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    • 1. 发明授权
    • Signal sensor for rf integrated systems
    • 用于rf集成系统的信号传感器
    • US06452413B1
    • 2002-09-17
    • US09712323
    • 2000-11-14
    • Joachim Norbert Burghartz
    • Joachim Norbert Burghartz
    • G01R3126
    • G01R15/148G01R21/01
    • A signal sensor is provided that includes a substrate, an input port formed on the substrate as a substantially linear conductive element, and a sensing port formed on the substrate adjacent to the input port. The sensing port is influenced by magnetic flux emanating from the input port such that a sense signal is generated in the sensing port. The sensing port can have as little as one sensing loop disposed on one side of the input port, but preferably includes at least one sensing loop on each side of the input port. The sensing loops on each side of the input port have an opposite sense of turn so that the sense signals in each loop are additive. A cross-over connector provides an electrical connection between the loops of the sensing port on opposite sides of the input port. The cross-over connector can be an underpass crossing below the input port or an overpass crossing above the input port. If desired, multiple sensing loops can be formed on each side of the input port. These sensing loops may be formed at the same fabrication level or may be formed on multiple fabrication levels. In the latter case, multi-level interconnects provide electrical connections between the sensing loops on each level.
    • 提供了一种信号传感器,其包括基板,形成在基板上的输入端口作为基本线性的导电元件,以及形成在基板上的与输入端口相邻的感测端口。 感测端口受到从输入端口发出的磁通量的影响,使得在感测端口中产生感测信号。 感测端口可以具有设置在输入端口的一侧上的至少一个感测回路,但是优选地在输入端口的每一侧包括至少一个感测回路。 输入端口每侧的感应回路具有相反的转向,使得每个回路中的感测信号是相加的。 交叉连接器在输入端口的相对侧上的感测端口的环路之间提供电连接。 交叉连接器可以是输入端口下方的地下通道或输入端口上方的立交桥。 如果需要,可以在输入端口的每一侧上形成多个感测回路。 这些感测回路可以以相同的制造水平形成,或者可以在多个制造水平上形成。 在后一种情况下,多级互连提供每层级感测环路之间的电气连接。
    • 3. 发明授权
    • Signal sensor for rf integrated systems
    • 用于rf集成系统的信号传感器
    • US06177806B1
    • 2001-01-23
    • US08923049
    • 1997-09-03
    • Joachim Norbert Burghartz
    • Joachim Norbert Burghartz
    • G01R3126
    • G01R15/148G01R21/01
    • A signal sensor is provided that includes a substrate, an input port formed on the substrate as a substantially linear conductive element, and a sensing port formed on the substrate adjacent to the input port. The sensing port is influenced by magnetic flux emanating from the input port such that a sense signal is generated in the sensing port. The sensing port can have as little as one sensing loop disposed on one side of the input port, but preferably includes at least one sensing loop on each side of the input port. The sensing loops on each side of the input port have an opposite sense of turn so that the sense signals in each loop are additive. A cross-over connector provides an electrical connection between the loops of the sensing port on opposite sides of the input port. The cross-over connector can be an underpass crossing below the input port or an overpass crossing above the input port. If desired, multiple sensing loops can be formed on each side of the input port. These sensing loops may be formed at the same fabrication level or may be formed on multiple fabrication levels. In the latter case, multi-level interconnects provide electrical connections between the sensing loops on each level.
