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1. 发明授权

US09153523B2 ASIC element including a via 有权
标题翻译： ASIC元件包括通孔
公开(公告)号：US09153523B2
公开(公告)日：2015-10-06
申请号：US14307108
申请日：2014-06-17
申请人： Heribert Weber , Hartmut Kueppers , Jochen Reinmuth , Neil Davies , Jens Frey
发明人： Heribert Weber , Hartmut Kueppers , Jochen Reinmuth , Neil Davies , Jens Frey
IPC分类号： H01L23/52 , H01L23/48 , B81C3/00
CPC分类号： H01L23/481 , B81C1/00238 , B81C3/001 , B81C2203/0109 , B81C2203/0792 , G01C19/5783 , H01L2924/0002 , H01L2924/00
摘要： In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench.
摘要翻译：在ASIC元件中，通孔被集成到ASIC基板的CMOS处理中。 ASIC元件包括其中实现电路功能的主动正面。该至少一个通孔旨在在元件的主动前侧和后侧之间建立电连接。通孔的前侧由完全填充的至少一个前侧沟槽限定，并且后侧由未完全填充的至少一个后侧沟槽限定。后侧沟槽穿过填充的前侧沟槽。

2. 发明授权

US09038466B2 Micromechanical component and manufacturing method for a micromechanical component 有权
标题翻译：微机械部件的微机械部件和制造方法
公开(公告)号：US09038466B2
公开(公告)日：2015-05-26
申请号：US13431613
申请日：2012-03-27
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01P15/125 , B81B3/00 , G01P15/08 , G01L9/00
CPC分类号： B81B3/0021 , B81B2201/0235 , B81B2201/0264 , G01L9/0005 , G01P15/0802 , G01P15/125 , G01P2015/0831 , Y10T29/49009
摘要： A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator electrode fixedly mounted with respect to the movable mass, and at least one spring via which the movable mass is displaceable. The movable mass is structured from the substrate with the aid of at least one separating trench, at least one outer stator electrode spans at least one section of the at least one separating trench and/or of the movable mass, the at least one actuator electrode protrudes between the at least one outer stator electrode and the substrate, and at least one inner stator electrode protrudes between the at least one actuator electrode and the substrate. A related manufacturing method is also described for a micromechanical component.
摘要翻译：描述了一种微机械部件，其具有相对于基板固定地安装有至少一个定子电极的基板，具有至少一个致动器电极相对于可移动质量块固定地安装的可移动质量块，以及至少一个弹簧，质量是可移位的。借助于至少一个分离沟槽，可移动质量体由衬底构成，至少一个外部定子电极跨越至少一个分离沟槽和/或可移动质量块的至少一个部分，至少一个致动器电极突出在所述至少一个外部定子电极和所述基板之间，并且至少一个内部定子电极在所述至少一个致动器电极和所述基板之间突出。还描述了用于微机械部件的相关制造方法。

3. 发明申请

US20150054101A1 MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT 审中-公开
标题翻译：微生物组分和制备微生物组分的方法
公开(公告)号：US20150054101A1
公开(公告)日：2015-02-26
申请号：US14467726
申请日：2014-08-25
申请人： Jochen REINMUTH
发明人： Jochen REINMUTH
IPC分类号： B81B3/00 , B81C1/00
CPC分类号： B81B3/0078 , B81B7/0016 , B81B2201/0235 , B81B2201/0242 , B81C1/00825
摘要： A micromechanical component comprising a substrate having a main plane of extension, comprising a movable element, and comprising a spring arrangement assemblage is provided, the movable element being attached to the substrate by way of the spring arrangement assemblage, the movable element being deflectable out of a rest position into a deflection position, the movable element encompassing a first sub-element and a second sub-element connected to the first sub-element, the first sub-element extending mainly along the main plane of extension of the substrate, the second sub-element extending mainly along a functional plane, the functional plane being disposed substantially parallel to the main plane of extension of the substrate, the functional plane being spaced away from the main plane of extension.
摘要翻译：一种微机械部件，包括具有主平面延伸部的基板，包括可移动元件，并且包括弹簧装置组合件，所述可移动元件通过所述弹簧装置组合件附接到所述基板，所述可移动元件可偏转静止位置进入偏转位置，所述可移动元件包围第一子元件和连接到第一子元件的第二子元件，第一子元件主要沿着基板的延伸主平面延伸，第二子元件子元件主要沿着功能平面延伸，功能平面设置成基本上平行于基板延伸的主平面，功能平面与主延伸平面间隔开。

