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    • 2. 发明授权
    • Electrostatic discharge protection device
    • 静电放电保护装置
    • US08278715B2
    • 2012-10-02
    • US13019846
    • 2011-02-02
    • Yeh-Ning JouChia-Wei HungHwa-Chyi ChiouYeh-Jen HuangShu-Ling Chang
    • Yeh-Ning JouChia-Wei HungHwa-Chyi ChiouYeh-Jen HuangShu-Ling Chang
    • H01L23/62H01L29/772
    • H01L23/60H01L2924/0002H01L2924/00
    • An ESD protection structure is disclosed. A substrate comprises a first conductive type. A first diffusion region is formed in the substrate. A first doped region is formed in the first diffusion region. A second doped region is formed in the first diffusion region. A third doped region is formed in the substrate. A first isolation region is formed in the substrate, covers a portion of the first diffusion region and is located between the second and the third doped regions. A fourth doped region is formed in the substrate. When the first doped region is coupled to a first power line and the third and the fourth doped regions are coupled to a second power line, an ESD current can be released to the second power line from the first power line. During the release of the ESD current, the second doped region is not electrically connected to the first power line.
    • 公开了ESD保护结构。 衬底包括第一导电类型。 在基板中形成第一扩散区。 第一掺杂区形成在第一扩散区中。 在第一扩散区域中形成第二掺杂区域。 在衬底中形成第三掺杂区。 第一隔离区形成在衬底中,覆盖第一扩散区的一部分并位于第二和第三掺杂区之间。 在衬底中形成第四掺杂区。 当第一掺杂区耦合到第一电源线并且第三和第四掺杂区耦合到第二电源线时,ESD电流可以从第一电力线释放到第二电力线。 在释放ESD电流期间,第二掺杂区域不与第一电力线电连接。
    • 3. 发明申请
    • ELECTROSTATIC DISCHARGE PROTECTION DEVICE
    • 静电放电保护装置
    • US20120193718A1
    • 2012-08-02
    • US13019846
    • 2011-02-02
    • Yeh-Ning JOUChia-Wei HungHwa-Chyi ChiouYeh-Jen HuangShu-Ling Chang
    • Yeh-Ning JOUChia-Wei HungHwa-Chyi ChiouYeh-Jen HuangShu-Ling Chang
    • H01L23/60
    • H01L23/60H01L2924/0002H01L2924/00
    • An ESD protection structure is disclosed. A substrate comprises a first conductive type. A first diffusion region is formed in the substrate. A first doped region is formed in the first diffusion region. A second doped region is formed in the first diffusion region. A third doped region is formed in the substrate. A first isolation region is formed in the substrate, covers a portion of the first diffusion region and is located between the second and the third doped regions. A fourth doped region is formed in the substrate. When the first doped region is coupled to a first power line and the third and the fourth doped regions are coupled to a second power line, an ESD current can be released to the second power line from the first power line. During the release of the ESD current, the second doped region is not electrically connected to the first power line.
    • 公开了ESD保护结构。 衬底包括第一导电类型。 在基板中形成第一扩散区。 第一掺杂区形成在第一扩散区中。 在第一扩散区域中形成第二掺杂区域。 在衬底中形成第三掺杂区。 第一隔离区形成在衬底中,覆盖第一扩散区的一部分并位于第二和第三掺杂区之间。 在衬底中形成第四掺杂区。 当第一掺杂区耦合到第一电源线并且第三和第四掺杂区耦合到第二电源线时,ESD电流可以从第一电力线释放到第二电力线。 在释放ESD电流期间,第二掺杂区域不与第一电力线电连接。
    • 5. 发明申请
    • TRIG MODULATION ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICES
    • TRIG MODULATION静电放电(ESD)保护装置
    • US20090261417A1
    • 2009-10-22
    • US12265603
    • 2008-11-05
    • Yeh-Ning JouHwa-Chyi Chiou
    • Yeh-Ning JouHwa-Chyi Chiou
    • H01L27/092
    • H01L27/0266H01L2924/0002H01L2924/00
    • Trig modulation electrostatic discharge (ESD) protection devices are presented. An ESD protection device includes a semiconductor substrate. A high voltage N-well (HVNW) region is formed in the semiconductor substrate. An NDD region, a first P-body region and a second P-body region are formed in the HVNW region, wherein the first P-body region is separated from the second P-body region with a predetermined distance, and wherein the NDD region is isolated from the first P-body region with an isolation region. An N+ doped source region is disposed in the NDD region. An N+ doped region is disposed in the first P-body region. A P+ doped region is disposed in the second P-body region. A first gate is disposed between the N+ doped region and the isolation region, and a second gate is disposed between the N+ doped region and the P+ doped region.
