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    • 5. 发明申请
    • Anti-clogging nozzle for semiconductor processing
    • 防堵塞喷嘴用于半导体加工
    • US20050218115A1
    • 2005-10-06
    • US11080387
    • 2005-03-14
    • Lawrence LeiSiqing LuSteven GianoulakisIrene ChouDavid Sun
    • Lawrence LeiSiqing LuSteven GianoulakisIrene ChouDavid Sun
    • G01L21/30H01L21/302
    • C23C16/45563
    • Embodiments of the present invention are directed to reducing clogging of nozzles and to reducing flow variance through the nozzles in a semiconductor processing chamber. In one embodiment, a method of introducing a gas into a semiconductor processing chamber comprises providing a nozzle having a proximal portion connected to a chamber wall or a gas distribution ring of the semiconductor processing chamber and a distal portion oriented inwardly away from the chamber wall into an interior of the semiconductor processing chamber. The nozzle includes a proximal end coupled with a gas supply. The nozzle includes a nozzle opening at a distal end. The nozzle includes a nozzle passage extending from the proximal end to the distal end. The method further comprises flowing a gas from the gas supply through the proximal end, the nozzle passage, and the nozzle opening of the nozzle into the interior of the semiconductor processing chamber; and choking the gas flow through the nozzle passage at a choke location which is spaced away from the distal end.
    • 本发明的实施例涉及减少喷嘴堵塞和减少半导体处理室中的喷嘴的流动变化。 在一个实施例中,将气体引入半导体处理室的方法包括提供喷嘴,该喷嘴具有连接到半导体处理室的室壁或气体分配环的近端部分,以及远离室壁向内取向的远侧部分 半导体处理室的内部。 喷嘴包括与气体供应连接的近端。 喷嘴包括在远端的喷嘴开口。 喷嘴包括从近端延伸到远端的喷嘴通道。 该方法还包括使气体从气体供应通过喷嘴的近端,喷嘴通道和喷嘴开口流入半导体处理室的内部; 并且在与远端间隔开的扼流位置处阻塞气体流过喷嘴通道。