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1. 发明授权

US07850836B2 Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate 失效
标题翻译：在半导体衬底的至少一个通孔通孔中电沉积导电材料的方法
公开(公告)号：US07850836B2
公开(公告)日：2010-12-14
申请号：US11595627
申请日：2006-11-09
申请人： Pradeep Dixit , Jianmin Miao
发明人： Pradeep Dixit , Jianmin Miao
IPC分类号： C25D5/00 , C25D21/12 , C25D5/18 , C25D5/02 , H01L21/288
CPC分类号： H01L21/2885 , C25D5/18 , C25D7/04 , C25D7/123 , C25D17/001 , H01L21/76898
摘要： An initial pulse current cycle is supplied to at least one through-hole via. The pulse current cycle includes a forward pulse current. The magnitude of the forward pulse current is lower than the magnitude of the reverse pulse current. A corresponding forward and reverse current density is generated across the via causing conductive material to be deposited within the via, thereby reducing the effective aspect ratio of the via. At least one subsequent pulse current cycle is supplied. The magnitudes of the forward and reverse pulse currents of the subsequent pulse current cycle are determined in relation to the reduced effective aspect ratio. A subsequent corresponding forward and reverse current density is generated across the through-hole via causing conductive material to be deposited within the via, thereby further reducing the effective aspect ratio of the via.
摘要翻译：初始脉冲电流循环被提供给至少一个通孔通孔。脉冲电流周期包括正向脉冲电流。正向脉冲电流的幅度小于反向脉冲电流的幅度。在整个通孔上产生相应的正向和反向电流密度，导致导电材料沉积在通孔内，从而降低通孔的有效纵横比。提供至少一个后续脉冲电流循环。随后的脉冲电流周期的正向和反向脉冲电流的幅度相对于减小的有效宽高比来确定。随后通过使导电材料沉积在通孔中，跨越通孔产生相应的正向和反向电流密度，从而进一步降低了通孔的有效纵横比。

2. 发明申请

US20050035671A1 Method of forming a micro-rotating device, and a micro-rotating device produced by the method 有权
标题翻译：形成微型旋转装置的方法以及通过该方法制造的微型旋转装置
公开(公告)号：US20050035671A1
公开(公告)日：2005-02-17
申请号：US10915142
申请日：2004-08-10
申请人： Akio Takada , Ching Yeo , Jianmin Miao
发明人： Akio Takada , Ching Yeo , Jianmin Miao
IPC分类号： B81B5/00 , B81C3/00 , H02K15/02 , H02K11/00
CPC分类号： H02K99/20 , Y10T29/49009
摘要： A micro-rotating device has a rotor 200 (of diameter not more than 1.5 cm), a shaft 202 threaded through the rotor 200, and a shaft holder 207 for holding the shaft. The shaft holders are formed by etching an Si substrate 501 to form multiple shaft receiving openings 508. The rotors and shafts too are formed from respective Si substrates 301, 401. The rotors 200 are located over the shaft holders 207, and the shafts threaded through the rotors 200 into the openings 509 and attached there by a wafer bonding process. Then the substrate 501 is partitioned to give individual motor elements. Protrusions 206 extend from the rotor in the direction towards the stator to space the rotor from the shaft holder.
摘要翻译：微型旋转装置具有转子200（直径不大于1.5cm），穿过转子200的轴202和用于保持轴的轴保持器207。轴保持器通过蚀刻Si衬底501形成以形成多个轴接收开口508.转子和轴也由相应的Si衬底301,401形成。转子200位于轴保持器207上方，并且轴穿过转子200进入开口509并通过晶片接合工艺附接到开口509。然后将衬底501分隔以给出单独的电机元件。突出部206从转子朝向定子的方向延伸，以使转子与轴保持器相交。

