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1. 发明授权

US06186216B1 Cast column grid array extraction apparatus and method 失效
标题翻译：铸柱阵列提取装置及方法
公开(公告)号：US06186216B1
公开(公告)日：2001-02-13
申请号：US09208791
申请日：1998-12-10
申请人： Lannie R. Bolde , James H. Covell II
发明人： Lannie R. Bolde , James H. Covell II
IPC分类号： B22D2900
CPC分类号： H01L21/4853 , H05K3/3457
摘要： An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate. The mold and the ejector assembly are relatively movable toward each other to cause at least some of the ejector pins to engage cast columns in the mold openings and push the engaged cast columns and substrate out of the mold. The stripper plate is movable relative to the ejector pins away from the ejector assembly after the ejector pins push the cast columns and substrate out of the mold.
摘要翻译：一种用于移除铸件的装置，包括电子封装衬底和从模具的相应开口延伸的具有小于2mm的柱间距的铸造焊料柱阵列。该装置包括一个可移除的模具，该模具包含多个用于铸造相应阵列的焊料柱的开口，并将该柱结合到电子封装衬底的下侧。用于接收模具的剥离板包含通过其对应于模具中的至少一些开口的厚度的开口。一种喷射器组件，其包括具有至少等于剥离板开口处的剥离板的厚度和柱形铸造开口处的模具的厚度的总和的长度的喷射销，并且对应于模具和剥离器中的开口盘子。模具和喷射器组件可相对于彼此相对移动，以使得至少一些顶针与模具开口中的铸造柱接合并将接合的铸造柱和基底推出模具。脱模板在推出销将铸造柱和基材推出模具之后相对于顶出销定位离开喷射器组件是可移动的。

2. 发明授权

US5982038A Cast metal seal for semiconductor substrates 失效
标题翻译：用于半导体衬底的铸造金属密封件
公开(公告)号：US5982038A
公开(公告)日：1999-11-09
申请号：US850092
申请日：1997-05-01
申请人： Hilton T. Toy , Lannie R. Bolde , James H. Covell, II , David L. Edwards , Lewis S. Goldmann , Peter A. Gruber
发明人： Hilton T. Toy , Lannie R. Bolde , James H. Covell, II , David L. Edwards , Lewis S. Goldmann , Peter A. Gruber
IPC分类号： H01L23/02 , H01L23/10 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/10 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152
摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection.For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.
摘要翻译：本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。这种多层金属密封提供增强的气密寿命和环境保护。对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

3. 发明授权

US5968670A Enhanced ceramic ball grid array using in-situ solder stretch with spring 失效
标题翻译：增强陶瓷球栅阵列使用弹簧原位焊料拉伸
公开(公告)号：US5968670A
公开(公告)日：1999-10-19
申请号：US909864
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , James H. Covell, II , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： B23K35/02 , H01L21/60 , H01L23/48 , H05K3/34 , B23K35/14
CPC分类号： H01L24/81 , B23K35/0222 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H05K3/3436 , H01L2224/10135 , H01L2224/13076 , H01L2224/131 , H01L2224/14051 , H01L2224/14505 , H01L2224/16058 , H01L2224/16227 , H01L2224/17051 , H01L2224/81136 , H01L2224/81139 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H05K2201/09781 , H05K2201/10265 , H05K2203/0415 , H05K2203/0465 , H05K2203/306 , Y02P70/613 , Y10T428/12222 , Y10T428/12333 , Y10T428/12486
摘要： A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.
摘要翻译：提供了一种方法和装置，用于在通过使用设置在基板之间的可膨胀焊料凸块装置制造过程中，在电子模块或电子模块的两个焊接基板之间形成细长焊接接头。可膨胀焊料凸点装置包括具有比用于接合基板的焊料更高的回流温度的焊料和诸如包封在焊料内的压缩弹簧的膨胀装置，并且通过在比熔融温度高于焊点。

4. 发明授权

US5821161A Cast metal seal for semiconductor substrates and process thereof 失效
标题翻译：用于半导体衬底的铸造金属密封及其工艺
公开(公告)号：US5821161A
公开(公告)日：1998-10-13
申请号：US850091
申请日：1997-05-01
申请人： James H. Covell, II , Lannie R. Bolde , David L. Edwards , Lewis S. Goldmann , Peter A. Gruber , Hilton T. Toy
发明人： James H. Covell, II , Lannie R. Bolde , David L. Edwards , Lewis S. Goldmann , Peter A. Gruber , Hilton T. Toy
IPC分类号： H01L21/50 , H01L23/10 , H01L21/44
CPC分类号： H01L23/10 , H01L21/50 , H01L2224/16 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152 , H01L2924/163
摘要： The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.
摘要翻译：本发明一般涉及为半导体衬底和芯片载体提供密封的新方案。更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。这种多层金属密封提供增强的气密寿命和环境保护。对于优选实施例，多层金属密封件是用于为模块产生低成本，高可靠性气密密封的两层焊料结构。这种焊料结构具有连接到盖的厚的高熔点温度区域和用于将衬底密封到帽的较低熔点温度区域的薄互连区域。

