会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method of fabricating fluidic plates and devices by irradiation of
photopolymers
    • 通过照射光聚合物制造流体板和装置的方法
    • US4960674A
    • 1990-10-02
    • US682090
    • 1984-12-17
    • Efrem V. FudimJeannine O. Colla
    • Efrem V. FudimJeannine O. Colla
    • G03F7/00G03F7/20
    • G03F7/00G03F7/2022
    • In general and in one preferred method, a diaphragm plate may be formed by providing a vessel containing a quantity of a light-transmittive first photopolymer compound which includes, as mixed constituents, a reactive oligomer resin, a reactive monomer diluent and a photoinitiator. A first unmasked surface of the compound is irradiated with ultraviolet (UV) light for solidifying the surface to a depth equal to the relief thickness, i.e., the desired diaphragm thickness. A second surface of the compound is irradiated with UV light subsequent to being covered with a opaque mask which defines the shape of the diaphragm. This irradiation completes the formation of the diaphragm plate by solidifying the remaining, unmasked quantity of compound. The unsolidified compound is then removed from the masked area of the plate. Other preferred methods are also disclosed.
    • 一般而言,在一个优选的方法中,可以通过提供包含一定量的透光性第一光聚合物化合物的容器来形成隔膜板,该容器包括作为混合成分的反应性低聚物树脂,反应性单体稀释剂和光引发剂。 用紫外线(UV)光照射化合物的第一未掩蔽表面,以使表面固化至等于凸起厚度即所需隔膜厚度的深度。 化合物的第二表面用UV光照射,然后用限定隔膜形状的不透明掩模覆盖。 这种照射通过固化剩余的未曝光量的化合物来完成隔膜板的形成。 然后将未固化的化合物从板的掩蔽区域中取出。 还公开了其它优选的方法。
    • 6. 发明授权
    • Temperature sensing resistance device
    • 温度感应电阻器件
    • US4183136A
    • 1980-01-15
    • US821516
    • 1977-08-03
    • Jeannine O. Colla
    • Jeannine O. Colla
    • H01C7/00H01C17/065H01C17/28
    • H01C17/065H01C7/003Y10T29/49099Y10T29/49101Y10T29/49135Y10T29/49163
    • A temperature sensitive thick film resistor unit for use in detecting and control systems is formed employing thick film plating technology. A final sized negative is formed from enlarged artwork and transferred to a photosensitive emulsion supported on a stainless steel screen to form a printing stencil. A fritted molecular bonding nickel paste including finely divided vitreous and nickel particles in a solvent carrier is screen printed onto an alumina substrate by a pressure printer in which the paste is forced through the screen to control the thickness of the deposited nickel paste. The deposited nickel is allowed to settle and partially heated to remove gases and organic solvents. A highly conductive film is overlaid on tab connecting ends and the unit is fired to intimately attach the nickel paste to the substrate by the formation of a chemical bond. Nickel in appropriate form for printing is a readily available material and also provides a significant and linear change in resistance per unit of temperature change.
    • 使用厚膜电镀技术形成用于检测和控制系统的温度敏感的厚膜电阻器单元。 最终尺寸的负片由放大的图案形成并转移到支撑在不锈钢屏幕上的感光乳剂以形成印刷模版。 将包含在溶剂载体中的细碎玻璃质和镍颗粒的烧结分子键合镍糊料通过压力打印机丝网印刷到氧化铝基底上,其中将糊剂强制通过筛网以控制沉积的镍浆料的厚度。 使沉积的镍沉淀并部分加热以除去气体和有机溶剂。 高导电膜覆盖在接头端部上,并且通过形成化学键将该单元烧结以将镍膏紧密地附着到基底上。 用于印刷的适当形式的镍是易于获得的材料,并且还提供每单位温度变化的电阻的显着和线性变化。
    • 8. 发明授权
    • Conformal coating for electrical circuit assemblies
    • 用于电路组件的保形涂层
    • US4300184A
    • 1981-11-10
    • US56505
    • 1979-07-11
    • Jeannine O. Colla
    • Jeannine O. Colla
    • H01L23/29H05K3/00H05K3/28H05K3/34
    • H05K3/284H01L23/293H01L2924/0002H05K2201/0209H05K2201/09872H05K2201/09909H05K2201/10977H05K3/0091H05K3/3447
    • A printed circuit board with electronic components wired thereto has a conformal insulating coating consisting of a single component of essentially pure urethane formulation and a minor amount of fumed colloidal silica powder. The insulating coating covers asperities and protrusions as well as the conductors and circuit components while maintaining a transparent characteristic. The coating material is made by mixing of the small proportion of silica with essentially pure urethane formulation under controlled conditions to prevent moisture contamination of the materials. The mixture is thoroughly mixed, deaerated under reduced pressure with a pulsating pressure to break any air bubbles and remove essentially all air. The coating is applied in an environment having at least 30 percent relative humidity and within a confined area defined by an encircling dam masking compound. The coating is allowed to partially cure at room temperature and the confining dam compound removed. For maximum protection, a further period of curing of one week is provided.
    • 具有连接到其上的电子部件的印刷电路板具有由基本上纯的氨基甲酸酯制剂的单一组分和少量的热解胶体二氧化硅粉末组成的共形绝缘涂层。 绝缘涂层覆盖粗糙度和突起以及导体和电路部件,同时保持透明特性。 涂料通过在受控条件下将小比例的二氧化硅与基本上纯的氨基甲酸酯配方混合来制备,以防止材料的水分污染。 将混合物充分混合,在减压下以脉动压力进行脱气以破坏任何气泡并基本上除去所有空气。 将涂层施用于具有至少30%相对湿度并且在由环绕的坝掩蔽化合物限定的限制区域内的环境中。 使涂层在室温下部分固化,并将封闭的混合物除去。 为了最大程度的保护,提供了一周的固化时间。