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1. 发明授权

US4602122A Automatically-insertable case suitable for wire-wound magnetic cores 失效
标题翻译：适用于绕线磁芯的自动插入式外壳
公开(公告)号：US4602122A
公开(公告)日：1986-07-22
申请号：US683112
申请日：1984-12-18
申请人： James D. Lint
发明人： James D. Lint
IPC分类号： H01F27/06
CPC分类号： H01F27/06 , H01F2005/046 , H01F2027/065
摘要： A case for holding a wire-wound magnetic core or other electrical component so that the leads can be automatically inserted on a circuit board which employs a base portion that is shaped and dimensioned for compatibility with conventional automatic insertion equipment. The base includes both plastically-deformable cantilever lead traps for mechanically gripping the leads to secure the component on the base as well as circular notches in the slots that define predetermined positions on the base at which to grip the leads to enable use of the case for automatic insertion.
摘要翻译：用于保持绕线磁芯或其他电气部件的壳体，使得引线可以自动插入电路板，该电路板采用成形和尺寸以与常规自动插入设备兼容的基部。基座包括可塑性可变形的悬臂引线收集器，用于机械地夹持引线以将部件固定在基座上，以及在槽中形成圆形凹口，该凹槽限定在基座上的预定位置，在该基座上夹持引线以使壳体能够自动插入

2. 发明授权

US5309130A Self leaded surface mount coil lead form 失效
标题翻译：自引脚表面安装线圈引线形式
公开(公告)号：US5309130A
公开(公告)日：1994-05-03
申请号：US968035
申请日：1992-10-26
申请人： James D. Lint
发明人： James D. Lint
IPC分类号： H01F17/06 , H01F27/29 , H05K3/30 , H01F15/02
CPC分类号： H01F27/292 , H01F17/062 , H05K3/301
摘要： A self leaded holder for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, lead ports extending from the cavity through the sides, an inductance coil mounted in the cavity, and a lead extending from the coil via the lead ports to and wound a partial turn around each of the lead support members and disposed for surface bonding to a PC board.
摘要翻译：用于将电路元件表面安装到PC板的自引脚保持器包括具有用于安装电路元件的空腔的大致盒形支撑体，所述支撑体具有基部和多个引线支撑构件，所述多个引线支撑构件具有大致的线轴构造从邻近基座的支撑体大致水平地向外延伸，从空腔延伸通过侧面的引出端口，安装在空腔中的电感线圈以及从线圈经由引线端口延伸到绕线部分的绕组引线支撑构件并且用于表面结合到PC板。

3. 发明授权

US5253145A Compliant cantilever surface mount lead 失效
标题翻译：符合悬臂表面安装导线
公开(公告)号：US5253145A
公开(公告)日：1993-10-12
申请号：US824985
申请日：1992-01-24
申请人： James D. Lint
发明人： James D. Lint
IPC分类号： H05K3/34 , H05K13/04 , H05K7/14
CPC分类号： H05K13/046 , H05K3/3426 , H05K2201/1003 , H05K2201/10325 , H05K2201/10818 , Y02P70/613
摘要： A compliant lead structure for mounting a circuit element to a PC board comprises a support body for supporting a circuit element, a plurality of elongated compliant cylindrical conductive lead members secured at an inner end to the support body and extending outward from the support body substantially perpendicular to a mounting plane of a PC board to which the support body is to be mounted and to a position for surface bonding to a PC board, the lead members having an elongated unrestricted section between the inner end and the outer end for enabling relative movement between the support body and a PC board to which the lead member is bonded, and a lead wire extends from a circuit element on the support body and connected to the lead member.
摘要翻译：用于将电路元件安装到PC板的兼容引线结构包括用于支撑电路元件的支撑体，多个细长顺应性圆柱形导电引线构件，其在内端固定到支撑体并从支撑体向外基本垂直连接到要安装支撑体的PC板的安装平面和用于表面粘合到PC板的位置，所述引线构件在内端和外端之间具有细长的无限制部分，以使得能够相对于第所述支撑体和所述引线部件接合的PC板，并且引线从所述支撑体上的电路元件延伸并连接到所述引线部件。

