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    • 1. 发明申请
    • Single chip data processing device with embedded nonvolatile memory and method thereof
    • 具有嵌入式非易失性存储器的单片数据处理装置及其方法
    • US20070298571A1
    • 2007-12-27
    • US11896560
    • 2007-09-04
    • Weon-Ho ParkSang-Soo KimHyun-Khe YooSung-Chul ParkByoung-Ho KimJu-Ri KimSeung-Beom YoonJeong-Uk Han
    • Weon-Ho ParkSang-Soo KimHyun-Khe YooSung-Chul ParkByoung-Ho KimJu-Ri KimSeung-Beom YoonJeong-Uk Han
    • H01L21/8247
    • H01L27/11526H01L21/76224H01L21/823842H01L21/823857H01L21/823892H01L27/0922H01L27/105H01L27/11546
    • A device is described comprising a substrate of a first conductivity type having a first dopant concentration, a first well formed in the substrate, a second well of the first conductivity type formed in the substrate and being deeper than the first well, the second well having a higher dopant concentration than the first dopant concentration, and a nonvolatile memory cell formed on the second well. A device is described comprising four wells of various conductivity types with a nonvolatile memory cell formed on the second well. A device is described comprising a plurality of wells for isolating transistors of a plurality of voltage ranges, wherein each one of the plurality of wells contains at least one transistor of a particular voltage range, and wherein transistors of only one of the plurality of voltage ranges are within each of the plurality of wells. A method is described of isolating transistors of a first voltage range from transistors of another voltage range, comprising forming a first well to hold transistors only of a first particular voltage range, and forming a second well to hold transistors only of a second particular voltage range.
    • 描述了一种器件,其包括具有第一掺杂剂浓度的第一导电类型的衬底,在衬底中形成的第一阱,在衬底中形成并且比第一阱更深的第一导电类型的第二阱,第二阱具有 比第一掺杂剂浓度高的掺杂剂浓度,以及形成在第二阱上的非易失性存储单元。 描述了一种装置,其包括具有形成在第二阱上的非易失性存储单元的各种导电类型的四个阱。 描述了一种器件,其包括用于隔离多个电压范围的晶体管的多个阱,其中多个阱中的每一个阱包含特定电压范围的至少一个晶体管,并且其中仅一个电压范围的晶体管 在多个孔的每一个内。 描述了一种将第一电压范围的晶体管与另一电压范围的晶体管隔离的方法,包括形成第一阱以仅保持第一特定电压范围的晶体管,以及形成第二阱以仅将晶体管保持在第二特定电压范围 。
    • 2. 发明申请
    • Method of manufacturing NOR-type mask ROM device and semiconductor device including the same
    • 制造NOR型掩模ROM器件的方法和包括该器件的半导体器件
    • US20070275509A1
    • 2007-11-29
    • US11882656
    • 2007-08-03
    • Hyun-Khe YooWeon-ho ParkByoung-ho Kim
    • Hyun-Khe YooWeon-ho ParkByoung-ho Kim
    • H01L21/8246
    • H01L27/11266H01L21/823462H01L27/105H01L27/112H01L27/11293
    • A method of manufacturing a NOR-type mask ROM device includes forming a first gate electrode for an OFF cell and a second gate electrode for an ON cell on a semiconductor substrate of a first conductivity type. To code the mask ROM device, a plurality of source/drain regions is formed by implanting impurities of a second conductivity type, opposite the first conductivity type, into the semiconductor substrate adjacent only to one side of the first gate electrode and adjacent to both sides of the second gate electrode. To prevent misalignment of a bit line contact hole with a contact region, additional impurities are implanted only into a bit line contact region of the mask ROM device region. When a semiconductor device formed on the same substrate as the mask ROM device includes a double diffused region, additional implantation for both may be realized simultaneously.
    • 一种制造NOR型掩模ROM器件的方法包括在第一导电类型的半导体衬底上形成用于OFF电池的第一栅电极和用于ON电池的第二栅电极。 为了对掩模ROM器件进行编码,通过将与第一导电类型相反的第二导电类型的杂质注入到仅与第一栅电极的一侧相邻并且邻近第二侧的半导体衬底中来形成多个源极/漏极区域 的第二栅电极。 为了防止与接触区域的位线接触孔不对准,仅将额外的杂质注入到掩模ROM器件区域的位线接触区域中。 当形成在与掩模ROM器件相同的衬底上的半导体器件包括双扩散区域时,可以同时实现两者的附加注入。
    • 9. 发明申请
    • EEPROM device and method of fabricating the same
    • EEPROM装置及其制造方法
    • US20060199334A1
    • 2006-09-07
    • US11418425
    • 2006-05-04
    • Weon-Ho ParkHyun-Khe Yoo
    • Weon-Ho ParkHyun-Khe Yoo
    • H01L21/336
    • H01L27/11521H01L27/115H01L27/11524H01L29/42324
    • A memory device comprises a semiconductor substrate of a first conductive type, a memory transistor, a select transistor, a floating junction region, a common source region, and a bit line junction region. The memory transistor positions on the semiconductor substrate and comprises a gate insulating film formed on the semiconductor substrate and a memory transistor gate formed on the gate insulating film. The gate insulating film includes a tunnel insulating film. The select transistor positions on the semiconductor substrate and is separated from the memory transistor gate. The select transistor comprises a gate insulating film formed on the semiconductor substrate and a select transistor gate formed on the gate insulating film. A floating junction region is formed of a second conductive type on the semiconductor substrate below the tunnel insulating film. The common source region of a second conductive type is formed on the semiconductor substrate adjacent to the memory transistor gate and separated from the floating junction region. A bit line junction region of a second conductive type is formed on the semiconductor substrate adjacent to the select transistor gate and is separated from the floating junction region, wherein the common source region includes a single junction region with a first doping concentration, and a depth of the common source region is shallower than a depth of the floating junction region and the bit line junction region.
    • 存储器件包括第一导电类型的半导体衬底,存储晶体管,选择晶体管,浮动结区域,公共源极区域和位线结区域。 存储晶体管位于半导体衬底上并且包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的存储晶体管栅极。 栅极绝缘膜包括隧道绝缘膜。 选择晶体管位于半导体衬底上并与存储晶体管栅极分离。 选择晶体管包括形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的选择晶体管栅极。 在隧道绝缘膜下方的半导体衬底上,由第二导电类型形成浮接区。 第二导电类型的公共源极区域形成在与存储晶体管栅极相邻并且与浮置结区域分离的半导体衬底上。 第二导电类型的位线结区域形成在与选择晶体管栅极相邻的半导体衬底上,并与浮置结区域分离,其中公共源极区域包括具有第一掺杂浓度的单结区域和深度 公共源极区域比浮置结区域和位线结区域的深度浅。