4. 发明授权

US08956544B2 Method for manufacturing a micromechanical structure, and micromechanical structure 有权
标题翻译：微机械结构的制造方法和微机械结构
公开(公告)号：US08956544B2
公开(公告)日：2015-02-17
申请号：US13586226
申请日：2012-08-15
申请人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
发明人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
IPC分类号： C23F1/00 , G01C19/5783 , B81C1/00 , G01P15/08
CPC分类号： G01C19/5783 , B81B2201/025 , B81C1/00182 , G01P15/0802 , G01P2015/0882
摘要： A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.
摘要翻译：微机械结构的制造方法和微机械结构。微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

5. 发明授权

US08778194B2 Component having a through-connection 有权
标题翻译：具有通过连接的部件
公开(公告)号：US08778194B2
公开(公告)日：2014-07-15
申请号：US13744611
申请日：2013-01-18
申请人： Jochen Reinmuth , Yvonne Bergmann
发明人： Jochen Reinmuth , Yvonne Bergmann
IPC分类号： H01L21/302
CPC分类号： H05K13/00 , B81B2201/0264 , B81B2207/095 , B81C1/00301 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/002 , H05K3/4076 , H05K3/421 , H05K2201/068 , Y10T29/49165 , Y10T428/24322 , H01L2924/00
摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.
摘要翻译：描述了用于制造具有贯通连接的部件的方法。该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。还描述了具有贯通连接的部件。

6. 发明申请

US20140027927A1 METHOD FOR MANUFACTURING A COMPONENT HAVING AN ELECTRICAL THROUGH-CONNECTION 有权
标题翻译：用于制造具有电气连接的组件的方法
公开(公告)号：US20140027927A1
公开(公告)日：2014-01-30
申请号：US13923035
申请日：2013-06-20
申请人： Jochen REINMUTH , Jens FREY , Yvonne BERGMANN
发明人： Jochen REINMUTH , Jens FREY , Yvonne BERGMANN
IPC分类号： H01L23/48 , H01L21/762
CPC分类号： H01L21/76224 , B81B7/007 , B81B2207/096 , B81C1/00095 , H01L21/76898 , H01L23/481 , H01L24/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/02311 , H01L2224/05009 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29147 , H01L2224/32145 , H01L2224/32225 , H01L2224/83193 , H01L2224/83805 , H01L2224/92 , H01L2224/9202 , H01L2224/94 , H01L2924/12042 , H01L2924/1461 , H01L2924/351 , H01L2224/0231 , H01L2224/83 , H01L21/78 , H01L2924/00014 , H01L2924/01032 , H01L2924/00
摘要： A method for manufacturing a component having an electrical through-connection is described. The method includes the following steps: providing a semiconductor substrate having a front side and a back side opposite from the front side, producing an insulating trench, which annularly surrounds a contact area, on the front side of the semiconductor substrate, filling the insulating trench with an insulating material, producing an electrical contact structure on the front side of the semiconductor substrate by depositing an electrically conductive material in the contact area, removing the semiconductor material remaining in the contact area on the back side of the semiconductor substrate in order to produce a contact hole which opens up the bottom side of the contact structure, and depositing a metallic material in the contact hole in order to electrically connect the electrical contact structure to the back side of the semiconductor substrate.
摘要翻译：描述了一种用于制造具有电穿通连接的部件的方法。该方法包括以下步骤：提供具有与前侧相反的前侧和后侧的半导体衬底，在半导体衬底的正面上产生环形地包围接触区域的绝缘沟槽，填充绝缘沟槽具有绝缘材料，通过在接触区域中沉积导电材料，在半导体衬底的正面上产生电接触结构，去除残留在半导体衬底背面接触区域中的半导体材料，以便产生接触孔，其向开放接触结构的底侧开口，并且在接触孔中沉积金属材料，以将电接触结构电连接到半导体衬底的背面。

