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1. 发明授权

US07707715B2 Method of fabricating multilayer printed circuit board 失效
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07707715B2
公开(公告)日：2010-05-04
申请号：US12005610
申请日：2007-12-28
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC分类号： H05K3/00
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译：公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

2. 发明申请

US20090056119A1 Method of fabricating multilayer printed circuit board 失效
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US20090056119A1
公开(公告)日：2009-03-05
申请号：US12005610
申请日：2007-12-28
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC分类号： H05K3/00
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译：公开了一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

3. 发明申请

US20080261158A1 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US20080261158A1
公开(公告)日：2008-10-23
申请号：US12068125
申请日：2008-02-01
申请人： Ji-Hong Jo , Shuhichi Okabe
发明人： Ji-Hong Jo , Shuhichi Okabe
IPC分类号： G03F7/20
CPC分类号： H05K3/205 , H05K3/045 , H05K3/107 , H05K2201/0376 , H05K2203/0108 , H05K2203/0113 , H05K2203/0117
摘要： A method of manufacturing a printed circuit board is disclosed. The method includes: forming a relievo pattern and an intaglio pattern on a surface of a base plate; forming a metal plate, which has a metal pattern that corresponds with a shape of the relievo pattern and the intaglio pattern, by plating a surface of the relievo pattern and a surface of the intaglio pattern; separating the metal plate from the base plate; pressing the metal plate onto an insulation layer with the metal pattern facing the insulation layer; and removing a portion of the metal plate such that the metal pattern is exposed. Since this method does not use carriers, there is no need for a chemical etching process for carrier removal.
摘要翻译：公开了一种制造印刷电路板的方法。该方法包括：在基板的表面上形成解除图案和凹版图案; 通过电镀所述消光图案的表面和所述凹版图案的表面，形成金属板，所述金属板具有与所述缓和图案和所述凹版图案的形状相对应的金属图案; 将金属板与基板分离; 将金属板压在绝缘层上，金属图案面向绝缘层; 以及去除所述金属板的一部分以使得所述金属图案露出。由于该方法不使用载体，因此不需要用于载体去除的化学蚀刻方法。

4. 发明申请

US20080241361A1 Printed circuit board manufacturing method 审中-公开
标题翻译：印刷电路板制造方法
公开(公告)号：US20080241361A1
公开(公告)日：2008-10-02
申请号：US12007368
申请日：2008-01-09
申请人： Ji-Hong Jo , Myung-Sam Kang
发明人： Ji-Hong Jo , Myung-Sam Kang
IPC分类号： H05K3/02
CPC分类号： H05K3/20 , H05K1/0393 , H05K2201/0129 , H05K2201/0355 , H05K2203/0191 , H05K2203/0376 , H05K2203/1536
摘要： A printed circuit board manufacturing method is disclosed. The printed circuit manufacturing method, which includes forming an adhesive layer on a carrier, adhesiveness of the adhesive layer being changed according to heat; forming a circuit pattern on a surface of the adhesive layer; compressing the carrier into the insulation layer to allow the circuit pattern to face the insulation layer; and separating the carrier from the insulation layer by supplying heat to allow the adhesive to reach a predetermined temperature, can reduce a cost of a transferring process and improve the reliability of products by minimizing the affect on a metal pattern, by using a material having the adhesiveness changed according to the temperature as an adhesive layer.
摘要翻译：公开了印刷电路板的制造方法。印刷电路制造方法，其包括在载体上形成粘合剂层，粘合剂层的粘合性根据热而改变; 在粘合剂层的表面上形成电路图案; 将载体压缩到绝缘层中以允许电路图案面向绝缘层; 并通过供应热量使粘合剂达到预定温度而将载体与绝缘层分离，可以通过使用具有以下特征的材料来降低对金属图案的影响，从而降低了转印过程的成本并提高了产品的可靠性粘合性根据作为粘合层的温度而变化。

5. 发明申请

US20080000680A1 Printed circuit board and method of manufacturing the same 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080000680A1
公开(公告)日：2008-01-03
申请号：US11819925
申请日：2007-06-29
申请人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
发明人： Suk Hyeon Cho , Byoung Youl Min , Je Gwang Yoo , Hae Nam Seo , Byung Moon Kim , Ji Hong Jo , Han Seo Cho
IPC分类号： H05K1/03
CPC分类号： H05K1/0206 , H01L23/3735 , H01L23/5389 , H01L24/25 , H01L24/82 , H01L2224/04105 , H01L2224/19 , H01L2224/2518 , H01L2224/82039 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/14 , H01L2924/3025 , H05K1/0204 , H05K1/185 , H05K3/06 , H05K3/4038 , H05K3/4602 , H05K3/4647 , H05K3/4652 , H05K2201/09509 , H05K2201/096 , H05K2203/0733 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed herein are a printed circuit board and a method of manufacturing the same, which can achieve reliable heat resistance because heat radiation characteristics are improved, and processing costs of which are reduced because processing times are shortened.
摘要翻译：这里公开了一种印刷电路板及其制造方法，其可以提高热辐射特性，从而可以实现可靠的耐热性，并且由于加工时间缩短，其加工成本降低。

