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1. 发明授权

US08324032B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08324032B2
公开(公告)日：2012-12-04
申请号：US13152492
申请日：2011-06-03
申请人： Hideto Ohnuma , Ichiro Uehara
发明人： Hideto Ohnuma , Ichiro Uehara
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L21/28114 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/66598 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863 , Y10S438/949
摘要： Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing, the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.
摘要翻译：通常以半导体器件中的LDD结构和GOLD结构的形式，以栅电极作为掩模进行自对准，但是栅电极具有两层结构的情况很多，成膜工艺和蚀刻工艺变得复杂。此外，为了仅通过诸如干蚀刻的工艺来形成LDD结构和GOLD结构，晶体管结构都具有相同的结构，并且难以分别形成用于不同电路的LDD结构，GOLD结构和单个漏极结构。通过对光栅掩模或掩模版形成栅极电极的光刻工艺，建立了具有降低光的强度并由衍射光栅图案或半透明膜构成的功能的补充图案，GOLD结构，LDD结构和单漏极通过干蚀刻和离子注入工艺步骤可以容易地为不同的电路制造结构晶体管。

2. 发明授权

US07655328B2 Conductive, plasma-resistant member 有权
标题翻译：导电，耐等离子体成员
公开(公告)号：US07655328B2
公开(公告)日：2010-02-02
申请号：US11785682
申请日：2007-04-19
申请人： Takao Maeda , Yuuichi Makino , Hajime Nakano , Ichiro Uehara
发明人： Takao Maeda , Yuuichi Makino , Hajime Nakano , Ichiro Uehara
IPC分类号： B32B9/00
CPC分类号： C23C4/08 , C23C4/06 , Y10T428/31678
摘要： An electrically conductive, plasma-resistant member adapted for exposure to a halogen-based gas plasma atmosphere includes a substrate having formed on at least part of a region thereof to be exposed to the plasma a thermal spray coating composed of yttrium metal or yttrium metal in admixture with yttrium oxide and/or yttrium fluoride so as to confer electrical conductivity. Because the member is conductive and has an improved erosion resistance to halogen-based corrosive gases or plasmas thereof, particle contamination due to plasma etching when used in semiconductor manufacturing equipment or flat panel display manufacturing equipment can be suppressed.
摘要翻译：适于暴露于基于卤素的气体等离子体气氛的导电等离子体构件包括在其至少部分区域上形成以暴露于等离子体的基底，其由钇金属或钇金属组成的热喷涂与氧化钇和/或氟化钇混合以赋予导电性。由于该部件是导电的并且具有改进的对卤素腐蚀性气体或其等离子体的耐腐蚀性，因此可以抑制当用于半导体制造设备或平板显示器制造设备时由于等离子体蚀刻引起的颗粒污染。

3. 发明授权

US07514868B2 Display device and method of fabricating the display device 有权
公开(公告)号：US07514868B2
公开(公告)日：2009-04-07
申请号：US10827709
申请日：2004-04-20
申请人： Shunpei Yamazaki , Hideomi Suzawa , Ichiro Uehara
发明人： Shunpei Yamazaki , Hideomi Suzawa , Ichiro Uehara
IPC分类号： H05B33/00
CPC分类号： H01L27/323 , H01L27/1214 , H01L27/124 , H01L27/1248 , H01L27/3246 , Y10S428/917
摘要： In an EL element having an anode, an insulating film (bump) formed on the anode, and an EL film and a cathode formed on the insulating film, each of a bottom end portion and a top end portion of the insulating film is formed so as to have a curved surface. The taper angle of a central portion of the insulating film is set within the range from 35° to 70°, thereby preventing the gradient of the film forming surface on which the EL film and the cathode are to be formed from being abruptly changed. On the thus-formed film forming surface, the EL film and the cathode can be formed so as to be uniform in thickness, so that occurrence of discontinuity in each of EL film and the cathode is prevented.

