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1. 发明授权

US06489035B1 Applying resistive layer onto copper 有权
标题翻译：在铜上涂上电阻层
公开(公告)号：US06489035B1
公开(公告)日：2002-12-03
申请号：US09628766
申请日：2000-07-31
申请人： Jiangtao Wang , John Callahan , Dan Lillie
发明人： Jiangtao Wang , John Callahan , Dan Lillie
IPC分类号： B32B1504
CPC分类号： C23C2/02 , C23C2/26 , C23C14/024 , C23C14/025 , C23C28/044 , C23C28/321 , C23C28/345 , H05K1/167 , H05K3/384 , H05K3/388 , H05K2201/0179 , H05K2201/0317 , H05K2201/0355 , H05K2203/0361 , Y10T428/12438 , Y10T428/12472
摘要： A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.
摘要翻译：由经过处理以在其上具有稳定层的铜箔组成的片材。稳定层由氧化锌，氧化铬或其组合构成，其厚度介于约和之间。在稳定层上提供蒸镀电阻材料。

2. 发明授权

US06489034B1 Method of forming chromium coated copper for printed circuit boards 有权
标题翻译：印刷电路板镀铬铜的方法
公开(公告)号：US06489034B1
公开(公告)日：2002-12-03
申请号：US09500192
申请日：2000-02-08
申请人： Jiangtao Wang , John Callahan , Dan Lillie
发明人： Jiangtao Wang , John Callahan , Dan Lillie
IPC分类号： B32B1504
CPC分类号： H05K1/167 , C23C2/02 , C23C2/26 , C23C14/024 , C23C14/025 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/345 , C23C28/3455 , H05K3/384 , H05K3/388 , H05K2201/0179 , H05K2201/0317 , H05K2201/0355 , H05K2203/0361 , Y10T428/12438
摘要： A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.
摘要翻译：一种在铜层上施加金属的方法，包括以下步骤：通过向其施加稳定层来稳定铜层的表面，所述稳定层由氧化锌，氧化铬，镍，氧化镍或其组合构成，稳定层由具有约5埃至约70埃的厚度; 并将从铝，镍，铬，铜，铁，铟，锌，钽，锡，钒，钨，锆，钼及其合金中选出的金属蒸镀沉积在铜层的稳定化表面上，由此形成的材料。

3. 发明授权

US06183607B2 Anode structure for manufacture of metallic foil 有权
标题翻译：用于制造金属箔的阳极结构
公开(公告)号：US06183607B2
公开(公告)日：2001-02-06
申请号：US09337576
申请日：1999-06-22
申请人： Sidney J. Clouser , Jiangtao Wang , John C. Briggs , Michael L. Stevens
发明人： Sidney J. Clouser , Jiangtao Wang , John C. Briggs , Michael L. Stevens
IPC分类号： C25D1712
CPC分类号： C25D1/04 , C25D17/12
摘要： An electrodeposition cell for electrodepositing metal onto a surface of a rotating drum that is partially immersed in an electrolytic solution. The cell includes an anode comprised of a main anode body portion and an anode extension portion. The main anode body portion has an arcuate main anode body surface having a radius of curvature slightly larger than the radius of curvature of the drum. The main anode body portion is totally immersed in the electrolytic solution adjacent the drum wherein a generally uniform gap is formed therebetween. The anode extension portion has an anode extension surface facing the drum and at least one opening extending therethrough. The anode extension portion is disposed within the electrolytic solution wherein a portion thereof extends above the electrolytic solution and the electrolytic solution can flow through the opening. A power source is connected to the main anode body portion and the anode extension portion to produce a like potential on the anode body surface and the anode extension surface, wherein the main anode body portion produces a first current density on the drum in a zone where the drum and the main anode body portion are adjacent and the anode extension portion produces a second current density on the drum in a zone where the drum and the anode extension portion are adjacent. The second current density is equal to or less than the first current density.
摘要翻译：一种用于将金属电沉积到部分浸入电解溶液中的旋转鼓表面上的电沉积池。电池包括由主阳极主体部分和阳极延伸部分组成的阳极。主阳极主体部分具有弧形主阳极体表面，其曲率半径稍大于滚筒的曲率半径。主阳极体部分完全浸入与鼓相邻的电解液中，其间形成大致均匀的间隙。阳极延伸部分具有面向鼓的阳极延伸表面和延伸穿过其中的至少一个开口。阳极延伸部分设置在电解液中，其中一部分在电解液的上方延伸，电解液可以流经开口。电源连接到主阳极体部分和阳极延伸部分，以在阳极体表面和阳极延伸表面上产生类似的电位，其中主阳极体部分在鼓上产生第一电流密度，滚筒和主阳极主体部分相邻，并且阳极延伸部分在滚筒和阳极延伸部分相邻的区域中在滚筒上产生第二电流密度。第二电流密度等于或小于第一电流密度。

