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1. 发明授权

US06159623A Palladium plating solution, palladium plating film formed using the solution and lead frame for semiconductor apparatuses having the palladium plating film 失效
标题翻译：钯电镀溶液，使用溶液形成的钯电镀膜和具有钯电镀膜的半导体装置的引线框架
公开(公告)号：US06159623A
公开(公告)日：2000-12-12
申请号：US82550
申请日：1998-05-21
申请人： Hisahiro Tanaka
发明人： Hisahiro Tanaka
IPC分类号： C25D3/50 , C25D3/52 , C25D7/12 , H01L23/50 , B32B15/01
CPC分类号： C25D3/52 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/12875 , H01L2924/00014 , H01L2924/00
摘要： A palladium plating film having excellent soldering characteristics, including excellent solder wettability, high solder wetting speed, and especially the maintenance of these characteristics in a high-temperature atmosphere, is produced by using a palladium plating solution. The palladium plating film can be used, for example, for the plating of electrical and electronic parts. The palladium plating solution used contains a soluble palladium salt and a quaternary compound, and, if necessary, further contains a pyridine derivative or a salt thereof, and optionally further contains at least one compound selected from ammonium chloride, ammonium hydrogenphosphate, ammonium nitrate, ammonium sulfate, ammonium chloride and boric acid or a soluble selenium salt.
摘要翻译：通过使用钯电镀液制造具有优异焊接特性的钯电镀膜，其具有优异的焊料润湿性，高焊锡润湿速度，特别是在高温气氛中维持这些特性。钯电镀膜可以用于例如电气和电子部件的电镀。使用的镀钯溶液含有可溶性钯盐和季铵化合物，如果需要，还含有吡啶衍生物或其盐，并且任选地还含有至少一种选自氯化铵，磷酸氢铵，硝酸铵，铵硫酸盐，氯化铵和硼酸或可溶性硒盐。

2. 发明授权

US07689255B2 In-vehicle apparatus 有权
标题翻译：车内装置
公开(公告)号：US07689255B2
公开(公告)日：2010-03-30
申请号：US11706961
申请日：2007-02-16
申请人： Seiji Kurauchi , Toshiaki Kobayashi , Yuichiro Nishioka , Hiroyuki Arai , Hisahiro Tanaka
发明人： Seiji Kurauchi , Toshiaki Kobayashi , Yuichiro Nishioka , Hiroyuki Arai , Hisahiro Tanaka
IPC分类号： H04M1/00
CPC分类号： G11B31/00 , B60R11/02 , B60R11/0247 , B60R11/0264 , B60R2011/008 , B60R2011/0294 , G11B33/027 , H04M1/6091
摘要： An in-vehicle apparatus including: an apparatus body; a front surface of the apparatus body; and a lid configured to open and close the front surface. A microphone directed to the front side of the front surface in the condition where the lid is opened is provided at the front surface of the apparatus body. A gap for communication between the location, where the microphone is provided, of the front surface and the outside is secured between the front surface and the lid in the condition where the front surface of the apparatus body is closed with the lid.
摘要翻译：一种车载设备，包括：设备主体; 设备主体的前表面; 以及构造成打开和关闭前表面的盖子。在打开盖子的状态下，指向前表面前侧的麦克风设置在装置本体的前表面。在装置主体的前表面用盖子关闭的状态下，前表面和外侧之间的麦克风位置之间的通信间隙被固定在前表面和盖子之间。

