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1. 发明授权

US07555826B2 Method of manufacturing RFID devices 有权
标题翻译：制造RFID设备的方法
公开(公告)号：US07555826B2
公开(公告)日：2009-07-07
申请号：US11315504
申请日：2005-12-22
申请人： Edward A. Armijo , John F. Hughen , Steven C. Kennedy , Samuel A. Linder , Jason D. Munn
发明人： Edward A. Armijo , John F. Hughen , Steven C. Kennedy , Samuel A. Linder , Jason D. Munn
IPC分类号： H01P11/00
CPC分类号： G06K19/07 , B32B38/0004 , B32B38/1858 , B32B2425/00 , B32B2519/02 , G06K19/07718 , H01L21/6835 , H01L23/49855 , H01L23/5388 , H01L2924/0002 , H01L2924/19041 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T156/1062 , H01L2924/00
摘要： A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
摘要翻译：制造RFID设备的方法包括以可变（非恒定）速度进给插入器网或片材，从插入器幅材或片材切割单个插入件，并且使用旋转传送装置将单个（切割）插入件传送到天线网。插入件从旋转传送装置传送并连接到天线网，可操作地耦合到天线网上的天线。插入器各自包括RFID应答器芯片和导电引线。进给器用于将插入器幅材或片材推进到旋转切割器和旋转输送装置之间的切割区域中。旋转切割装置可以一次能够分割多个插入件，并且系统能够能够去除不与天线网连接的插入件。

2. 发明授权

US07120987B2 Method of making RFID device 有权
标题翻译：制造RFID设备的方法
公开(公告)号：US07120987B2
公开(公告)日：2006-10-17
申请号：US10634243
申请日：2003-08-05
申请人： Peikang Liu , Steven C. Kennedy , Christine U. Dang , Scott Wayne Ferguson , Jason D. Munn
发明人： Peikang Liu , Steven C. Kennedy , Christine U. Dang , Scott Wayne Ferguson , Jason D. Munn
IPC分类号： H01Q13/00 , H01Q1/38
CPC分类号： G06K19/077 , G06K19/07749 , G06K19/07752 , H01L23/49855 , H01L2924/0002 , H01L2924/3011 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , H01L2924/00
摘要： A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.
摘要翻译：射频识别（RFID）装置包括在衬底的一侧上的诸如天线的导电图案，以及电耦合到导电图案的芯片，例如带的一部分，以及与导电图案相反的一侧衬底或与衬底相同的一侧作为天线。制造RFID装置的方法可以包括将带绑在衬底上，与种子层接触，接种层随后用于通过电镀形成天线或其它导电图案。种子层可以是图案化的导电油墨层。或者，种子层可以是沉积在基底上的导电材料层，例如通过真空沉积。沉积层的一部分可以用图案化掩模覆盖，以便形成导电图案的所需结构。

3. 发明授权

US07874493B2 Method of manufacturing RFID devices 有权
标题翻译：制造RFID设备的方法
公开(公告)号：US07874493B2
公开(公告)日：2011-01-25
申请号：US12474300
申请日：2009-05-29
申请人： Edward A. Armijo , John F. Hughen , Steven C. Kennedy , Samuel A. Linder , Jason D. Munn
发明人： Edward A. Armijo , John F. Hughen , Steven C. Kennedy , Samuel A. Linder , Jason D. Munn
IPC分类号： G06K19/00
CPC分类号： G06K19/07 , B32B38/0004 , B32B38/1858 , B32B2425/00 , B32B2519/02 , G06K19/07718 , H01L21/6835 , H01L23/49855 , H01L23/5388 , H01L2924/0002 , H01L2924/19041 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T156/1062 , H01L2924/00
摘要： A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
摘要翻译：制造RFID设备的方法包括以可变（非恒定）速度进给插入器网或片材，从插入器幅材或片材切割单个插入件，并且使用旋转传送装置将单个（切割）插入件传送到天线网。插入件从旋转传送装置传送并连接到天线网，可操作地耦合到天线网上的天线。插入器各自包括RFID应答器芯片和导电引线。进给器用于将插入器幅材或片材推进到旋转切割器和旋转输送装置之间的切割区域中。旋转切割装置可以一次能够分割多个插入件，并且系统能够能够去除不与天线网连接的插入件。

