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1. 发明授权

US07238547B2 Packaging integrated circuits for accelerated detection of transient particle induced soft error rates 有权
标题翻译：封装集成电路，用于加速检测瞬态粒子引起的软错误率
公开(公告)号：US07238547B2
公开(公告)日：2007-07-03
申请号：US11098343
申请日：2005-04-04
申请人： Janes Jones, legal representative , Jerry D. Ackaret , Michael A. Gaynes , Michael S. Gordon , Nancy C. LaBianca
发明人： Theodore H. Zabel, deceased
IPC分类号： H01L21/56
CPC分类号： G06F11/00
摘要： An IC device is packaged for accelerated transient particle emission by doping the underfill thereof with a transient-particle-emitting material having a predetermined, substantially constant emission rate. The emission rate may be tunable. In one aspect, a radioactive adhesive composition is provided for bonding a semiconductor device to a chip carrier. The radioactive adhesive composition is made from a cured reaction product including a resin and a filler, and may be reworkable or non-reworkable. Either the resin or the filler, individually or both together as a mix, are doped substantially uniformly with the transient-particle-emitting material, thereby putting the transient-particle-emitting in close proximity with the IC to be tested. The underfill is formulated to have a stable chemistry, and the doped particles are encapsulated, so as to contain the emissions. Accelerated transient-particle-emission testing may then be performed on the IC in situ to provide accelerated detection of soft errors.
摘要翻译：通过用具有预定的，基本上恒定的发射速率的瞬态粒子发射材料掺杂其底部填充物来封装IC器件用于加速瞬态粒子发射。排放率可能是可调的。在一个方面，提供了用于将半导体器件接合到芯片载体的放射性粘合剂组合物。放射性粘合剂组合物由包括树脂和填料的固化反应产物制成，并且可以是可再加工的或不可再加工的。单独或两者一起作为混合物的树脂或填料均以瞬态粒子发射材料基本上均匀地掺杂，从而使瞬态粒子发射紧密接近待测试的IC。底层填料配制成具有稳定的化学性质，并且掺杂的颗粒被包封，以便包含排放物。然后可以在IC上原位进行加速瞬态粒子发射测试，以提供软错误的加速检测。

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