3. 发明授权

US07494100B2 Electronic equipment tilting and rotating apparatus 失效
标题翻译：电子设备倾斜和旋转装置
公开(公告)号：US07494100B2
公开(公告)日：2009-02-24
申请号：US10990248
申请日：2004-11-16
申请人： Takehiko Tanaka , Hisahiro Tanaka
发明人： Takehiko Tanaka , Hisahiro Tanaka
IPC分类号： A47F5/00
CPC分类号： B60R11/0235 , B60R2011/0085 , B60R2011/0092 , Y10S248/919
摘要： A torsion coil spring spring-biases a rotary plate in such direction that a display unit may be rotated around rotary shafts, so as to rise from a horizontal position. An extension spring spring-biases the display unit, so that the display unit may be changed from an anti-rising direction to a rising direction while the display unit is being rotated, whereby a driving torque may become substantially constant against the weight of the display unit. One end of the extension spring is engaged with the rotary plate and the other end thereof is engaged with an engagement pin disposed at a position displaced from the center of the rotary shaft of the display unit. The length of the extension spring becomes longest while the rotary plate is being tilted and rotated. Thus, the electronic equipment tilting and rotating apparatus can tilt and rotate the display unit with application of a necessary and minimum driving torque.
摘要翻译：扭转螺旋弹簧弹簧以使显示单元绕旋转轴旋转的方向偏压旋转板，从而从水平位置上升。延伸弹簧弹簧偏压显示单元，使得显示单元可以在显示单元旋转时从反向上升方向改变到上升方向，由此驱动扭矩可以相对于显示器的重量变得基本恒定单元。拉伸弹簧的一端与旋转板接合，另一端与设置在从显示单元的旋转轴的中心偏移的位置处的接合销接合。延伸弹簧的长度在旋转板倾斜旋转时变长。因此，电子设备倾斜和旋转装置可以通过施加必要和最小的驱动扭矩来倾斜和旋转显示单元。

4. 发明申请

US20050224689A1 Electronic equipment tilting and rotating apparatus 失效
标题翻译：电子设备倾斜和旋转装置
公开(公告)号：US20050224689A1
公开(公告)日：2005-10-13
申请号：US10990248
申请日：2004-11-16
申请人： Takehiko Tanaka , Hisahiro Tanaka
发明人： Takehiko Tanaka , Hisahiro Tanaka
IPC分类号： B60R11/00 , B60R11/02 , G09F9/00 , H05K5/02 , E02F3/00
CPC分类号： B60R11/0235 , B60R2011/0085 , B60R2011/0092 , Y10S248/919
摘要： A torsion coil spring spring-biases a rotary plate in such direction that a display unit may be rotated around rotary shafts, so as to rise from a horizontal position. An extension spring spring-biases the display unit, so that the display unit may be changed from an anti-rising direction to a rising direction while the display unit is being rotated, whereby a driving torque may become substantially constant against the weight of the display unit. One end of the extension spring is engaged with the rotary plate and the other end thereof is engaged with an engagement pin disposed at a position displaced from the center of the rotary shaft of the display unit. The length of the extension spring becomes longest while the rotary plate is being tilted and rotated. Thus, the electronic equipment tilting and rotating apparatus can tilt and rotate the display unit with application of a necessary and minimum driving torque.
摘要翻译：扭转螺旋弹簧弹簧以使显示单元绕旋转轴旋转的方向偏压旋转板，从而从水平位置上升。延伸弹簧弹簧偏压显示单元，使得显示单元可以在显示单元旋转时从反向上升方向改变到上升方向，由此驱动扭矩可以相对于显示器的重量变得基本恒定单元。拉伸弹簧的一端与旋转板接合，另一端与设置在从显示单元的旋转轴的中心偏移的位置处的接合销接合。延伸弹簧的长度在旋转板倾斜旋转时变长。因此，电子设备倾斜和旋转装置可以通过施加必要和最小的驱动扭矩来倾斜和旋转显示单元。

5. 发明授权

US06575354B2 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film 失效
标题翻译：用于生产锡 - 银合金镀膜的方法，用于具有该膜的电子部件的锡 - 银合金镀膜和引线框架
公开(公告)号：US06575354B2
公开(公告)日：2003-06-10
申请号：US09986478
申请日：2001-11-08
申请人： Hisahiro Tanaka , Matsuo Masuda , Tsuyoshi Tokiwa
发明人： Hisahiro Tanaka , Matsuo Masuda , Tsuyoshi Tokiwa
IPC分类号： B23K3102
CPC分类号： H01L23/49582 , C25D3/60 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/85011 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： The present invention relates to a method for producing a tin-silver alloy plating film having an excellent wettability and improved in solderability and said method comprises a step of heat treating the surface of the tin-silver alloy plating film preferably the heat treating temperature is 70-210° C.
摘要翻译：本发明涉及一种具有优异润湿性和改善焊接性的锡 - 银合金电镀膜的制造方法，所述方法包括对锡 - 银合金镀膜表面进行热处理的步骤，优选热处理温度为70℃ -210℃