4. 发明授权

US06771160B2 Resistor component with multiple layers of resistive material 有权
标题翻译：具有多层电阻材料的电阻元件
公开(公告)号：US06771160B2
公开(公告)日：2004-08-03
申请号：US09921074
申请日：2001-08-02
申请人： Jiangtao Wang , Michael A. Centanni , Sidney J. Clouser
发明人： Jiangtao Wang , Michael A. Centanni , Sidney J. Clouser
IPC分类号： H01C1012
CPC分类号： H05K1/167 , H01C7/18 , H01C17/07 , H05K2201/0317 , H05K2201/0355 , H05K2201/0391 , H05K2203/0361 , H05K2203/0723 , Y10S29/016 , Y10T29/49082 , Y10T29/49099 , Y10T29/49101 , Y10T29/49156
摘要： A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
摘要翻译：一种电阻箔，由具有第一面和第二面的铜层构成。在铜层的第一侧上设置厚度介于5埃和70埃之间的中间层。在中间层上设置厚度为50埃至2微米的第一电阻金属的第一层，并且具有50埃至2微米厚度的第二电阻金属的第二层设置在第一层的第一个电阻金属。第一电阻金属具有与第二电阻金属不同的电阻。

5. 发明授权

US06770976B2 Process for manufacturing copper foil on a metal carrier substrate 失效
标题翻译：在金属载体基板上制造铜箔的方法
公开(公告)号：US06770976B2
公开(公告)日：2004-08-03
申请号：US10074988
申请日：2002-02-13
申请人： Jiangtao Wang , Dan Lillie , David B. Russell , Sidney J. Clouser
发明人： Jiangtao Wang , Dan Lillie , David B. Russell , Sidney J. Clouser
IPC分类号： H01L2348
CPC分类号： C25D1/04 , H05K3/025
摘要： A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.
摘要翻译：一种用于在载体基底上形成相对薄的可释放铜层的方法和装置。首先，在载体基板上设置分离促进层。然后在分离促进层上形成一层蒸汽沉积的铜，以在随后的处理期间保护分离促进层。此后，通过将铜电沉积到气相沉积层上，铜层的厚度增加。将铜层施加到电介质上，并在分离促进层从载体衬底释放。

6. 发明授权

US06447929B1 Thin copper on usable carrier and method of forming same 有权
标题翻译：可用载体上的薄铜及其形成方法
公开(公告)号：US06447929B1
公开(公告)日：2002-09-10
申请号：US09649922
申请日：2000-08-29
申请人： Jiangtao Wang , Dan Lillie , Sidney J. Clouser
发明人： Jiangtao Wang , Dan Lillie , Sidney J. Clouser
IPC分类号： B32B1508
CPC分类号： B32B15/08 , C25D5/12 , C25D5/16 , C25D7/0614 , C25D7/0635 , H05K3/0097 , H05K3/025 , H05K3/384 , H05K2203/0307 , H05K2203/1536 , Y10T428/12417 , Y10T428/12472 , Y10T428/12569 , Y10T428/12847 , Y10T428/12903
摘要： A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
摘要翻译：一种用于形成印刷电路板的部件，包括铜箔，化学沉积在其上的铬层，厚度小于约0.10μm的铬层; 以及铬层上的电沉积铜层，电沉积铜层的厚度小于35μm。在铜箔和电沉积铜层上提供结节处理层。

7. 发明授权

US08653850B2 Apparatus and method for testing number of turns on coil 有权
标题翻译：用于测试线圈匝数的装置和方法
公开(公告)号：US08653850B2
公开(公告)日：2014-02-18
申请号：US13320212
申请日：2009-05-19
申请人： Wei Cai , Weimin Zhang , Jiangtao Wang
发明人： Wei Cai , Weimin Zhang , Jiangtao Wang
IPC分类号： G01R31/06 , H02P1/00
CPC分类号： G01R29/20 , G01R31/346
摘要： An apparatus for testing number of turns, used for testing the number of turns of a winding coil on an electrical machine stator with concentrated winding, comprising: a base (6); a rod-shaped rotor bracket (4) around one end of which an excitation coil (1) is wound and around the other end of which a standard coil (2) is wound; a joining member for joining the base (6) with the rotor bracket (4) so that the base (6) and the rotor bracket (4) can rotate relative to each other, wherein the plane of the base (6) is parallel to the rotor bracket (4); a fixing member for fixing the electrical machine stator (5) with concentrated winding to the base (6) so as to make the stator (5) concentric and coplanar with the rotor bracket (4); a galvanometer (17) connected to the standard coil (2), which is connected to the tested coil (3) of the stator (5) in reverse polarity to form a loop during testing. Also provided is a method for using the apparatus to test the number of turns. The apparatus for testing number of turns has a simple structure, is of great utility and can test the number of turns of a winding coil on an electrical machine stator with concentrated winding directly.
摘要翻译：一种用于测试匝数的装置，用于测试具有集中绕组的电机定子上的绕组线圈的匝数，包括：基座（6）; 杆状转子支架（4）围绕其一端缠绕励磁线圈（1）并绕其另一端缠绕有标准线圈（2）的一端; 用于将所述基座（6）与所述转子支架（4）接合的接合构件，使得所述基座（6）和所述转子支架（4）能够相对于彼此旋转，其中所述基座（6）的平面平行于转子支架（4）; 固定构件，用于将具有集中绕组的电机定子（5）固定到基座（6），以使定子（5）与转子支架（4）同心并共面; 连接到标准线圈（2）的电流计（17），其以相反极性连接到定子（5）的测试线圈（3），以在测试期间形成环路。还提供了一种使用该装置来测试匝数的方法。用于测试匝数的装置结构简单，具有很大的实用性，可以直接测试集中绕组的电机定子上绕组线圈的匝数。

