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1. 发明申请

US20090133247A1 APPARATUS FOR PACKAGING A TAPE SUBSTRATE 审中-公开
标题翻译：用于包装胶带基材的装置
公开(公告)号：US20090133247A1
公开(公告)日：2009-05-28
申请号：US12362445
申请日：2009-01-29
申请人： John G. Meyers
发明人： John G. Meyers
IPC分类号： H05K13/00 , H05K13/04 , G06F19/00 , H01L21/67
CPC分类号： H01L25/50 , H01L23/5387 , H01L25/0657 , H01L2224/32145 , H01L2225/06579 , Y10T29/5313 , Y10T29/53178 , Y10T29/53191
摘要： An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other.
摘要翻译：提供了一种用于包装带基材的设备。该装置包括多个机器人臂，多个夹持元件，其连接到机器人手臂，存储有存储在其中的程序的存储器，以及耦合到存储器以执行程序以执行封装处理的控制模块。封装过程包括将多个带状基片段夹持到夹紧元件上，将第一芯片封装在带基片的第一侧上以在第一段中形成第一胶囊，并将带基片的第二段相邻第一段到第二夹紧元件。包装过程还包括相对于彼此移动机器人手臂以将第二片段堆叠在第一胶囊上。第一夹紧元件和第二夹紧元件彼此独立地移动。

2. 发明授权

US06927497B2 Multi-die semiconductor package 有权
标题翻译：多芯片半导体封装
公开(公告)号：US06927497B2
公开(公告)日：2005-08-09
申请号：US10226070
申请日：2002-08-22
申请人： John G. Meyers
发明人： John G. Meyers
IPC分类号： H01L23/538 , H01L25/10 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/5387 , H01L2224/48227 , H01L2924/15311 , H01L2924/1815
摘要： A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule.
摘要翻译：半导体封装包括第一胶囊，第二胶囊和在第一胶囊的表面内的凹槽内的粘合剂，其将第一胶囊固定到第二胶囊。

3. 发明申请

US20170092602A1 PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE 有权
公开(公告)号：US20170092602A1
公开(公告)日：2017-03-30
申请号：US14866576
申请日：2015-09-25
申请人： John G. Meyers , Bilal Khalaf , Sireesha Gogineni , Brian J. Long
发明人： John G. Meyers , Bilal Khalaf , Sireesha Gogineni , Brian J. Long
IPC分类号： H01L23/58 , H01L21/52 , H01L25/00 , H01L21/66 , H01L25/065
CPC分类号： H01L23/585 , H01L21/52 , H01L22/32 , H01L22/34 , H01L23/13 , H01L23/3121 , H01L23/49816 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/16 , H01L25/50 , H01L2223/6677 , H01L2224/16227 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06593 , H01L2225/06596 , H01L2924/00014 , H01L2924/1433 , H01L2924/1436 , H01L2924/15162 , H01L2924/15192 , H01L2924/1531 , H01L2924/15311 , H01L2924/15331 , H01L2924/15333 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/00012 , H01L2924/00 , H01L2224/45099
摘要： Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device includes a first substrate coupled to a first side of a package, and a second substrate coupled to a second side of the package opposite the first side. Circuitry, coupled via the first substrate to one or more IC dies disposed in the package, includes a circuit structure disposed at a cantilever portion of the first substrate. The cantilever portion extends past one or both of an edge of the first side and an edge of the second side. In another embodiment, a hardware interface disposed on the second substrate enables coupling of the packaged device to another device.

4. 发明授权

US07533457B2 Packaging method for circuit board 失效
标题翻译：包装方法装置
公开(公告)号：US07533457B2
公开(公告)日：2009-05-19
申请号：US11173219
申请日：2005-06-30
申请人： Richard B Foehringer , Jason E Snodgress , Steven R. Eskildsen , John G. Meyers
发明人： Richard B Foehringer , Jason E Snodgress , Steven R. Eskildsen , John G. Meyers
IPC分类号： H01R43/00 , H05K3/30
CPC分类号： H01L23/3121 , H01L21/565 , H01L24/97 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/0052 , H05K3/284 , H05K2201/10106 , H05K2201/10446 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , H01L2924/00014 , H01L2924/00012
摘要： A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
摘要翻译：一种方法包括使用组件填充电路板，并用材料封装电路板和组件。该方法还包括将电路板分离成多个单独的装置。

5. 发明授权

US07503155B2 Method for packaging a tape substrate 有权
标题翻译：包装胶带基材的方法
公开(公告)号：US07503155B2
公开(公告)日：2009-03-17
申请号：US10228617
申请日：2002-08-26
申请人： John G. Meyers
发明人： John G. Meyers
IPC分类号： B26D7/02
CPC分类号： H01L25/50 , H01L23/5387 , H01L25/0657 , H01L2224/32145 , H01L2225/06579 , Y10T29/5313 , Y10T29/53178 , Y10T29/53191
摘要： A process and apparatus for packaging a tape substrate are provided. A first chip is encapsulated to a first side of a tape substrate to form a first capsule in a first segment of the tape substrate. The first segment of the tape substrate is secured to a first clamping element. A second segment of the tape substrate adjacent the first segment is secured to a second clamping element. At least one of the first segment and the second segment is moved to stack the second segment over the first capsule. The first clamping element and second clamping element can move independently of each other.
摘要翻译：提供一种用于包装带基材的方法和装置。第一芯片被封装到带基板的第一侧，以在带基板的第一段中形成第一胶囊。带基材的第一段被固定到第一夹紧元件。邻近第一段的带基片的第二段被固定到第二夹紧元件。移动第一段和第二段中的至少一个以将第二段叠置在第一胶囊上。第一夹紧元件和第二夹紧元件可彼此独立地移动。

6. 发明授权

US07498201B2 Method of forming a multi-die semiconductor package 失效
标题翻译：形成多管芯半导体封装的方法
公开(公告)号：US07498201B2
公开(公告)日：2009-03-03
申请号：US11167495
申请日：2005-06-27
申请人： John G. Meyers
发明人： John G. Meyers
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L23/5387 , H01L2224/48227 , H01L2924/15311 , H01L2924/1815
摘要： Some embodiments of the invention relate to a method of packaging multiple dice into a semiconducting device. The method includes placing a first capsule that includes a first die onto a front side of a tape substrate, placing a second capsule that includes a second die onto the front side of the tape substrate, filling a recess in a surface of the first capsule with an adhesive and folding the tape substrate to attach the first capsule to the second capsule using the adhesive. The method may further include placing a third capsule that includes a third die onto the front side of the tape substrate such that folding the tape substrate includes positioning the third capsule against a back side of the tape substrate opposite to the second capsule.
摘要翻译：本发明的一些实施例涉及将多个骰子封装到半导体器件中的方法。该方法包括将包括第一管芯的第一封壳放置在带基板的正面上，将包括第二管芯的第二封壳放置在带基板的前侧上，用第一封壳的表面填充第一封壳的表面中的凹槽，粘合剂并折叠胶带基材，以使用粘合剂将第一胶囊附着到第二胶囊。该方法还可以包括将包括第三裸片的第三胶囊放置在带基材的前侧，使得折叠带基材包括将第三胶囊定位在与第二胶囊相对的带基材的背面上。

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