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1. 发明授权

US08252029B2 Expandable interspinous process spacer with lateral support and method for implantation 有权
标题翻译：具有横向支撑的可扩展棘突间间隔和植入方法
公开(公告)号：US08252029B2
公开(公告)日：2012-08-28
申请号：US12035165
申请日：2008-02-21
申请人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
发明人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
IPC分类号： A61B17/70
CPC分类号： A61B17/7065 , A61B2017/00557
摘要： An interspinous process spacer and method of implanting same is provided for maintaining separation between adjacent spinous processes of adjacent vertebrae. The spacer has two lateral portions and a medial portion therebetween, the medial portion adapted to reside between the adjacent superior and inferior spinous processes in the deployed configuration and the lateral portions each comprise a superior lateral portion and an inferior lateral portion adapted to reside on the lateral side of the respective superior and inferior spinous process in the deployed configuration to maintain positioning of the interspinous process spacer between the two adjacent vertebrae. The lateral portions each comprise an expandable lateral member.
摘要翻译：提供棘突间间隔和植入方法，以保持相邻椎骨的相邻棘突之间的分离。间隔件具有两个横向部分和其间的中间部分，中间部分适于驻留在展开构造中的相邻上部和下部棘突之间，并且横向部分各自包括上部侧部和下侧部，相应的上下棘突的侧面在展开的构型中，以保持椎间间隔垫在两个相邻的椎骨之间的定位。横向部分各自包括可膨胀的横向构件。

2. 发明申请

US20120296379A1 EXPANDABLE INTERSPINOUS PROCESS SPACER WITH LATERAL SUPPORT AND METHOD FOR IMPLANTATION 审中-公开
标题翻译：具有侧向支持的可扩展的互补过程间隔和用于植入的方法
公开(公告)号：US20120296379A1
公开(公告)日：2012-11-22
申请号：US13567352
申请日：2012-08-06
申请人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
发明人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrütter , Jochen Reinmuth
IPC分类号： A61B17/70 , A61B17/88
CPC分类号： A61B17/7065 , A61B2017/00557
摘要： An interspinous process spacer and method of implanting same is provided for maintaining separation between adjacent spinous processes of adjacent vertebrae. The spacer has two lateral portions and a medial portion therebetween, the medial portion adapted to reside between the adjacent superior and inferior spinous processes in the deployed configuration and the lateral portions each comprise a superior lateral portion and an inferior lateral portion adapted to reside on the lateral side of the respective superior and inferior spinous process in the deployed configuration to maintain positioning of the interspinous process spacer between the two adjacent vertebrae. The lateral portions each comprise an expandable lateral member.
摘要翻译：提供棘突间间隔和植入方法，以保持相邻椎骨的相邻棘突之间的分离。间隔件具有两个横向部分和其间的中间部分，中间部分适于驻留在展开构造中的相邻上部和下部棘突之间，并且横向部分各自包括上部侧部和下侧部，相应的上下棘突的侧面在展开的构型中，以保持椎间间隔垫在两个相邻的椎骨之间的定位。横向部分各自包括可膨胀的横向构件。

