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1. 发明授权

US09196557B1 Protective packaging for integrated circuit device 有权
标题翻译：集成电路器件的保护封装
公开(公告)号：US09196557B1
公开(公告)日：2015-11-24
申请号：US14554058
申请日：2014-11-26
申请人： Jianshe Bi , Lanping Bai , Quan Chen , Liping Guo , Yanbo Xu
发明人： Jianshe Bi , Lanping Bai , Quan Chen , Liping Guo , Yanbo Xu
IPC分类号： H01L23/495 , H01L23/31 , H01L23/48 , H01L23/00 , H01L21/56 , H01L21/82
CPC分类号： H01L21/565 , H01L21/67126 , H01L23/3107 , H01L23/3128 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/75272 , H01L2224/75705 , H01L2224/75745 , H01L2224/7598 , H01L2224/81192 , H01L2224/81903 , H01L2224/81904 , H01L2224/83193 , H01L2224/83862 , H01L2224/9221 , H01L2224/97 , H01L2924/15153 , H01L2924/15311 , H01L2224/81 , H01L2924/00014 , H01L2224/83
摘要： A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
摘要翻译：一种用于封装集成电路（IC）装置的方法，其中将模具机械地结合到相应的互连基板，将芯片引线接合并将模具封装在保护壳体中的常规制造步骤由单个制造步骤代替，该制造步骤包括热处理部件的适当组件以在所得IC封装中为模具形成适当的电连接，并使模塑化合物将模具封装在保护外壳中。

2. 发明申请

US20120301656A1 BONDED STRUCTURE OF TOUCH SCREEN WITH FLEXIBLE CIRCUIT BOARD FOR PREVENTING OVERFLOW AND BONDING METHOD THEREOF 有权
标题翻译：用于防止流过的柔性电路板的触摸屏的结合结构及其结合方法
公开(公告)号：US20120301656A1
公开(公告)日：2012-11-29
申请号：US13480465
申请日：2012-05-24
申请人： Xin Yi , Jianshe Bi
发明人： Xin Yi , Jianshe Bi
IPC分类号： B32B3/06 , B29C65/14
CPC分类号： G06F3/041 , G06F2203/04103 , H05K3/361 , Y10T428/24942 , Y10T428/24959 , Y10T428/24992
摘要： The present invention provides a bonded structure of a flexible circuit board of a touch screen for preventing overflow including a touch sensor panel having a flexible circuit board adhered thereon. The flexible circuit board and/or the touch sensor panel have a glue dam disposed thereon, and a length of the glue dam is larger than a width of the flexible circuit board. The bonded structure of the flexible circuit board of the touch screen for preventing overflow in the present invention disposes the glue dam at a position at the bonding area of the flexible circuit board bonded to the touch sensor panel to effectively reduce the overflow to a side of the flexible circuit board outside the touch sensor panel, and an appearance of the overflow and voids during bonding could be avoided.
摘要翻译：本发明提供了一种用于防止溢出的触摸屏的柔性电路板的接合结构，包括具有粘附在其上的柔性电路板的触摸传感器面板。柔性电路板和/或触摸传感器面板具有设置在其上的胶水坝，并且胶水坝的长度大于柔性电路板的宽度。本发明的用于防止溢出的触摸屏的柔性电路板的结合结构将胶水处置在与触摸传感器面板结合的柔性电路板的接合区域的位置处，以有效地将溢流到可以避免触摸传感器面板外部的柔性电路板，并且可以避免在接合期间溢出和空隙的外观。

3. 发明授权

US08859086B2 Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereof 有权
标题翻译：具有柔性电路板的触摸屏的结合结构，用于防止溢出及其接合方法
公开(公告)号：US08859086B2
公开(公告)日：2014-10-14
申请号：US13480465
申请日：2012-05-24
申请人： Xin Yi , Jianshe Bi
发明人： Xin Yi , Jianshe Bi
IPC分类号： B32B3/06 , G06F3/041 , H05K3/36
CPC分类号： G06F3/041 , G06F2203/04103 , H05K3/361 , Y10T428/24942 , Y10T428/24959 , Y10T428/24992
摘要： The present invention provides a bonded structure of a flexible circuit board of a touch screen for preventing overflow including a touch sensor panel having a flexible circuit board adhered thereon. The flexible circuit board and/or the touch sensor panel have a glue dam disposed thereon, and a length of the glue dam is larger than a width of the flexible circuit board. The bonded structure of the flexible circuit board of the touch screen for preventing overflow in the present invention disposes the glue dam at a position at the bonding area of the flexible circuit board bonded to the touch sensor panel to effectively reduce the overflow to a side of the flexible circuit board outside the touch sensor panel, and an appearance of the overflow and voids during bonding could be avoided.
摘要翻译：本发明提供了一种用于防止溢出的触摸屏的柔性电路板的接合结构，包括具有粘附在其上的柔性电路板的触摸传感器面板。柔性电路板和/或触摸传感器面板具有设置在其上的胶水坝，并且胶水坝的长度大于柔性电路板的宽度。本发明的用于防止溢出的触摸屏的柔性电路板的结合结构将胶水处置在与触摸传感器面板结合的柔性电路板的接合区域的位置处，以有效地将溢流到可以避免触摸传感器面板外部的柔性电路板，并且可以避免在接合期间溢出和空隙的外观。

4. 发明申请

US20150332985A1 PROTECTIVE PACKAGING FOR INTEGRATED CIRCUIT DEVICE 有权
标题翻译：集成电路设备的保护包装
公开(公告)号：US20150332985A1
公开(公告)日：2015-11-19
申请号：US14554058
申请日：2014-11-26
申请人： Jianshe Bi , Lanping Bai , Quan Chen , Liping Guo , Yanbo Xu
发明人： Jianshe Bi , Lanping Bai , Quan Chen , Liping Guo , Yanbo Xu
IPC分类号： H01L23/31 , H01L21/82 , H01L21/56 , H01L23/48 , H01L23/00
CPC分类号： H01L21/565 , H01L21/67126 , H01L23/3107 , H01L23/3128 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/75272 , H01L2224/75705 , H01L2224/75745 , H01L2224/7598 , H01L2224/81192 , H01L2224/81903 , H01L2224/81904 , H01L2224/83193 , H01L2224/83862 , H01L2224/9221 , H01L2224/97 , H01L2924/15153 , H01L2924/15311 , H01L2224/81 , H01L2924/00014 , H01L2224/83
摘要： A method for packaging an integrated circuit (IC) device in which conventional manufacturing steps of mechanically bonding a die to a corresponding interconnecting substrate, wire bonding the die, and encapsulating the die in a protective shell are replaced by a single manufacturing step that includes thermally treating an appropriate assembly of parts to both form proper electrical connections for the die in the resulting IC package and cause the molding compound(s) to encapsulate the die in a protective enclosure.
摘要翻译：一种用于封装集成电路（IC）装置的方法，其中将模具机械地结合到相应的互连基板，将芯片引线接合并将模具封装在保护壳体中的常规制造步骤由单个制造步骤代替，该制造步骤包括热处理部件的适当组件以在所得IC封装中为模具形成适当的电连接，并使模塑化合物将模具封装在保护外壳中。

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