    • 提出了Trig调制静电放电(ESD)保护装置。 ESD保护器件包括半导体衬底。 在半导体衬底中形成高电压N阱(HVNW)区域。 在HVNW区域中形成NDD区域,第一P体区域和第二P体区域,其中,第一P体区域与第二P体区域以预定距离分离,并且其中NDD区域 与具有隔离区域的第一P体区隔离。 N +掺杂源区设置在NDD区中。 N +掺杂区域设置在第一P体区域中。 P +掺杂区域设置在第二P体区域中。 第一栅极设置在N +掺杂区域和隔离区域之间,第二栅极设置在N +掺杂区域和P +掺杂区域之间。
    • 6. 发明申请
    • ELECTROSTATIC DISCHARGE PROTECTION DEVICE
    • 静电放电保护装置
    • US20120056239A1
    • 2012-03-08
    • US12875217
    • 2010-09-03
    • Yeh-Ning JOUChia-Wei HungShu-Ling ChangHwa-Chyi ChiouYeh-Jen Huang
    • Yeh-Ning JOUChia-Wei HungShu-Ling ChangHwa-Chyi ChiouYeh-Jen Huang
    • H01L29/739H01L23/60
    • H01L27/0259H01L27/0274
    • An electrostatic discharge protection device is coupled between a first power line and a second power line and comprises a P-type well, a first N-type doped region, a first P-type doped region, a second P-type doped region and a second N-type doped region. The first N-type doped region is formed in the P-type well. The first P-type doped region is formed in the first N-type doped region. The second P-type doped region comprises a first portion and a second portion. The first portion of the second P-type doped region is formed in the first N-type doped region. The second portion of the second P-type doped region is formed outside of the first N-type doped region. The second N-type doped region is formed in the first portion of the second P-type doped region. The first P-type doped region, the first N-type doped region, the second P-type doped region and the second N-type doped region constitute an insulated gate bipolar transistor (IGBT).
    • 静电放电保护装置耦合在第一电力线和第二电力线之间,并且包括P型阱,第一N型掺杂区,第一P型掺杂区,第二P型掺杂区和 第二N型掺杂区域。 第一个N型掺杂区形成在P型阱中。 第一P型掺杂区域形成在第一N型掺杂区域中。 第二P型掺杂区域包括第一部分和第二部分。 第二P型掺杂区的第一部分形成在第一N型掺杂区中。 第二P型掺杂区的第二部分形成在第一N型掺杂区的外部。 第二N型掺杂区形成在第二P型掺杂区的第一部分中。 第一P型掺杂区域,第一N型掺杂区域,第二P型掺杂区域和第二N型掺杂区域构成绝缘栅双极晶体管(IGBT)。
    • 7. 发明授权
    • Trig modulation electrostatic discharge (ESD) protection devices
    • 触发调制静电放电(ESD)保护装置
    • US08008726B2
    • 2011-08-30
    • US12887463
    • 2010-09-21
    • Yeh-Ning JouHwa-Chyi Chiou
    • Yeh-Ning JouHwa-Chyi Chiou
    • H01L23/60
    • H01L27/0266H01L2924/0002H01L2924/00
    • Trig modulation electrostatic discharge (ESD) protection devices are presented. An ESD protection device includes a semiconductor substrate. A high voltage N-well (HVNW) region is formed in the semiconductor substrate. An NDD region, a first P-body region and a second P-body region are formed in the HVNW region, wherein the first P-body region is separated from the second P-body region with a predetermined distance, and wherein the NDD region is isolated from the first P-body region with an isolation region. An N+ doped source region is disposed in the NDD region. An N+ doped region is disposed in the first P-body region. A P+ doped region is disposed in the second P-body region. A first gate is disposed between the N+ doped region and the isolation region, and a second gate is disposed between the N+ doped region and the P+ doped region.
    • 提出了Trig调制静电放电(ESD)保护装置。 ESD保护器件包括半导体衬底。 在半导体衬底中形成高电压N阱(HVNW)区域。 在HVNW区域中形成NDD区域,第一P体区域和第二P体区域,其中,第一P体区域与第二P体区域以预定距离分离,并且其中NDD区域 与具有隔离区域的第一P体区隔离。 N +掺杂源区设置在NDD区中。 N +掺杂区域设置在第一P体区域中。 P +掺杂区域设置在第二P体区域中。 第一栅极设置在N +掺杂区域和隔离区域之间,第二栅极设置在N +掺杂区域和P +掺杂区域之间。
    • 8. 发明授权
    • Trig modulation electrostatic discharge (ESD) protection devices
    • 触发调制静电放电(ESD)保护装置
    • US07821070B2
    • 2010-10-26
    • US12265603
    • 2008-11-05
    • Yeh-Ning JouHwa-Chyi Chiou
    • Yeh-Ning JouHwa-Chyi Chiou
    • H01L23/60
    • H01L27/0266H01L2924/0002H01L2924/00
    • Trig modulation electrostatic discharge (ESD) protection devices are presented. An ESD protection device includes a semiconductor substrate. A high voltage N-well (HVNW) region is formed in the semiconductor substrate. An NDD region, a first P-body region and a second P-body region are formed in the HVNW region, wherein the first P-body region is separated from the second P-body region with a predetermined distance, and wherein the NDD region is isolated from the first P-body region with an isolation region. An N+ doped source region is disposed in the NDD region. An N+ doped region is disposed in the first P-body region. A P+ doped region is disposed in the second P-body region. A first gate is disposed between the N+ doped region and the isolation region, and a second gate is disposed between the N+ doped region and the P+ doped region.