4. 发明授权

US08020283B2 High-speed RFID circuit placement device 有权
标题翻译：高速RFID电路放置装置
公开(公告)号：US08020283B2
公开(公告)日：2011-09-20
申请号：US12685191
申请日：2010-01-11
申请人： Jason D. Munn
发明人： Jason D. Munn
IPC分类号： B23P19/00
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/07752 , Y10T29/49002 , Y10T29/49018 , Y10T29/4902 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.
摘要翻译：高速处理包括从具有第一间距的载体网上移除芯片或插入件，并将芯片或插入件传送到诸如RFID天线结构之类的电气部件，在具有第二间距的移动的网上。根据一种方法，当转印鼓静止时，转印鼓通过拾取芯片将碎片或插入物转移到电动元件的移动幅材上，并且当转印鼓旋转时将转印鼓转移到移动幅材上，使得转印鼓的切向速度转印鼓基本上等于移动幅材的线速度。根据另一种方法，初级滚筒从具有第一间距的载体网移除芯片或插入物，并将芯片或插入件传送到可变转动的次级鼓，然后将芯片或插入件放置在具有第二音调

5. 发明申请

US20090230198A1 METHOD OF MANUFACTURING RFID DEVICES 有权
标题翻译：制造RFID设备的方法
公开(公告)号：US20090230198A1
公开(公告)日：2009-09-17
申请号：US12474300
申请日：2009-05-29
申请人： Edward A. ARMIJO , John F. HUGHEN , Steven C. KENNEDY , Samuel A. LINDER , Jason D. MUNN
发明人： Edward A. ARMIJO , John F. HUGHEN , Steven C. KENNEDY , Samuel A. LINDER , Jason D. MUNN
IPC分类号： G06K19/00 , B32B37/02
CPC分类号： G06K19/07 , B32B38/0004 , B32B38/1858 , B32B2425/00 , B32B2519/02 , G06K19/07718 , H01L21/6835 , H01L23/49855 , H01L23/5388 , H01L2924/0002 , H01L2924/19041 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T156/1062 , H01L2924/00
摘要： A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.
摘要翻译：制造RFID设备的方法包括以可变（非恒定）速度进给插入器网或片材，从插入器幅材或片材切割单个插入件，并且使用旋转传送装置将单个（切割）插入件传送到天线网。插入件从旋转传送装置传送并连接到天线网，可操作地耦合到天线网上的天线。插入器各自包括RFID应答器芯片和导电引线。进给器用于将插入器幅材或片材推进到旋转切割器和旋转输送装置之间的切割区域中。旋转切割装置可以一次能够分割多个插入件，并且系统能够能够去除不与天线网连接的插入件。

6. 发明授权

US07333061B2 RFID device and method of making 有权
标题翻译： RFID设备及制作方法
公开(公告)号：US07333061B2
公开(公告)日：2008-02-19
申请号：US11520077
申请日：2006-09-13
申请人： Peikang Liu , Steven C. Kennedy , Christine U. Dang , Scott Wayne Ferguson , Jason D. Munn
发明人： Peikang Liu , Steven C. Kennedy , Christine U. Dang , Scott Wayne Ferguson , Jason D. Munn
IPC分类号： H01Q1/38
CPC分类号： G06K19/077 , G06K19/07749 , G06K19/07752 , H01L23/49855 , H01L2924/0002 , H01L2924/3011 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/4913 , H01L2924/00
摘要： A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.
摘要翻译：射频识别（RFID）装置包括在衬底的一侧上的诸如天线的导电图案，以及电耦合到导电图案的芯片，例如带的一部分，以及与导电图案相反的一侧衬底或与衬底相同的一侧作为天线。制造RFID装置的方法可以包括将带绑在衬底上，与种子层接触，接种层随后用于通过电镀形成天线或其它导电图案。种子层可以是图案化的导电油墨层。或者，种子层可以是沉积在基底上的导电材料层，例如通过真空沉积。沉积层的一部分可以用图案化掩模覆盖，以便形成导电图案的所需结构。

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