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    • 1. 发明授权
    • Method of forming thin film from multiple deposition sources
    • 从多个沉积源形成薄膜的方法
    • US08986783B2
    • 2015-03-24
    • US12926587
    • 2010-11-29
    • Suk-Won JungSeung-Ho ChoiKang-Il LeeHyun-Keun SongCheol-Lae Roh
    • Suk-Won JungSeung-Ho ChoiKang-Il LeeHyun-Keun SongCheol-Lae Roh
    • C23C16/448C23C14/24H01L51/00H01L51/56
    • C23C14/243C23C14/24H01L51/001H01L51/56
    • A method of depositing a material on a substrate is provided for use in manufacturing electronic and display devices such as semiconductors, liquid crystal displays, and organic light emitting diode displays. A deposition material stored in a first deposition source section is heated to evaporate the deposition material. A second deposition source section, which is separate from the first deposition source section, is cooled. The first deposition source section is cooled, and deposition material stored in a second deposition source section is heated so as to alternately supply evaporated deposition material from the first and second deposition source sections to a feed section. The evaporated deposition material from the feed section is supplied to a nozzle section. A substrate can be provided to receive the evaporated deposition material from the nozzle section. A thin film of deposition material can then be formed on the substrate.
    • 提供了一种在衬底上沉积材料的方法,用于制造诸如半导体,液晶显示器和有机发光二极管显示器的电子和显示装置。 存储在第一沉积源部分中的沉积材料被加热以蒸发沉积材料。 与第一沉积源部分分开的第二沉积源部分被冷却。 第一沉积源部分被冷却,并且存储在第二沉积源部分中的沉积材料被加热,从而将蒸发的沉积材料从第一和第二沉积源部分交替地供应到进料部分。 来自进料部分的蒸发的沉积材料被供应到喷嘴部分。 可以提供衬底以从喷嘴部分接收蒸发的沉积材料。 然后可以在衬底上形成沉积材料的薄膜。
    • 5. 发明申请
    • SPUTTERING SYSTEM
    • 喷射系统
    • US20110168553A1
    • 2011-07-14
    • US12825285
    • 2010-06-28
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • C23C14/35
    • C23C14/352H01J37/32449H01J37/3405H01J37/3417H01J37/345H01J37/347
    • A sputtering system is disclosed. The sputtering system includes: a first sputter unit including: a first deposition material plate, a second deposition material plate, where the first and second deposition material plates face each other, and a first magnetic field generator disposed behind each of the first deposition material plate and the second deposition material plate, configured to generate a magnetic field, a second sputter unit including: a third deposition material plate, disposed next to the first deposition material plate, a fourth deposition material plate, disposed next to the second deposition plate, where the third and fourth deposition material plates face each other, and a second magnetic field generator disposed behind each of the third deposition material plate and the fourth deposition material plate, configured to generate a magnetic field, a first gas supply pipe disposed between the first and third deposition material plates, configured to discharge gas to the second and fourth deposition material plates, a second gas supply pipe disposed between the second fourth deposition material plates, configured to discharge gas to the first and third deposition material plates, a first substrate support unit, configured to support a first deposition substrate, oriented toward outer edges of the first and second deposition material plates, and a second substrate support unit, configured to support a second deposition substrate, oriented toward outer edges of the third and fourth deposition material plates.
    • 公开了溅射系统。 溅射系统包括:第一溅射单元,包括:第一沉积材料板,第二沉积材料板,其中第一和第二沉积材料板彼此面对;以及第一磁场发生器,其布置在每个第一沉积材料板的后面 和第二沉积材料板,被配置为产生磁场;第二溅射单元,包括:第三沉积材料板,设置在第一沉积材料板旁边;第四沉积材料板,设置在第二沉积板旁边,其中 所述第三和第四沉积材料板彼此面对;以及第二磁场发生器,设置在每个所述第三沉积材料板和所述第四沉积材料板的后面,被配置为产生磁场;第一气体供给管,设置在所述第一和第二沉积材料板之间, 第三沉积材料板,被配置为将气体排放到第二和第四沉积物 第二气体供给管,设置在第二第四沉积材料板之间,被配置为将气体排放到第一和第三沉积材料板;第一基板支撑单元,被配置为支撑第一沉积基板, 第一和第二沉积材料板和第二衬底支撑单元,其被配置为支撑朝向第三和第四沉积材料板的外边缘定向的第二沉积衬底。
    • 6. 发明授权
    • Sputtering system
    • 溅射系统
    • US08382966B2
    • 2013-02-26
    • US12825285
    • 2010-06-28
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • Seung-Ho ChoiSuk-Won JungYoung-Mook ChoiHyun-Keun Song
    • C23C14/35
    • C23C14/352H01J37/32449H01J37/3405H01J37/3417H01J37/345H01J37/347
    • A sputtering system is disclosed. The sputtering system includes: a first sputter unit including: a first deposition material plate, a second deposition material plate, where the first and second deposition material plates face each other, and a first magnetic field generator disposed behind each of the first deposition material plate and the second deposition material plate, configured to generate a magnetic field, a second sputter unit including: a third deposition material plate, disposed next to the first deposition material plate, a fourth deposition material plate, disposed next to the second deposition plate, where the third and fourth deposition material plates face each other, and a second magnetic field generator disposed behind each of the third deposition material plate and the fourth deposition material plate, configured to generate a magnetic field, a first gas supply pipe disposed between the first and third deposition material plates, configured to discharge gas to the second and fourth deposition material plates, a second gas supply pipe disposed between the second fourth deposition material plates, configured to discharge gas to the first and third deposition material plates, a first substrate support unit, configured to support a first deposition substrate, oriented toward outer edges of the first and second deposition material plates, and a second substrate support unit, configured to support a second deposition substrate, oriented toward outer edges of the third and fourth deposition material plates.
    • 公开了溅射系统。 溅射系统包括:第一溅射单元,包括:第一沉积材料板,第二沉积材料板,其中第一和第二沉积材料板彼此面对;以及第一磁场发生器,其布置在每个第一沉积材料板的后面 和第二沉积材料板,被配置为产生磁场;第二溅射单元,包括:第三沉积材料板,设置在第一沉积材料板旁边;第四沉积材料板,设置在第二沉积板旁边,其中 所述第三和第四沉积材料板彼此面对;以及第二磁场发生器,设置在每个所述第三沉积材料板和所述第四沉积材料板的后面,被配置为产生磁场;第一气体供给管,设置在所述第一和第二沉积材料板之间, 第三沉积材料板,被配置为将气体排放到第二和第四沉积物 第二气体供给管,设置在第二第四沉积材料板之间,被配置为将气体排放到第一和第三沉积材料板;第一基板支撑单元,被配置为支撑第一沉积基板, 第一和第二沉积材料板和第二衬底支撑单元,其被配置为支撑朝向第三和第四沉积材料板的外边缘定向的第二沉积衬底。