5. 发明授权

US5971058A Apparatus and method for continuous casting solder onto discrete parts 失效
标题翻译：将焊料连续铸造到分立零件上的装置和方法
公开(公告)号：US5971058A
公开(公告)日：1999-10-26
申请号：US876140
申请日：1997-06-13
申请人： Lannie R. Bolde , James H. Covell, II
发明人： Lannie R. Bolde , James H. Covell, II
IPC分类号： B23K3/06 , H05K3/34 , B22D33/04
CPC分类号： B23K3/0607 , H05K3/3457 , B23K2201/40 , H05K2203/0113 , H05K2203/1545
摘要： An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds. The preferred mold design utilizes an upper plate having mold opening, and a lower substrate or backing plate, with the length and width of the upper plate being slightly longer than the length and width of the lower substrate or late.
摘要翻译：提供了一种装置和方法，用于将熔融焊料连续地注入多个模具中，以将形成的焊料块转移到电子器件如多层陶瓷封装。常规的注射成型装置采用专门设计的用于形成模具的装置，优选地具有专门设计的模具以提供连续的模制工艺。该装置优选为U形构造，由此模具在熔融的焊料储存器和注射头的前方通过前述的模具在装置中前进。前一模具在后续模具上的推动作用，优选结合优选的模具设计，能够实现将熔融焊料注入多个模具中的连续方法和设备。优选的模具设计利用具有模具开口的上板和下基板或背板，上板的长度和宽度比下基板的长度和宽度稍长，或较晚。

6. 发明授权

US5961032A Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold 失效
标题翻译：通过堵塞模具中的通孔的一部分来制造多组分焊料柱的方法
公开(公告)号：US5961032A
公开(公告)日：1999-10-05
申请号：US884977
申请日：1997-06-30
申请人： James H. Covell, II , Shaji Farooq , Peter A. Gruber , Sudipta K. Ray
发明人： James H. Covell, II , Shaji Farooq , Peter A. Gruber , Sudipta K. Ray
IPC分类号： B22C9/22 , B23K3/06 , B23K35/02 , H01L21/60 , H01L23/12 , H01L23/50 , H05K3/34 , B23K35/012 , B23K31/002 , B22C9/020
CPC分类号： H05K3/3468 , B22C9/22 , B23K3/0607 , B23K35/0222 , B23K2201/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/16152 , H01L2924/19105 , H05K2201/0379 , H05K2201/10992 , H05K2203/0113 , H05K2203/0338 , H05K2203/128 , H05K3/3463
摘要： A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.
摘要翻译：描述了用于形成用于附接到电子设备的焊接凸块的方法。焊料块优选为柱状，并且包括第一焊料部分和第二焊料部分，其中两个焊料部分具有不同的熔点。焊料柱优选使用注射成型装置形成。该方法涉及使用单柱模具来形成多焊料柱。在一个实施例中，可变形材料用于在第一次焊接注入过程期间部分地阻挡模具的通孔的一部分。然后去除可变形材料，并且模具的通孔的其余部分填充有第二熔融焊料。然后通过回流将多焊料柱电连接到衬底。

7. 发明授权

US5504612A Synchronized XY laser scanner 失效
标题翻译：同步XY激光扫描仪
公开(公告)号：US5504612A
公开(公告)日：1996-04-02
申请号：US443634
申请日：1995-05-18
申请人： Joshua M. Cobb , James H. Covell, II , Franz X. Topolovec , Uldis A. Ziemins
发明人： Joshua M. Cobb , James H. Covell, II , Franz X. Topolovec , Uldis A. Ziemins
IPC分类号： B41J2/44 , B23K26/08 , G02B26/10 , H01L21/027 , H01L21/268 , G02B26/08
CPC分类号： G02B26/101 , Y10S359/90
摘要： An apparatus and method are disclosed for laser raster scanning a substrate in an XY plane wherein a single motor is used to provide synchronized X-Y scanning by two mirrors positioned orthogonally and which move linearly in an XY plane relative to each other by the rotation of the motor shaft. A preferred embodiment uses a specially designed cam to provide back and forth laser scanning motion and an intermittent gear to provide indexing of the laser. The apparatus and method may be configured for various scan speeds, spot sizes, Y-axis indexing and X-axis scan at the object plane. Over scanning of the active XY area of the object plane is preferred to provide constant velocity and energy density over the active XY area.
摘要翻译：公开了用于在XY平面中激光光栅扫描基板的装置和方法，其中使用单个电机来提供通过正交定位的两个反射镜同步的XY扫描，并且通过电动机的旋转在XY平面中相对于彼此线性移动轴。优选实施例使用专门设计的凸轮来提供来回激光扫描运动和间歇齿轮以提供激光的分度。该装置和方法可以被配置用于在物平面处的各种扫描速度，光斑尺寸，Y轴分度和X轴扫描。在对象平面的主动XY区域的扫描是优选的，以在主动XY区域上提供恒定的速度和能量密度。

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