3. 发明申请

US20070202686A1 Method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate 失效
标题翻译：在半导体衬底的至少一个通孔通孔中电沉积导电材料的方法
公开(公告)号：US20070202686A1
公开(公告)日：2007-08-30
申请号：US11595627
申请日：2006-11-09
申请人： Pradeep Dixit , Jianmin Miao
发明人： Pradeep Dixit , Jianmin Miao
IPC分类号： H03K3/017
CPC分类号： H01L21/2885 , C25D5/18 , C25D7/04 , C25D7/123 , C25D17/001 , H01L21/76898
摘要： A method of electro-depositing a conductive material in at least one through-hole via of a semiconductor substrate, said through-hole via having an effective aspect ratio, said method including supplying an initial pulse current cycle to the via, said pulse current cycle including a forward pulse current, and a reverse pulse current, wherein the forward pulse current and the reverse pulse current are each of a predetermined distinct magnitude and are each supplied over a predetermined distinct period, wherein the magnitude of the forward pulse current is lower than the magnitude of the reverse pulse current, such that a corresponding forward and reverse current density is generated across the via causing conductive material to be deposited within the via, thereby reducing the effective aspect ratio of said via; and supplying at least one subsequent pulse current cycle wherein the magnitude of the forward and reverse pulse currents of the subsequent pulse current cycle are determined in relation to the reduced effective aspect ratio resulting from a previous pulse current cycle, such that a subsequent corresponding forward and reverse current density is generated across the through-hole via causing conductive material to be deposited within the via, thereby further reducing the effective aspect ratio of said via with each subsequent pulse current cycle until the through-hole via is completely filled with conductive material.
摘要翻译：一种在半导体衬底的至少一个通孔通孔中电沉积导电材料的方法，所述通孔通孔具有有效的纵横比，所述方法包括向通孔提供初始脉冲电流循环，所述脉冲电流循环包括正向脉冲电流和反向脉冲电流，其中正向脉冲电流和反向脉冲电流各自具有预定的不同幅度，并且分别被提供在预定的不同周期，其中正向脉冲电流的幅度低于反向脉冲电流的大小，使得跨过通孔产生相应的正向和反向电流密度，导致导电材料沉积在通孔内，从而降低所述通孔的有效纵横比; 并提供至少一个随后的脉冲电流循环，其中随后脉冲电流周期的正向和反向脉冲电流的大小相对于由先前脉冲电流周期产生的减小的有效宽高比来确定，使得随后的相应的前进和通过使通孔中的导电材料沉积在通孔内而产生反向电流密度，从而进一步减少所述通孔与每个随后的脉冲电流循环的有效纵横比直到通孔通孔完全填充有导电材料。

4. 发明授权

US07239054B2 Method of forming a micro-rotating device, and a micro-rotating device produced by the method 有权
标题翻译：形成微型旋转装置的方法以及通过该方法制造的微型旋转装置
公开(公告)号：US07239054B2
公开(公告)日：2007-07-03
申请号：US10915142
申请日：2004-08-10
申请人： Akio Takada , Ching Biing Yeo , Jianmin Miao
发明人： Akio Takada , Ching Biing Yeo , Jianmin Miao
IPC分类号： H02K5/00
CPC分类号： H02K99/20 , Y10T29/49009
摘要： A micro-rotating device has a rotor 200 (of diameter not more than 1.5 cm), a shaft 202 threaded through the rotor 200, and a shaft holder 207 for holding the shaft. The shaft holders are formed by etching an Si substrate 501 to form multiple shaft receiving openings 508. The rotors and shafts too are formed from respective Si substrates 301, 401. The rotors 200 are located over the shaft holders 207, and the shafts threaded through the rotors 200 into the openings 509 and attached there by a wafer bonding process. Then the substrate 501 is partitioned to give individual motor elements. Protrusions 206 extend from the rotor in the direction towards the stator to space the rotor from the shaft holder.
摘要翻译：微型旋转装置具有转子200（直径不大于1.5cm），穿过转子200的轴202和用于保持轴的轴保持器207。轴保持器通过蚀刻Si衬底501形成多个轴接收孔508。转子和轴也由相应的Si衬底301,401形成。转子200位于轴保持器207上方，并且穿过转子200的轴穿过开口509并通过晶片接合过程附接到开口509。然后将衬底501分隔以给出单独的电机元件。突出部206从转子朝向定子的方向延伸，以使转子与轴保持器相交。

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