7. 发明申请

US20130189483A1 COMPONENT HAVING A THROUGH-CONNECTION 有权
标题翻译：具有通过连接的组件
公开(公告)号：US20130189483A1
公开(公告)日：2013-07-25
申请号：US13744611
申请日：2013-01-18
申请人： Jochen REINMUTH , Yvonne BERGMANN
发明人： Jochen REINMUTH , Yvonne BERGMANN
IPC分类号： H05K13/00
CPC分类号： H05K13/00 , B81B2201/0264 , B81B2207/095 , B81C1/00301 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/002 , H05K3/4076 , H05K3/421 , H05K2201/068 , Y10T29/49165 , Y10T428/24322 , H01L2924/00
摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.
摘要翻译：描述了用于制造具有贯通连接的部件的方法。该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。还描述了具有贯通连接的部件。

8. 发明授权

US08492188B2 Method for producing a micromechanical component 有权
标题翻译：微机械部件的制造方法
公开(公告)号：US08492188B2
公开(公告)日：2013-07-23
申请号：US13296923
申请日：2011-11-15
申请人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
发明人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
IPC分类号： H01L21/00
CPC分类号： B81C1/00777
摘要： A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.
摘要翻译：对微机械部件的制造方法进行说明。该方法包括提供具有包括位于基板上的绝缘材料的层系统的基板，与导电层部分连接的导电层部分和保护层结构，其与绝缘材料的一部分相接触。该方法还包括进行用于去除绝缘材料的一部分，导电层部分和保护层结构的各向同性蚀刻工艺，以防止去除绝缘材料的边界部分; 以及正在开发的结构元件，其包括导电层部分，保护层结构和绝缘材料的边界部分。

9. 发明申请

US20120296379A1 EXPANDABLE INTERSPINOUS PROCESS SPACER WITH LATERAL SUPPORT AND METHOD FOR IMPLANTATION 审中-公开
标题翻译：具有侧向支持的可扩展的互补过程间隔和用于植入的方法
公开(公告)号：US20120296379A1
公开(公告)日：2012-11-22
申请号：US13567352
申请日：2012-08-06
申请人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
发明人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
IPC分类号： A61B17/70 , A61B17/88
CPC分类号： A61B17/7065 , A61B2017/00557
摘要： An interspinous process spacer and method of implanting same is provided for maintaining separation between adjacent spinous processes of adjacent vertebrae. The spacer has two lateral portions and a medial portion therebetween, the medial portion adapted to reside between the adjacent superior and inferior spinous processes in the deployed configuration and the lateral portions each comprise a superior lateral portion and an inferior lateral portion adapted to reside on the lateral side of the respective superior and inferior spinous process in the deployed configuration to maintain positioning of the interspinous process spacer between the two adjacent vertebrae. The lateral portions each comprise an expandable lateral member.
摘要翻译：提供棘突间间隔和植入方法，以保持相邻椎骨的相邻棘突之间的分离。间隔件具有两个横向部分和其间的中间部分，中间部分适于驻留在展开构造中的相邻上部和下部棘突之间，并且横向部分各自包括上部侧部和下侧部，相应的上下棘突的侧面在展开的构型中，以保持椎间间隔垫在两个相邻的椎骨之间的定位。横向部分各自包括可膨胀的横向构件。

10. 发明申请

US20120133003A1 MICROMECHANICAL COMPONENT 有权
标题翻译：微生物组分
公开(公告)号：US20120133003A1
公开(公告)日：2012-05-31
申请号：US13298753
申请日：2011-11-17
申请人： Jochen REINMUTH
发明人： Jochen REINMUTH
IPC分类号： H01L29/84
CPC分类号： B81C1/00246 , B81B2201/0235 , B81B2203/053 , B81C2203/0735 , B81C2203/0742 , G01P15/0802 , G01P15/125
摘要： A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.
摘要翻译：微机械部件包括：具有多个沟槽结构的衬底，其将衬底的第一和第二质量元件与衬底的腹板元件分开，使得第一和第二质量元件沿着并且被设置为允许在主表面的法线方向上相对于基板的移动; 施加在所述基板的主表面上的第一电极层，并且在所述网状元件上在所述第一和第二质量元件之间形成第一电极; 以及施加在所述第一和第二质量元件上的第二电极层，并且在所述网状元件的区域中在所述第一电极的上方形成自支撑的第二电极，所述第一和第二电极形成电容。

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