    • 提出了Trig调制静电放电(ESD)保护装置。 ESD保护器件包括半导体衬底。 在半导体衬底中形成高电压N阱(HVNW)区域。 在HVNW区域中形成NDD区域,第一P体区域和第二P体区域,其中,第一P体区域与第二P体区域以预定距离分离,并且其中NDD区域 与具有隔离区域的第一P体区隔离。 N +掺杂源区设置在NDD区中。 N +掺杂区域设置在第一P体区域中。 P +掺杂区域设置在第二P体区域中。 第一栅极设置在N +掺杂区域和隔离区域之间,第二栅极设置在N +掺杂区域和P +掺杂区域之间。
    • 9. 发明授权
    • Electrostatic discharge protection device
    • 静电放电保护装置
    • US08278736B2
    • 2012-10-02
    • US12875217
    • 2010-09-03
    • Yeh-Ning JouChia-Wei HungShu-Ling ChangHwa-Chyi ChiouYeh-Jen Huang
    • Yeh-Ning JouChia-Wei HungShu-Ling ChangHwa-Chyi ChiouYeh-Jen Huang
    • H01L29/739H01L23/60
    • H01L27/0259H01L27/0274
    • An electrostatic discharge protection device coupled between a first power line and a second power line is provided. A first N-type doped region is formed in a P-type well. A first P-type doped region is formed in the first N-type doped region. A second P-type doped region includes a first portion and a second portion. The first portion of the second P-type doped region is formed in the first N-type doped region. The second portion of the second P-type doped region is formed outside of the first N-type doped region. A second N-type doped region is formed in the first portion of the second P-type doped region. The first P-type doped region, the first N-type doped region, the second P-type doped region and the second N-type doped region constitute an insulated gate bipolar transistor (IGBT).
    • 提供耦合在第一电力线和第二电力线之间的静电放电保护装置。 在P型阱中形成第一N型掺杂区。 在第一N型掺杂区域中形成第一P型掺杂区域。 第二P型掺杂区域包括第一部分和第二部分。 第二P型掺杂区的第一部分形成在第一N型掺杂区中。 第二P型掺杂区的第二部分形成在第一N型掺杂区的外部。 在第二P型掺杂区域的第一部分中形成第二N型掺杂区域。 第一P型掺杂区域,第一N型掺杂区域,第二P型掺杂区域和第二N型掺杂区域构成绝缘栅双极晶体管(IGBT)。
    • 10. 发明申请
    • TRIG MODULATION ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICES
    • TRIG MODULATION静电放电(ESD)保护装置
    • US20110012204A1
    • 2011-01-20
    • US12887463
    • 2010-09-21
    • Yeh-Ning JouHwa-Chyi Chiou
    • Yeh-Ning JouHwa-Chyi Chiou
    • H01L27/092
    • H01L27/0266H01L2924/0002H01L2924/00
    • Trig modulation electrostatic discharge (ESD) protection devices are presented. An ESD protection device includes a semiconductor substrate. A high voltage N-well (HVNW) region is formed in the semiconductor substrate. An NDD region, a first P-body region and a second P-body region are formed in the HVNW region, wherein the first P-body region is separated from the second P-body region with a predetermined distance, and wherein the NDD region is isolated from the first P-body region with an isolation region. An N+ doped source region is disposed in the NDD region. An N+ doped region is disposed in the first P-body region. A P+ doped region is disposed in the second P-body region. A first gate is disposed between the N+ doped region and the isolation region, and a second gate is disposed between the N+ doped region and the P+ doped region.
    • 提出了Trig调制静电放电(ESD)保护装置。 ESD保护器件包括半导体衬底。 在半导体衬底中形成高电压N阱(HVNW)区域。 在HVNW区域中形成NDD区域,第一P体区域和第二P体区域,其中,第一P体区域与第二P体区域以预定距离分离,并且其中NDD区域 与具有隔离区域的第一P体区隔离。 N +掺杂源区设置在NDD区中。 N +掺杂区域设置在第一P体区域中。 P +掺杂区域设置在第二P体区域中。 第一栅极设置在N +掺杂区域和隔离区域之间,第二栅极设置在N +掺杂区域和P +掺杂区域之间。