4. 发明授权

US4614030A Method and apparatus for automatically processing the wire ends of wound toroidal cores 失效
标题翻译：用于自动处理缠绕环形铁芯的线端的方法和装置
公开(公告)号：US4614030A
公开(公告)日：1986-09-30
申请号：US734961
申请日：1985-05-16
申请人： James D. Lint , Bryan P. Kent
发明人： James D. Lint , Bryan P. Kent
IPC分类号： B23D31/00 , H01F41/10 , H01R43/28 , H01R43/00 , B23P19/00
CPC分类号： B23D31/00 , H01F41/10 , H01R43/28 , Y10S29/078 , Y10T29/49224 , Y10T29/53404 , Y10T29/53539
摘要： An apparatus for automatically processing the wire ends of cores includes a forming die for bending the axially projecting wire ends back to project parallel to one another generally away from the core. Cores are received in a receiving station aligned with the forming die and orientated so that the wire ends are spaced as far as possible from the die. When the wire ends are sensed to be in the correct orientation, an actuator is operated to push the core through the forming die. The core with its wire ends bent back is then preferably stepped through a series of processing stations to trim and tin the wire ends and then ejected from the machine. A series of cores can be stepped continuously one after the other through the machine.
摘要翻译：用于自动处理芯线的端部的装置包括：成形模，用于将轴向突出的导线端部弯曲回地平行于彼此平行地突出远离芯部。芯接收在与成形模对准的接收站中并定向，使得线端尽可能远离模具间隔开。当电线端部被感测为正确的方向时，致动器被操作以推动芯体通过成形模具。然后将其电线端部弯曲回来的铁芯穿过一系列处理站，以修整和锡线，然后从机器上弹出。一系列芯可以通过机器一个接一个地连续地步进。

5. 发明授权

US6005463A Through-hole interconnect device with isolated wire-leads and component barriers 失效
标题翻译：具有隔离导线和元件屏障的通孔互连装置
公开(公告)号：US6005463A
公开(公告)日：1999-12-21
申请号：US791247
申请日：1997-01-30
申请人： James D. Lint , Aurelio J. Gutierrez , Victor H. Renteria
发明人： James D. Lint , Aurelio J. Gutierrez , Victor H. Renteria
IPC分类号： H01F27/02 , H01R4/02 , H01R4/12 , H05K3/30 , H01F27/06 , H01F27/29
CPC分类号： H01F27/027 , H05K3/301 , H01L2924/0002 , H01R4/02 , H01R4/12
摘要： A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes. The leads are inserted into the through-holes such that they protrude below the bottom surface of the base element, thereby facilitating soldering of all such connections in a single process step. This arrangement reduces manufacturing and labor costs and increases component and overall package reliability.
摘要翻译：用于将微电子封装内的各种电子元件的引线电连接的装置。提供具有多个电子元件屏障和导线通孔的非导电基底构件。通孔通常位于基体元件的内部区域内，以最小化引线与外部封装端子之间潜在的有害的场相互作用或电容耦合。在包装组装期间，电子元件被放置在通过前述屏障形成在基底构件内的凹槽内。这些凹槽和屏障对准元件并有助于在制造过程中保持电气分离和均匀性。从两个或多个元件引出的电线通过将它们扭转在一起并将它们插入其中一个通孔而相互连接。引线插入到通孔中，使得它们突出在基部元件的底表面下方，从而便于在单个工艺步骤中焊接所有这样的连接。这种安排降低了制造和人力成本，并增加了部件和整体包装的可靠性。

