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    • 1. 发明授权
    • Method for coding mask read-only memory
    • 掩码只读存储器的编码方法
    • US5891781A
    • 1999-04-06
    • US924318
    • 1997-09-05
    • Sung Gon Choi
    • Sung Gon Choi
    • H01L21/82H01L21/8246H01L27/112H01L21/22
    • H01L27/11266H01L27/112
    • A method for coding a mask read-only memory (ROM) implants impurity ions into a semiconductor substrate so as to form a first impurity region, and forms a plurality of gate electrodes on the semiconductor substrate. Next, sidewalls on both sides of each of the gate electrodes are formed, and source and drain impurity regions are formed in the semiconductor substrate at respective sides of each of the gate electrodes. Then a mask over the semiconductor substrate, which exposes at least one of the gate electrodes and which exposes the source and drain impurity regions associated with the exposed gate electrode, is formed, and code ions are implanted into the semiconductor substrate. The semiconductor substrate is also annealed so that the source and drain impurity regions associated with the exposed gate electrode electrically contact the first impurity region.
    • 用于对掩模只读存储器(ROM)进行编码的方法将杂质离子注入到半导体衬底中以形成第一杂质区,并在半导体衬底上形成多个栅电极。 接下来,形成每个栅电极两侧的侧壁,并且在每个栅极的各个侧面的半导体衬底中形成源极和漏极杂质区。 然后,形成半导体衬底上的掩模,其露出至少一个栅电极并暴露与暴露的栅电极相关的源极和漏极杂质区,并且将码离子注入到半导体衬底中。 半导体衬底也被退火,使得与暴露的栅极电极相关联的源极和漏极杂质区域与第一杂质区域电接触。
    • 3. 发明申请
    • Method of fabricating nonvolatile memory device
    • 制造非易失性存储器件的方法
    • US20080076242A1
    • 2008-03-27
    • US11893063
    • 2007-08-14
    • Sung-Gon ChoiHyun-Khe YooBo-Young SeoChang-Min JeonJi-Do Ryu
    • Sung-Gon ChoiHyun-Khe YooBo-Young SeoChang-Min JeonJi-Do Ryu
    • H01L21/3205
    • H01L27/11526H01L27/11546
    • A method of fabricating a nonvolatile memory device includes preparing a semiconductor substrate having a cell array region and a peripheral circuit region. Cell gate patterns are formed in the cell array region, and peripheral gate patterns are formed in the peripheral circuit region. Each of the cell gate patterns includes a control gate pattern and a capping pattern, and each of the peripheral gate patterns has a smaller thickness than the cell gate pattern. An interlayer dielectric layer is formed on the resultant structure having the cell gate patterns and the peripheral gate patterns. The interlayer dielectric layer is planarized by etching until the top surface of the capping pattern is exposed, so that an interlayer dielectric pattern is formed. The interlayer dielectric pattern covers the peripheral circuit region and fills a space between the cell gate patterns. An ion implantation process is performed using the interlayer dielectric pattern as an ion mask so that impurity ions are selectively implanted into the control gate pattern.
    • 制造非易失性存储器件的方法包括制备具有单元阵列区域和外围电路区域的半导体衬底。 在单元阵列区域中形成单元栅极图案,并且在外围电路区域中形成外围栅极图案。 每个单元栅极图案包括控制栅极图案和封盖图案,并且每个外围栅极图案具有比单元栅极图案更小的厚度。 在具有单元栅极图案和外围栅极图案的合成结构上形成层间介电层。 通过蚀刻来平坦化层间绝缘层,直到覆盖图案的顶表面露出,形成层间电介质图案。 层间电介质图案覆盖外围电路区域并填充单元栅极图案之间的空间。 使用层间电介质图案作为离子掩模进行离子注入工艺,使得杂质离子被选择性地注入到控制栅极图案中。