4. 发明申请

US20080182209A1 Method of Fabricating Semiconductor Device, and Developing Apparatus Using the Method 有权
标题翻译：使用该方法制造半导体器件的方法和显影装置
公开(公告)号：US20080182209A1
公开(公告)日：2008-07-31
申请号：US12016244
申请日：2008-01-18
申请人： Masaharu Nagai , Ichiro Uehara
发明人： Masaharu Nagai , Ichiro Uehara
IPC分类号： G03F7/26
CPC分类号： H01L27/1288 , G03F7/40 , H01L21/0273 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/4908 , H01L29/66757 , H01L29/78621 , H01L29/78675
摘要： In a resist pattern forming method in which bake processing is performed at a temperature not lower than a glass transition temperature in order to obtain the desired sidewall angle, resist removable is difficult. Accordingly, in the resist pattern forming method of performing bake processing at a temperature not lower than a glass transition temperature, a process margin for resist removability cannot be ensured, so that there is the problem that it is impossible to compatibly realize both the formation of a resist pattern having the desired sidewall angle and the resist removability of the resist pattern. The invention aims to solve the problem. A resist pattern including a diazonaphthoquinone (DNQ)-novolac resin type of positive resist is formed, and the resist pattern is irradiated with light within the range of photosensitive wavelengths of a DNQ photosensitizer to perform bake processing on the resist pattern at a temperature not lower than the glass transition temperature of the resist pattern.
摘要翻译：在为了获得期望的侧壁角度而在不低于玻璃化转变温度的温度进行烘烤处理的抗蚀剂图案形成方法中，难以除去抗蚀剂。因此，在不低于玻璃化转变温度的温度进行烘烤处理的抗蚀剂图案形成方法中，不能确保抗蚀剂除去性的工艺余量，所以存在不能兼容地实现抗蚀剂图案具有期望的侧壁角度和抗蚀剂图案的抗蚀剂可除去性。本发明旨在解决问题。形成包含重氮萘醌（DNQ） - 新型异氰酸酯树脂型正性抗蚀剂的抗蚀剂图案，用DNQ光敏剂的光敏波长范围内的光照射抗蚀剂图案，以在不低于的温度对抗蚀剂图案进行烘烤处理比抗蚀剂图案的玻璃化转变温度高。

5. 发明申请

US20070218604A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20070218604A1
公开(公告)日：2007-09-20
申请号：US11754484
申请日：2007-05-29
申请人： Hideto Ohnuma , Ichiro Uehara
发明人： Hideto Ohnuma , Ichiro Uehara
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L21/28114 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/66598 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863 , Y10S438/949
摘要： Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.
摘要翻译：通常以半导体器件中的LDD结构和GOLD结构的形式，以栅电极作为掩模进行自对准，但是栅电极具有两层结构的情况很多，成膜工艺和蚀刻工艺变得复杂。此外，为了仅通过诸如干蚀刻的工艺来形成LDD结构和GOLD结构，晶体管结构都具有相同的结构，并且难以分别形成用于不同电路的LDD结构，GOLD结构和单个漏极结构。通过应用用于形成栅电极的光刻工艺来形成光掩模或掩模版，其中具有降低光强度并且由衍射光栅图案或半透明膜构成的功能的补充图案，GOLD结构，LDD结构和单漏极结构通过干蚀刻和离子注入工艺步骤可以容易地为不同的电路制造晶体管。

6. 发明申请

US20060014335A1 Method of manufacturing a semiconductor device 有权
公开(公告)号：US20060014335A1
公开(公告)日：2006-01-19
申请号：US11224047
申请日：2005-09-13
申请人： Hideto Ohnuma , Ichiro Uehara
发明人： Hideto Ohnuma , Ichiro Uehara
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L21/28114 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/66598 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863 , Y10S438/949
摘要： Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.

7. 发明授权

US07955912B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07955912B2
公开(公告)日：2011-06-07
申请号：US12823175
申请日：2010-06-25
申请人： Hideto Ohnuma , Ichiro Uehara
发明人： Hideto Ohnuma , Ichiro Uehara
IPC分类号： H01L21/84
CPC分类号： H01L27/1288 , H01L21/28114 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/66598 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863 , Y10S438/949
摘要： Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.
摘要翻译：通常以半导体器件中的LDD结构和GOLD结构的形式，以栅电极作为掩模进行自对准，但是栅电极具有两层结构的情况很多，成膜工艺和蚀刻工艺变得复杂。此外，为了仅通过诸如干蚀刻的工艺来形成LDD结构和GOLD结构，晶体管结构都具有相同的结构，并且难以分别形成用于不同电路的LDD结构，GOLD结构和单个漏极结构。通过应用用于形成栅电极的光刻工艺来形成光掩模或掩模版，其中具有降低光强度并且由衍射光栅图案或半透明膜构成的功能的补充图案，GOLD结构，LDD结构和单漏极结构通过干蚀刻和离子注入工艺步骤可以容易地为不同的电路制造晶体管。