8. 发明授权

US06841084B2 Etching solution for forming an embedded resistor 失效
标题翻译：用于形成嵌入式电阻器的蚀刻溶液
公开(公告)号：US06841084B2
公开(公告)日：2005-01-11
申请号：US10073503
申请日：2002-02-11
申请人： Dan Lillie , Jiangtao Wang
发明人： Dan Lillie , Jiangtao Wang
IPC分类号： H05K1/16 , C23F1/02 , C23F1/28 , C23G1/02 , C23G1/06 , H01C17/24 , H01L21/02 , H01L21/3213 , H05K3/06 , B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , C23F3/00
CPC分类号： H05K3/067 , C23F1/28 , H01C17/2416 , H01L21/32135 , H01L28/24 , H05K1/167
摘要： A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.
摘要翻译：含有硫脲的电阻蚀刻溶液，其特别适用于蚀刻由镍 - 铬合金构成的电阻材料。在（a）铜表面积与（b）镍/铬表面积的比例相对较大的情况下，以及需要精细特征蚀刻的情况下，电阻蚀刻溶液可以快速有效地蚀刻镍 - 铬合金。

9. 发明授权

US06824880B1 Process for improving adhesion of resistive foil to laminating materials 有权
标题翻译：提高电阻箔与层压材料粘合性的方法
公开(公告)号：US06824880B1
公开(公告)日：2004-11-30
申请号：US10439124
申请日：2003-05-15
申请人： Atnaf Admasu , Jiangtao Wang , Sidney Clouser
发明人： Atnaf Admasu , Jiangtao Wang , Sidney Clouser
IPC分类号： B32B1504
CPC分类号： H05K1/167 , C23C26/00 , C23C28/00 , H01C17/07 , H01C17/281 , H05K3/389 , H05K2201/0355 , H05K2203/0361 , Y10S428/901 , Y10T428/28 , Y10T428/31663
摘要： The invention relates to a process to enhance adhesion of resistive foil to laminating materials, including: providing a copper foil; depositing at least one resistive metal layer on at least one side of the copper foil; and applying at least one layer of at least one adhesion-promoting material over and adhered to the resistive metal layer, the adhesion-promoting material being suitable for enhancing adhesion between the resistive metal layer and laminating materials. The resistive metal layer may include NiCr, NiCrAlSi, aluminum, nickel, zinc, titanium, vanadium, chromium, manganese, iron, tantalum, molybdenum, ruthenium, and alloys, oxides, nitrides and silicides thereof. The invention further relates to a multilayer foil and to a laminate, both including the resistive metal layer and adhesion-promoting material.
摘要翻译：本发明涉及一种增强电阻箔对层压材料的附着力的方法，包括：提供铜箔; 在铜箔的至少一侧上沉积至少一个电阻金属层; 并且将至少一层至少一种粘附促进材料施加到电阻金属层上并粘附到电阻金属层上，该粘合促进材料适用于增强电阻金属层与层压材料之间的粘附性。电阻金属层可以包括NiCr，NiCrAlSi，铝，镍，锌，钛，钒，铬，锰，铁，钽，钼，钌及其合金，氧化物，氮化物和硅化物。本发明还涉及一种多层箔和层压体，它们均包括电阻金属层和粘附促进材料。

10. 发明授权

US06622374B1 Resistor component with multiple layers of resistive material 有权
标题翻译：具有多层电阻材料的电阻元件
公开(公告)号：US06622374B1
公开(公告)日：2003-09-23
申请号：US09667294
申请日：2000-09-22
申请人： Jiangtao Wang , Michael A. Centanni , Sidney J. Clouser
发明人： Jiangtao Wang , Michael A. Centanni , Sidney J. Clouser
IPC分类号： H01F17075
CPC分类号： H05K1/167 , H01C7/18 , H01C17/07 , H05K2201/0317 , H05K2201/0355 , H05K2201/0391 , H05K2203/0361 , H05K2203/0723 , Y10S29/016 , Y10T29/49082 , Y10T29/49099 , Y10T29/49101 , Y10T29/49156
摘要： A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
摘要翻译：一种制造电阻箔的方法，包括具有第一侧和第二侧的铜层。在铜层的第一面上设置有厚度为介于-5埃之间的粘结层金属层。第一层厚度为100埃至500埃的第一电阻器金属设置在该涂层金属层上，并且第一层第二层第二电阻金属层，其厚度介于100埃至500埃之间。第一电阻金属层。第一电阻金属具有与第二电阻金属不同的电阻。

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