6. 发明授权

US5986894A Microelectronic component carrier and method of its manufacture 失效
标题翻译：微电子元件载体及其制造方法
公开(公告)号：US5986894A
公开(公告)日：1999-11-16
申请号：US045379
申请日：1998-03-19
申请人： James D. Lint , Nanci Vogtli
发明人： James D. Lint , Nanci Vogtli
IPC分类号： H01F5/04 , H01F17/06 , H01F27/02 , H01F27/29 , H01F41/10 , H01L23/32 , H01R43/01 , H05K3/30 , H05K5/02 , H01F27/28 , H05K7/02
CPC分类号： H01F41/10 , H01F17/062 , H01F27/027 , H01L23/32 , H05K3/301 , H01F27/29 , H01F5/04 , H01L2924/0002
摘要： A microelectronic component carrier package and method of its manufacture. A non-conducting component carrier having vertical risers and guide channels permits the rapid and accurate routing of microelectronic component leads with respect to the leadframe. Specially shaped perforations in the leadframe adjacent to and aligned with the guide channels receive the leads, strip away the necessary amount of insulation, and sever the leads to the proper length in one manufacturing process step. The leads are joined to the leadframe by an interference fit, conventional bonding technique (such as solder or thermal compression bonding), or other techniques. The perforations further provide for stress relief of the leads in the assembled package, and permit the joints between the leadframe and leads to reside outside of the package, thereby minimizing the overall volume of the package. The perforations may also be used as masks for laser energy used to strip insulation from the leads in the vicinity of the perforations.
摘要翻译：一种微电子元件载体封装及其制造方法。具有垂直立管和引导通道的非导电部件载体允许微电子元件引线相对于引线框的快速和准确的布线。在引导框架中与引导通道相邻并与引导通道对准的特殊形状的穿孔接收引线，剥离必要量的绝缘体，并且在一个制造工艺步骤中将引线切断到合适的长度。引线通过干涉配合，常规粘合技术（例如焊料或热压接）或其它技术连接到引线框架上。这些穿孔进一步提供了组装好的包装中引线的应力消除，并且允许引线框架和引线之间的接合部位于封装的外部，从而最小化封装的总体积。穿孔也可以用作用于从穿孔附近的引线剥离绝缘的激光能量的掩模。

7. 发明授权

US5455741A Wire-lead through hole interconnect device 失效
标题翻译：导线通孔互连装置
公开(公告)号：US5455741A
公开(公告)日：1995-10-03
申请号：US143306
申请日：1993-10-26
申请人： Ka K. Wai , Moin Ahmad , Aurelio J. Gutierrez , James D. Lint
发明人： Ka K. Wai , Moin Ahmad , Aurelio J. Gutierrez , James D. Lint
IPC分类号： H05K1/11 , H05K1/18 , H05K3/34 , H05K3/40 , B65D73/02
CPC分类号： H05K1/119 , H05K1/116 , H05K1/183 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09827 , H05K2201/09845 , H05K2201/1003 , H05K3/3447 , H05K3/403 , Y10T29/49139 , Y10T29/49147 , Y10T29/49153
摘要： An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.
摘要翻译：一种电子设备包括一个具有在第一表面中具有至少一个空腔的非导电材料的三维电子元件保持器，以及多个引线通孔，其具有从腔体延伸到具有电路的第二表面的入口引导件，电子元件，其安装在所述腔中并具有多个引线，多个所述引线经由所述通孔从所述元件延伸到所述第二表面;以及多个引线端子凹部，形成在所述第二表面处以用于接收和形成端部，引线与第二表面电路的连接。