3. 发明申请

US20090216274A1 EXPANDABLE INTERSPINOUS PROCESS SPACER WITH LATERAL SUPPORT AND METHOD FOR IMPLANTATION 有权
标题翻译：具有侧向支持的可扩展的互补过程间隔和用于植入的方法
公开(公告)号：US20090216274A1
公开(公告)日：2009-08-27
申请号：US12035165
申请日：2008-02-21
申请人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrutter , Jochen Reinmuth
发明人： Anne Catherine Morancy-Meister , Thomas Egli , Rosemary Thompson , Nicole Gronau , Walter Gross , Michael Motzko , Fabio Bernhardsgrutter , Jochen Reinmuth
IPC分类号： A61B17/70 , A61F2/44
CPC分类号： A61B17/7065 , A61B2017/00557
摘要： An interspinous process spacer and method of implanting same is provided for maintaining separation between adjacent spinous processes of adjacent vertebrae. The spacer has two lateral portions and a medial portion therebetween, the medial portion adapted to reside between the adjacent superior and inferior spinous processes in the deployed configuration to maintain separation therebetween. The lateral portions each comprise a superior lateral portion and an inferior lateral portion adapted to reside on the lateral side of the respective superior and inferior spinous process in the deployed configuration to maintain positioning of the interspinous process spacer between the two adjacent vertebrae. The lateral portions each comprise an expandable lateral member that is expandable from an insertion configuration to the deployed configuration, and at least one of the lateral portions includes within it a lateral support member configured to be deformable for the insertion configuration and expanded in the deployed configuration. The method includes introducing the spacer through a tubular delivery device to the region between the spinous processes and positioning therein, followed by retraction of the delivery device and expansion of the expandable lateral members and lateral support members.
摘要翻译：提供棘突间间隔和植入方法，以保持相邻椎骨的相邻棘突之间的分离。间隔件具有两个横向部分和其间的中间部分，中间部分适于驻留在展开构造中的相邻上部和下部棘突之间，以保持它们之间的分离。侧面部分各自包括优选的侧向部分和适于在展开构造中位于相应的上部和下部棘突的横向侧上的下侧部分，以保持棘突间间隔物在两个相邻椎骨之间的定位。横向部分各自包括可膨胀的侧向构件，其可从插入构型扩展到展开构型，并且至少一个横向部分在其内部包括侧向支撑构件，该侧向支撑构件被构造成可变形以用于插入构造并且在展开构型中展开。该方法包括将间隔件通过管状输送装置引入棘突之间的区域并定位在其中，随后递送装置缩回和可膨胀侧向构件和横向支撑构件的膨胀。

4. 发明授权

US09153523B2 ASIC element including a via 有权
标题翻译： ASIC元件包括通孔
公开(公告)号：US09153523B2
公开(公告)日：2015-10-06
申请号：US14307108
申请日：2014-06-17
申请人： Heribert Weber , Hartmut Kueppers , Jochen Reinmuth , Neil Davies , Jens Frey
发明人： Heribert Weber , Hartmut Kueppers , Jochen Reinmuth , Neil Davies , Jens Frey
IPC分类号： H01L23/52 , H01L23/48 , B81C3/00
CPC分类号： H01L23/481 , B81C1/00238 , B81C3/001 , B81C2203/0109 , B81C2203/0792 , G01C19/5783 , H01L2924/0002 , H01L2924/00
摘要： In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench.
摘要翻译：在ASIC元件中，通孔被集成到ASIC基板的CMOS处理中。 ASIC元件包括其中实现电路功能的主动正面。该至少一个通孔旨在在元件的主动前侧和后侧之间建立电连接。通孔的前侧由完全填充的至少一个前侧沟槽限定，并且后侧由未完全填充的至少一个后侧沟槽限定。后侧沟槽穿过填充的前侧沟槽。

5. 发明授权

US09038466B2 Micromechanical component and manufacturing method for a micromechanical component 有权
标题翻译：微机械部件的微机械部件和制造方法
公开(公告)号：US09038466B2
公开(公告)日：2015-05-26
申请号：US13431613
申请日：2012-03-27
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： G01P15/125 , B81B3/00 , G01P15/08 , G01L9/00
CPC分类号： B81B3/0021 , B81B2201/0235 , B81B2201/0264 , G01L9/0005 , G01P15/0802 , G01P15/125 , G01P2015/0831 , Y10T29/49009
摘要： A micromechanical component is described having a substrate which has at least one stator electrode fixedly mounted with respect to the substrate, a movable mass having at least one actuator electrode fixedly mounted with respect to the movable mass, and at least one spring via which the movable mass is displaceable. The movable mass is structured from the substrate with the aid of at least one separating trench, at least one outer stator electrode spans at least one section of the at least one separating trench and/or of the movable mass, the at least one actuator electrode protrudes between the at least one outer stator electrode and the substrate, and at least one inner stator electrode protrudes between the at least one actuator electrode and the substrate. A related manufacturing method is also described for a micromechanical component.
摘要翻译：描述了一种微机械部件，其具有相对于基板固定地安装有至少一个定子电极的基板，具有至少一个致动器电极相对于可移动质量块固定地安装的可移动质量块，以及至少一个弹簧，质量是可移位的。借助于至少一个分离沟槽，可移动质量体由衬底构成，至少一个外部定子电极跨越至少一个分离沟槽和/或可移动质量块的至少一个部分，至少一个致动器电极突出在所述至少一个外部定子电极和所述基板之间，并且至少一个内部定子电极在所述至少一个致动器电极和所述基板之间突出。还描述了用于微机械部件的相关制造方法。