8. 发明申请

US20080119024A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20080119024A1
公开(公告)日：2008-05-22
申请号：US11969247
申请日：2008-01-04
申请人： Hideto Ohnuma , Ichiro Uehara
发明人： Hideto Ohnuma , Ichiro Uehara
IPC分类号： H01L21/04
CPC分类号： H01L27/1288 , H01L21/28114 , H01L21/32136 , H01L21/32139 , H01L27/1214 , H01L29/42384 , H01L29/66598 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863 , Y10S438/949
摘要： Formation of LDD structures and GOLD structures in a semiconductor device is conventionally performed in a self aligning manner with gate electrodes as masks, but there are many cases in which the gate electrodes have two layer structures, and film formation processes and etching processes become complex. Further, in order to perform formation of LDD structures and GOLD structures only by processes such as dry etching, the transistor structures all have the same structure, and it is difficult to form LDD structures, GOLD structures, and single drain structures separately for different circuits. By applying a photolithography process for forming gate electrodes to photomasks or reticles, in which supplemental patterns having a function of reducing the intensity of light and composed of diffraction grating patterns or translucent films, are established, GOLD structure, LDD structure, and single drain structure transistors can be easily manufactured for different circuits through dry etching and ion injection process steps.
摘要翻译：通常以半导体器件中的LDD结构和GOLD结构的形式，以栅电极作为掩模进行自对准，但是栅电极具有两层结构的情况很多，成膜工艺和蚀刻工艺变得复杂。此外，为了仅通过诸如干蚀刻的工艺来形成LDD结构和GOLD结构，晶体管结构都具有相同的结构，并且难以分别形成用于不同电路的LDD结构，GOLD结构和单个漏极结构。通过应用用于形成栅电极的光刻工艺来形成光掩模或掩模版，其中具有降低光强度并且由衍射光栅图案或半透明膜构成的功能的补充图案，GOLD结构，LDD结构和单漏极结构通过干蚀刻和离子注入工艺步骤可以容易地为不同的电路制造晶体管。

9. 发明申请

US20070248832A1 Conductive, plasma-resistant member 有权
标题翻译：导电，耐等离子体成员
公开(公告)号：US20070248832A1
公开(公告)日：2007-10-25
申请号：US11785682
申请日：2007-04-19
申请人： Takao Maeda , Yuuichi Makino , Hajime Nakano , Ichiro Uehara
发明人： Takao Maeda , Yuuichi Makino , Hajime Nakano , Ichiro Uehara
IPC分类号： B32B15/04
CPC分类号： C23C4/08 , C23C4/06 , Y10T428/31678
摘要： An electrically conductive, plasma-resistant member adapted for exposure to a halogen-based gas plasma atmosphere includes a substrate having formed on at least part of a region thereof to be exposed to the plasma a thermal spray coating composed of yttrium metal or yttrium metal in admixture with yttrium oxide and/or yttrium fluoride so as to confer electrical conductivity. Because the member is conductive and has an improved erosion resistance to halogen-based corrosive gases or plasmas thereof, particle contamination due to plasma etching when used in semiconductor manufacturing equipment or flat panel display manufacturing equipment can be suppressed.
摘要翻译：适于暴露于基于卤素的气体等离子体气氛的导电等离子体构件包括在其至少部分区域上形成以暴露于等离子体的基底，其由钇金属或钇金属组成的热喷涂与氧化钇和/或氟化钇混合以赋予导电性。由于该部件是导电的并且具有改进的对卤素腐蚀性气体或其等离子体的耐腐蚀性，因此可以抑制当用于半导体制造设备或平板显示器制造设备时由于等离子体蚀刻引起的颗粒污染。

10. 发明申请

US20070155182A1 Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US20070155182A1
公开(公告)日：2007-07-05
申请号：US11516273
申请日：2006-09-06
申请人： Ichiro Uehara , Hideomi Suzawa
发明人： Ichiro Uehara , Hideomi Suzawa
IPC分类号： H01L21/302
CPC分类号： H01L21/0274 , G03F7/022 , H01L27/1214 , H01L27/127 , H01L27/1288 , H01L29/42384 , H01L29/4908 , H01L29/66757 , H01L29/78621 , H01L29/78627 , H01L2029/7863
摘要： In the manufacturing method of a GOLD structured TFT having a gate electrode of double-layered structure, in which, compared to a second layer gate electrode, the first layer gate electrode is thinner in film thickness and longer in dimension of the channel direction, by controlling the density of the photo-absorbent contained in a positive type resist such as diazonaphthoquinone (DNQ)-novolac resin series, the taper angle of the side wall is controlled to a desired angle range so that the angle thereof becomes smaller. Owing to this, it is possible to control the retreat amount of the resist when carrying out dry etching and the dimension of Lov area to a desired dimensional range so that the dimension thereof becomes larger.
摘要翻译：在具有双层结构的栅电极的GOLD结构TFT的制造方法中，与第二层栅电极相比，第一层栅电极的膜厚度越薄，沟道方向的尺寸越长，通过控制包含在正型抗蚀剂（如重氮萘醌（DNQ）） - 新鲜树脂系列中的光吸收剂的密度，将侧壁的锥角控制在期望的角度范围，使其角度变小。由此，可以在进行干法蚀刻时将抗蚀剂的退避量控制在所需的尺寸范围内，使其尺寸变大。

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