/38 , B23K2103/50 , H01C17/242 , H01L27/016
摘要： A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector.
摘要翻译：公开了一种用于高速，精确地微加工器件阵列的方法和系统，其中提供了改进的工艺处理量和精度，例如电阻器修整精度。光束扫描和偏转都用于将光束斑点分布到用于选择性处理的元件阵列的元件。偏转可用固态偏转器进行。

9. 发明授权

US07563695B2 Method and system for high-speed precise laser trimming and scan lens for use therein 失效
标题翻译：用于高速精密激光修整和扫描镜片的方法和系统
公开(公告)号：US07563695B2
公开(公告)日：2009-07-21
申请号：US11657810
申请日：2007-01-25
申请人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
发明人： Bo Gu , Jonathan S. Ehrmann , Joseph V. Lento , Bruce L. Couch , Yun Fee Chu , Shepard D. Johnson
IPC分类号： H01L21/00
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/351 , B23K26/361
摘要： A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
摘要翻译：提供了一种用于其中的方法，系统和扫描透镜，用于沿着修剪路径的高速，基于激光的，精确的激光修整至少一个电气元件。该方法包括用激光产生脉冲激光输出，该输出具有一个或多个重复频率的激光脉冲。可以使用快速上升/下降时间，脉冲形q切换激光器或超快速激光器。光束成形光学元件可用于产生平顶光束轮廓。每个激光脉冲具有脉冲能量，激光波长范围内的激光波长和脉冲持续时间。波长足够短以产生所需的小光斑尺寸，紧密公差，高吸收以及沿着修剪路径减少或消除的热影响区（HAZ）的短波长益处，但不会如此短以致于引起微裂纹。以这种方式，减少了修整过程之后的电阻漂移。

10. 发明授权

US07538564B2 Methods and apparatus for utilizing an optical reference 有权
标题翻译：用于使用光学参考的方法和装置
公开(公告)号：US07538564B2
公开(公告)日：2009-05-26
申请号：US11582829
申请日：2006-10-18
申请人： Jonathan S. Ehrmann , Patrick S. Duffy , Markus M. Weber , Gregg A. Metzger , Joseph V. Lento , Pierre-Yves Mabboux , Jens Zink , Yun Fee Chu
发明人： Jonathan S. Ehrmann , Patrick S. Duffy , Markus M. Weber , Gregg A. Metzger , Joseph V. Lento , Pierre-Yves Mabboux , Jens Zink , Yun Fee Chu
IPC分类号： G01R31/302 , G01R31/28
CPC分类号： G01R31/2891 , B23K26/032 , B23K26/042 , B23K26/0861 , B23K26/351 , B23K26/705
摘要： A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.
摘要翻译：激光处理系统实现将探针元件（例如，探针）与装置接口元件（例如，电路基板的接触焊盘）对准的方法。首先，激光处理系统在一个或多个预定位置处产生光学参考光束，以校准参考场。激光处理系统然后在参考场中检测探针元件的位置。激光处理系统还确定设备接口元件在参考场中的相对位置。基于探针元件和器件接口元件的位置，激光加工系统然后启动探针元件和器件接口元件的对准。在一个应用中，探针元件和器件接口元件的对准还包括将探针元件接触到器件接口元件以进行电连接。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式