    • 提供了一种信号传感器,其包括基板,形成在基板上的输入端口作为基本线性的导电元件,以及形成在基板上的与输入端口相邻的感测端口。 感测端口受到从输入端口发出的磁通量的影响,使得在感测端口中产生感测信号。 感测端口可以具有设置在输入端口的一侧上的至少一个感测回路,但是优选地在输入端口的每一侧包括至少一个感测回路。 输入端口每侧的感应回路具有相反的转向,使得每个回路中的感测信号是相加的。 交叉连接器在输入端口的相对侧上的感测端口的环路之间提供电连接。 交叉连接器可以是输入端口下方的地下通道或输入端口上方的立交桥。 如果需要,可以在输入端口的每一侧上形成多个感测回路。 这些感测回路可以以相同的制造水平形成,或者可以在多个制造水平上形成。 在后一种情况下,多级互连提供每层级感测环路之间的电气连接。
    • 7. 发明授权
    • MOS high frequency switch circuit using a variable well bias
    • MOS高频开关电路使用可变阱偏置
    • US5818099A
    • 1998-10-06
    • US724876
    • 1996-10-03
    • Joachim Norbert Burghartz
    • Joachim Norbert Burghartz
    • H01L29/10H03K17/687H01L29/00
    • H01L29/1079H01L29/1087H03K17/6871H03K17/693H03K2217/0018Y10S257/901
    • An RF switch comprises a switching FET having gate and back gate terminals, an input port for receiving an RF signal, and an output port for providing substantially the RF signal during an ON state of the FET. Switching circuitry connects the back gate terminal of the FET to the input port during the ON state to reduce insertion loss during the ON state, and connects the back gate terminal to a point of reference potential during an OFF state of the FET to increase isolation during the OFF state. Preferably, the switching FET is a depletion mode silicon MOSFET capable of operating with low supply voltages. The switching circuitry preferably comprises a second FET for electrically connecting the back gate terminal and the input terminal (e.g., source) of the switching FET during the ON state, and a third FET for electrically connecting the back gate terminal of the switching FET to the point of reference potential during the OFF state.
    • RF开关包括具有栅极和背栅极端子的开关FET,用于接收RF信号的输入端口和用于在FET的导通状态期间基本上提供RF信号的输出端口。 开关电路在接通状态期间将FET的背栅极连接到输入端口,以在导通状态期间降低插入损耗,并且在FET的OFF状态期间将背栅极端子连接到参考电位点以增加隔离度 OFF状态。 优选地,开关FET是能够以低电源电压工作的耗尽型硅MOSFET。 开关电路优选地包括用于在导通状态期间电连接开关FET的背栅极端子和输入端子(例如,源极)的第二FET,以及用于将开关FET的背栅极电连接到开关FET的第三FET OFF状态下的参考点电位。
    • 10. 发明授权
    • Integrated circuit-compatible photo detector device and fabrication
process
    • US5994162A
    • 1999-11-30
    • US18942
    • 1998-02-05
    • Joachim Norbert BurghartzMark B RitterUli Klepser
    • Joachim Norbert BurghartzMark B RitterUli Klepser
    • H01L31/11H01L31/18H01L21/265H01L21/00
    • H01L31/1105H01L31/18
    • An integrated circuit-compatible photo detector is disclosed which is particularly compatible with BiCMOS fabrication processes. In a first aspect, the photo detector is formed as a lateral phototransistor having a semiconductor substrate, a base structure formed as a first impurity region in the substrate, an emitter structure formed as a second impurity region in the first impurity region, and a collector structure formed by the substrate and by a pair of third and fourth impurity regions in the substrate on opposite sides of the first and second impurity regions. An emitter contact is electrically connected to the second impurity region, while a pair of collector contacts are electrically connected to the third and fourth impurity regions and to each other. An anti-reflective coating is applied to at least the base structure. Advantageously, if a photodiode is required instead of a phototransistor, the second impurity region can be formed with the same polarity as the first impurity region, in which case the first and second impurity regions form a cathode (or anode) and the third and fourth impurity regions form an anode (or cathode). In a second aspect, the photo detector is formed as a lateral phototransistor having a semiconductor substrate, a base structure formed by the substrate, an emitter structure formed as a first impurity region in the substrate, and a collector structure formed as a pair of second and third impurity regions in the substrate on opposite sides of the first impurity region. An emitter contact is electrically connected to the first impurity region, while a pair of collector contacts are electrically connected to the second and third impurity regions and to each other. An anti-reflective coating is applied to at least the base structure. Advantageously, if a photodiode is required instead of a phototransistor, the first impurity region can be formed with the same polarity as the substrate, in which case the substrate and the first impurity region form an anode (or cathode) and the second and third impurity regions form a cathode (or anode).