8. 发明授权

US5015981A Electronic microminiature packaging and method 失效
标题翻译：电子微型包装及方法
公开(公告)号：US5015981A
公开(公告)日：1991-05-14
申请号：US570894
申请日：1990-08-21
申请人： James D. Lint , Aurelio J. Gutierrez
发明人： James D. Lint , Aurelio J. Gutierrez
IPC分类号： H01F27/02 , H05K3/30
CPC分类号： H01F27/027 , H05K3/301 , Y10T29/4902 , Y10T29/49169 , Y10T29/49171
摘要： An electronic device having a plurality of leads comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity therein and a plurality of lead slots extending from the cavity to a base of the holder, an electronic element mounted in the cavity and having a plurality of leads extending therefrom, a plurality of the leads extending within the slots from the element to the base, and a plurality of lead terminals mounted on the holder and each having one end extending into one of the slots into conducting engagement with a lead and a free end extending outward therefrom.
摘要翻译：具有多个引线的电子设备包括其中具有至少一个空腔的非导电材料的三维电子元件保持器以及从所述空腔延伸到所述保持器的基座的多个引线槽，安装在所述电子元件中的电子元件并且具有从其延伸的多个引线，从所述元件到所述基座在所述槽内延伸的多个引线，以及安装在所述保持器上并且每个所述引线端子延伸到所述槽中的一个的导电接合中的多个引线端子具有从其向外延伸的铅和自由端。

9. 发明授权

US4288041A Shuttleless toroidal core winder 失效
标题翻译：无梭环形卷芯机
公开(公告)号：US4288041A
公开(公告)日：1981-09-08
申请号：US101829
申请日：1979-12-10
申请人： Willy Marzec , James D. Lint
发明人： Willy Marzec , James D. Lint
IPC分类号： B65H81/02 , B65H81/04 , H01F41/08
CPC分类号： H01F41/08
摘要： Disclosed is an apparatus for simultaneously winding multiple strands of wire into turns about a toroidal core in rapid fashion. The apparatus includes a U-shaped wire receiving channel having a semi-circular portion with a gap and a pair of open-ended legs. The ends of the channel legs are positioned adjacent opposite sides of a rotatably mounted drum which is driven by a resilient endless belt engaging approximately one half of its annular outer surface. A toroidal core is supplied and rigidly supported in the gap by a core feeding mechanism. A grooved gap crosser is thereafter extended through the central opening of the core to bridge the gap and complete the channel. A pair of pinch roller type feed/brake mechanisms propel and guide the leading ends of the wires into the channel, through the core opening, and up one channel leg to the drum. There the wires are frictionally held between the drum and the belt and they are positively driven into the other channel leg, through the core opening, and back to the drum. Continued feeding of the wire results in the formation of a coil having a plurality of vertically stacked, oval-shaped loops which extend through the core opening and are alternately made of different ones of the wires. Thereafter, staggered braking of the trailing ends of the wires causes the loops to be successively peeled radially inwardly from the channel and the drum as the coil is continuously circulated. The loops are tightened into turns about the core as it is slowly rotated about its axis by the core feeding mechanism. First and second shear mechanisms cut off the trailing and leading ends of the wires at the beginning and end of the winding operation, respectively.
摘要翻译：公开了一种用于以快速方式同时绕多环绕多个线圈卷绕环形芯的装置。该装置包括具有间隙的半圆形部分和一对开口端的U形导线接收通道。通道腿的端部邻近可旋转地安装的滚筒的相对侧定位，该滚筒由接合其环形外表面的大约一半的弹性环形带驱动。一个环形芯被提供并通过一个芯进给机构刚性地支承在间隙中。然后，沟槽间隙交叉器延伸穿过芯的中心开口以桥接间隙并完成通道。一对夹送辊式进给/制动机构推动并将导线的前端引导通过通道，通过芯部开口，并将一个通道支腿引导到滚筒。电线被摩擦地保持在滚筒和皮带之间，并且它们通过芯部开口被确实地驱动到另一个通道支腿中并返回到滚筒。线的继续进给导致形成具有多个垂直堆叠的椭圆形环的线圈，该椭圆形环延伸穿过芯开口，并且交替地由不同的导线制成。此后，线的后端的交错制动导致环路随着线圈连续循环而从通道和鼓径向向内剥离。当芯通过芯进给机构绕其轴线缓慢旋转时，环被围绕芯紧固。第一和第二剪切机构分别在卷绕操作的开始和结束时切断导线的后端和前端。

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