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1. 发明授权

US6132688A Method and apparatus for treating exhaust gas from a semiconductor fabrication machine 失效
标题翻译：用于处理来自半导体制造机器的废气的方法和装置
公开(公告)号：US6132688A
公开(公告)日：2000-10-17
申请号：US73580
申请日：1998-05-06
申请人： J. S. Hsiue , B. H. Yang , T. J. Fang , J. J. Wang , W. C. Lee , T. D. Chang , C. S. Chung , W. F. Chuang
发明人： J. S. Hsiue , B. H. Yang , T. J. Fang , J. J. Wang , W. C. Lee , T. D. Chang , C. S. Chung , W. F. Chuang
IPC分类号： B01D5/00 , B01D53/00 , B01D53/04 , B01D53/34 , B01J8/00
CPC分类号： B01D53/002 , B01D5/0075 , B01D5/0081 , B01D2253/102 , B01D2257/70 , B01D2258/0216 , B01D53/04
摘要： A method and apparatus for treating exhaust gas from a semiconductor fabrication machine by utilizing a dual-stage apparatus are disclosed. The dual-stage apparatus utilizes a first stage treatment of a condensation unit for removing high boiling temperature contents in the exhaust gas and a second stage treatment in fluid communication with the first stage treatment of an absorption unit for removing low boiling temperature contents in the exhaust gas or contents that were not previously removed in the first stage treatment. The condensation unit can be operated efficiently at a temperature range between about 5.degree. C. and about 15.degree. C., while the partially-treated exhaust gas exiting the condensation unit can be pre-heated to a temperature between about 20.degree. C. and about 40.degree. C. prior to entering the absorption unit for removal of the low boiling temperature contents.
摘要翻译：公开了一种通过利用双级装置来处理来自半导体制造机的废气的方法和装置。双级装置利用冷凝装置的第一级处理来除去废气中的高沸点含量的第一级处理和与排气中的低沸点含量一起除去的吸收单元的第一级处理流体连通的第二级处理在第一阶段处理中以前未被除去的气体或内容物。冷凝单元可以在约5℃至约15℃的温度范围内有效地操作，而从冷凝单元排出的经部分处理的废气可以预热至约20℃至在进入吸收单元之前约40℃以除去低沸点的内容物。

2. 发明授权

US07810396B2 Test device for electronic product 有权
标题翻译：电子产品测试装置
公开(公告)号：US07810396B2
公开(公告)日：2010-10-12
申请号：US12315909
申请日：2008-12-08
申请人： J. J. Wang , Li-Min Sun
发明人： J. J. Wang , Li-Min Sun
IPC分类号： G01N3/08
CPC分类号： G01N3/08 , G01N2203/0441
摘要： A test device for an electronic product includes a vertical pressing pole having a pushing end. The test device also includes a movable platform with a sticking point, wherein upward movement of the movable platform moves the vertical pressing pole upwards by the sticking point. The vertical pressing pole passes through a balance weight which rests on the sticking point. A pressurized platform bears pressure from the pushing end, when the pushing end is pushed onto the pressurized platform. A load-bearing platform supports the pressurized platform and the electronic product located below the pressurized platform. The product is pressed between the pressurized platform and the load-bearing platform due to the pressure from the pushing end lying on the pressurized platform. When the movable platform is further moved downwards after the pushing end is on the pressurized platform, the sticking point bearing the balance weight is separate from the movable platform.
摘要翻译：一种用于电子产品的测试装置包括具有推动端的垂直按压杆。测试装置还包括具有粘着点的可移动平台，其中可移动平台的向上运动使垂直按压杆向上移动粘着点。垂直按压杆穿过搁置点上的平衡重。当推动端被推到加压平台上时，加压平台承受来自推动端的压力。承载平台支撑加压平台和位于加压平台下方的电子产品。由于来自位于加压平台上的推动端的压力，产品被压在加压平台和承重平台之间。当推动端在加压平台上之后，当可移动平台进一步向下移动时，承载平衡重的粘着点与可移动平台分开。

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