6. 发明授权

US08956544B2 Method for manufacturing a micromechanical structure, and micromechanical structure 有权
标题翻译：微机械结构的制造方法和微机械结构
公开(公告)号：US08956544B2
公开(公告)日：2015-02-17
申请号：US13586226
申请日：2012-08-15
申请人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
发明人： Johannes Classen , Jochen Reinmuth , Sebastian Guenther , Pia Bustian-Todorov
IPC分类号： C23F1/00 , G01C19/5783 , B81C1/00 , G01P15/08
CPC分类号： G01C19/5783 , B81B2201/025 , B81C1/00182 , G01P15/0802 , G01P2015/0882
摘要： A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.
摘要翻译：微机械结构的制造方法和微机械结构。微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

7. 发明授权

US08778194B2 Component having a through-connection 有权
标题翻译：具有通过连接的部件
公开(公告)号：US08778194B2
公开(公告)日：2014-07-15
申请号：US13744611
申请日：2013-01-18
申请人： Jochen Reinmuth , Yvonne Bergmann
发明人： Jochen Reinmuth , Yvonne Bergmann
IPC分类号： H01L21/302
CPC分类号： H05K13/00 , B81B2201/0264 , B81B2207/095 , B81C1/00301 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L2924/0002 , H05K3/002 , H05K3/4076 , H05K3/421 , H05K2201/068 , Y10T29/49165 , Y10T428/24322 , H01L2924/00
摘要： A method is described for manufacturing a component having a through-connection. The method includes providing a substrate; forming a trench structure in the substrate, a substrate area which is completely surrounded by the trench structure being produced; forming a closing layer for closing off the trench structure, a cavity girded by the closing layer being formed in the area of the trench structure; removing substrate material from the substrate area surrounded by the closed-off trench structure; and at least partially filling the substrate area surrounded by the closed-off trench structure with a metallic material. A component having a through-connection is also described.
摘要翻译：描述了用于制造具有贯通连接的部件的方法。该方法包括提供基板; 在衬底中形成沟槽结构，被正被制造的沟槽结构完全包围的衬底区域; 形成用于封闭所述沟槽结构的封闭层，由所述封闭层围绕的腔体形成在所述沟槽结构的区域中; 从由封闭沟槽结构包围的衬底区域中去除衬底材料; 并且用金属材料至少部分地填充由封闭沟槽结构包围的衬底区域。还描述了具有贯通连接的部件。

8. 发明授权

US08492188B2 Method for producing a micromechanical component 有权
标题翻译：微机械部件的制造方法
公开(公告)号：US08492188B2
公开(公告)日：2013-07-23
申请号：US13296923
申请日：2011-11-15
申请人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
发明人： Heiko Stahl , Christina Leinenbach , Axel Franke , Jochen Reinmuth , Ando Feyh , Christian Rettig
IPC分类号： H01L21/00
CPC分类号： B81C1/00777
摘要： A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the conductive layer section, which borders a section of the insulating material. The method furthermore includes carrying out an isotropic etching process for removing a part of the insulating material, the conductive layer section and the protective layer structure preventing the removal of the bordered section of the insulating material; and a structural element being developed, which includes the conductive layer section, the protective layer structure and the bordered section of the insulating material.
摘要翻译：对微机械部件的制造方法进行说明。该方法包括提供具有包括位于基板上的绝缘材料的层系统的基板，与导电层部分连接的导电层部分和保护层结构，其与绝缘材料的一部分相接触。该方法还包括进行用于去除绝缘材料的一部分，导电层部分和保护层结构的各向同性蚀刻工艺，以防止去除绝缘材料的边界部分; 以及正在开发的结构元件，其包括导电层部分，保护层结构和绝缘材料的边界部分。