6. 发明申请

US20120210576A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120210576A1
公开(公告)日：2012-08-23
申请号：US13461694
申请日：2012-05-01
申请人： Jin Yong AN , Suk Hyeon CHO , Ji Hong JO
发明人： Jin Yong AN , Suk Hyeon CHO , Ji Hong JO
IPC分类号： H05K3/46 , H05K3/36 , H05K3/20
CPC分类号： H05K3/4658 , H05K1/113 , H05K3/20 , H05K3/4682 , H05K2201/0352 , H05K2201/096 , Y10T29/49128
摘要： This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
摘要翻译：印刷电路板及其制造方法技术领域本发明涉及一种印刷电路板及其制造方法，其中印刷电路板的最外层包括精细电路，并且印刷电路板的制造成本降低。

7. 发明申请

US20110005824A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20110005824A1
公开(公告)日：2011-01-13
申请号：US12544100
申请日：2009-08-19
申请人： Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
发明人： Jin Yong AN , Suk Hyeon Cho , Ji Hong Jo
IPC分类号： H05K1/11 , H05K3/20
CPC分类号： H05K3/4658 , H05K1/113 , H05K3/20 , H05K3/4682 , H05K2201/0352 , H05K2201/096 , Y10T29/49128
摘要： This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.
摘要翻译：印刷电路板及其制造方法技术领域本发明涉及一种印刷电路板及其制造方法，其中印刷电路板的最外层包括精细电路，并且印刷电路板的制造成本降低。

8. 发明授权

US07824838B2 Method of manufacturing printed circuit board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US07824838B2
公开(公告)日：2010-11-02
申请号：US12068125
申请日：2008-02-01
申请人： Ji-Hong Jo , Shuhichi Okabe
发明人： Ji-Hong Jo , Shuhichi Okabe
IPC分类号： G03F7/00 , G03F7/26 , G03F7/40
CPC分类号： H05K3/205 , H05K3/045 , H05K3/107 , H05K2201/0376 , H05K2203/0108 , H05K2203/0113 , H05K2203/0117
摘要： A method of manufacturing a printed circuit board is disclosed. The method includes: forming a relievo pattern and an intaglio pattern on a surface of a base plate; forming a metal plate, which has a metal pattern that corresponds with a shape of the relievo pattern and the intaglio pattern, by plating a surface of the relievo pattern and a surface of the intaglio pattern; separating the metal plate from the base plate; pressing the metal plate onto an insulation layer with the metal pattern facing the insulation layer; and removing a portion of the metal plate such that the metal pattern is exposed. Since this method does not use carriers, there is no need for a chemical etching process for carrier removal.
摘要翻译：公开了一种制造印刷电路板的方法。该方法包括：在基板的表面上形成解除图案和凹版图案; 通过电镀所述消光图案的表面和所述凹版图案的表面，形成金属板，所述金属板具有与所述缓和图案和所述凹版图案的形状相对应的金属图案; 将金属板与基板分离; 将金属板压在绝缘层上，金属图案面向绝缘层; 以及去除所述金属板的一部分以使得所述金属图案露出。由于该方法不使用载体，因此不需要用于载体去除的化学蚀刻方法。

9. 发明申请

US20100024212A1 Method of fabricating multilayer printed circuit board 审中-公开
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US20100024212A1
公开(公告)日：2010-02-04
申请号：US12588259
申请日：2009-10-08
申请人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
发明人： Shuhichi Okabe , Je Gwang Yoo , Chang Sup Ryu , Myung Sam Kang , Jung Hyun Park , Ji Hong Jo , Jin Yong An , Soon Oh Jung
IPC分类号： H05K3/06 , H05K3/36 , H05K3/42
CPC分类号： H05K3/205 , H05K3/062 , H05K3/108 , H05K3/462 , H05K2201/09509 , H05K2201/09563 , H05K2203/0369 , H05K2203/061 , H05K2203/0733 , H05K2203/1476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
摘要翻译：一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

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