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    • 4. 发明申请
    • CPP read sensors having constrained current paths made of lithographically-defined conductive vias and methods of making the same
    • CPP读取具有由光刻定义的导电通孔制成的约束电流路径的传感器及其制造方法
    • US20070047154A1
    • 2007-03-01
    • US11219108
    • 2005-09-01
    • Jeffrey ChildressJordan Katine
    • Jeffrey ChildressJordan Katine
    • G11B5/127G11B5/33
    • H01F41/308B82Y25/00B82Y40/00G11B5/3163G11B5/398H01L43/12Y10T29/49032Y10T29/49041
    • Current-perpendicular-to-planes (CPP) read sensors for magnetic heads having constrained current paths made of lithographically-defined conductive vias, and methods of making the same, are disclosed. In one illustrative example, a sensor stack structure which includes an electrically conductive spacer layer is formed over a first shield layer. An insulator layer is deposited over and adjacent the spacer layer, and a resist structure which exposes one or more portions of the insulator layer is formed over the insulator layer. With the resist structure in place, the exposed insulator layer portions are removed by etching to form one or more apertures through the insulator layer down to the spacer layer. Electrically conductive materials are subsequently deposited within the one or more apertures to form one or more lithographically-defined conductive vias of a current-constraining structure. Advantageously, such lithographically-defined conductive vias increase the current density in the active sensing region of the read sensor to thereby simultaneously increase its resistance and magnetoresistance. The size and number of vias may be varied and selected so as to precisely “tune” the sensor's resistance and magnetoresistance.
    • 公开了具有由光刻定义的导电通孔制成的约束电流路径的磁头的电流垂直平面(CPP)读取传感器及其制造方法。 在一个说明性示例中,包括导电间隔层的传感器堆叠结构形成在第一屏蔽层上。 绝缘体层沉积在间隔层之上并与其相邻,并且在绝缘体层上形成暴露绝缘体层的一个或多个部分的抗蚀剂结构。 在抗蚀剂结构就位的情况下,通过蚀刻去除暴露的绝缘体层部分,以形成穿过绝缘体层的一个或多个孔直到间隔层。 导电材料随后沉积在一个或多个孔内以形成电流约束结构的一个或多个光刻定义的导电通孔。 有利地,这种光刻定义的导电通孔增加读取传感器的有源感测区域中的电流密度,从而同时增加其电阻和磁阻。 可以改变和选择通孔的尺寸和数量,以精确地“调谐”传感器的电阻和磁阻。