9. 发明申请

US20120017681A1 ACCELERATION SENSOR METHOD FOR OPERATING AN ACCELERATION SENSOR 有权
标题翻译：用于加速传感器的加速传感器方法
公开(公告)号：US20120017681A1
公开(公告)日：2012-01-26
申请号：US13148038
申请日：2009-12-11
申请人： Jochen Reinmuth , Harald Emmerich
发明人： Jochen Reinmuth , Harald Emmerich
IPC分类号： G01P15/08
CPC分类号： G01P15/125 , G01P2015/0831
摘要： An acceleration sensor includes a housing, a first seismic mass which is formed as a first asymmetrical rocker and is disposed in the housing via at least one first spring, a second seismic mass which is formed as a second asymmetrical rocker and is disposed in the housing via at least one second spring, and a sensor and evaluation unit which is designed to ascertain information regarding corresponding rotational movements of the first seismic mass and the second seismic mass in relation to the housing and to determine acceleration information with respect to an acceleration of the acceleration sensor, taking the ascertained information into account. In addition, a method for operating an acceleration sensor is disclosed. The rockers execute opposite rotational movements in response to the presence of an acceleration. A differential evaluation of the signals makes it possible to free the measuring signal of any existing interference signals.
摘要翻译：加速度传感器包括壳体，第一抗震块，其形成为第一不对称摇臂，并且经由至少一个第一弹簧设置在壳体中，第二抗震块形成为第二不对称摇臂并设置在壳体中经由至少一个第二弹簧以及传感器和评估单元，该传感器和评估单元被设计成确定关于第一地震质量块和第二地震质量块相对于壳体的相应旋转运动的信息，并且确定相对于壳体的加速度的加速度信息加速度传感器，考虑确定的信息。此外，公开了一种用于操作加速度传感器的方法。响应于加速度的存在，摇臂执行相反的旋转运动。信号的差分评估使得可以释放任何现有干扰信号的测量信号。

10. 发明申请

US20110298140A1 Component having a through-contact 有权
标题翻译：具有通过接触的部件
公开(公告)号：US20110298140A1
公开(公告)日：2011-12-08
申请号：US13134075
申请日：2011-05-26
申请人： Jochen Reinmuth
发明人： Jochen Reinmuth
IPC分类号： H01L23/48 , H01L21/283
CPC分类号： B81C1/00301 , B81B2207/095 , H01L21/7682 , H01L21/76898 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/48 , H01L2224/0345 , H01L2224/04042 , H01L2224/0508 , H01L2224/05624 , H01L2224/05655 , H01L2224/05666 , H01L2224/06181 , H01L2224/48463 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/1461 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing a component having a through-contact includes: providing a substrate; forming an insulating layer on the substrate; structuring the insulating layer, the insulating layer being removed at least in a predetermined trenching area surrounding a selected substrate area; performing an etching process in which the structured insulating layer functions as a mask to remove substrate material in the trenching area and to create a trench structure surrounding the selected substrate area; and forming a metallic layer on the insulating layer, the metallic layer sealing the trench structure.
摘要翻译：一种具有贯通接触部件的制造方法包括：提供基板; 在所述基板上形成绝缘层; 构造绝缘层，绝缘层至少在围绕所选择的衬底区域的预定的沟槽区域中被去除; 执行蚀刻工艺，其中结构化绝缘层用作掩模以去除在沟槽区域中的衬底材料并且产生围绕所选择的衬底区域的沟槽结构; 以及在所述绝缘层上形成金属层，所述金属层密封所述沟槽结构。

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