6. 发明授权

US07488408B2 Tin-plated film and method for producing the same 有权
标题翻译：镀锡膜及其制造方法
公开(公告)号：US07488408B2
公开(公告)日：2009-02-10
申请号：US11184079
申请日：2005-07-19
申请人： Hisahiro Tanaka , Shigeki Ogata
发明人： Hisahiro Tanaka , Shigeki Ogata
IPC分类号： C25D5/50 , C25D3/30
CPC分类号： H01L23/49582 , C25D5/505 , C25F3/02 , H01L2224/32245 , H01L2924/15173 , Y10S428/929 , Y10T428/12715
摘要： The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.
摘要翻译：本发明的目的是提供一种镀锡膜及其制造方法，其能够防止产生晶须，同时防止未被镀锡膜覆盖的基板表面，由于氧化引起的变色，通过其可以防止晶须生成的抑制，晶须生长的抑制以及防止被镀基板的变色，从而确保了优异的生产率。该方法具有以下步骤：去除在铜或铜合金上形成的一部分镀锡膜; 处理以防止除去镀锡膜的铜或铜合金的变色; 并对被加工成防止变色的铜或铜合金的镀锡膜施加热能。

7. 发明申请

US20060016694A1 Tin-plated film and method for producing the same 有权
公开(公告)号：US20060016694A1
公开(公告)日：2006-01-26
申请号：US11184079
申请日：2005-07-19
申请人： Hisahiro Tanaka , Shigeki Ogata
发明人： Hisahiro Tanaka , Shigeki Ogata
IPC分类号： C25D3/30
CPC分类号： H01L23/49582 , C25D5/505 , C25F3/02 , H01L2224/32245 , H01L2924/15173 , Y10S428/929 , Y10T428/12715
摘要： The present invention has an object to provide a tin-plated film and a method for producing the same, capable of preventing whiskers from being generated and simultaneously preventing the surface of a substrate to be plated, which is not covered with a tin-plated film, from discoloring due to oxidation, by which prevention of whisker generation, suppression of whisker growth, and prevention of discoloring of a substrate to be plated are compatible with simplified operations ensuring excellent productivity. The method is provided with the steps of removing a part of a tin-plated film formed on copper or copper alloy; processing to prevent discoloring of the copper or copper alloy from which the tin-plated film is removed; and applying heat energy to the tin-plated film of the copper or copper alloy which is processed to prevent discoloring.

8. 发明授权

US06521358B1 Lead frame for semiconductor device and method of producing same 失效
标题翻译：用于半导体器件的引线框架及其制造方法
公开(公告)号：US06521358B1
公开(公告)日：2003-02-18
申请号：US09153065
申请日：1998-09-15
申请人： Hisahiro Tanaka , Masanori Ikari
发明人： Hisahiro Tanaka , Masanori Ikari
IPC分类号： B32B1500
CPC分类号： C23C2/04 , C23C28/023 , C25D3/50 , C25D3/567 , C25D5/12 , H01L23/49582 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/29111 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48664 , H01L2224/48764 , H01L2224/48864 , H01L2224/73265 , H01L2224/83439 , H01L2224/85464 , H01L2224/97 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/351 , Y10S428/929 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/01026 , H01L2924/0105 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than 0.12%. By virtue of limiting the amount of Ni or Cu to these particular levels, the solderability of the lead frame is remarkably enhanced.
摘要翻译：用于半导体器件的引线框架包括在片状体上镀覆的片状体和Pd涂层。 Pd涂层包括不大于2％的Ni。在另一个实施方案中，Pd涂层包括不超过0.12％的Cu。通过将Ni或Cu的量限制到这些特定的水平，引线框架的可焊性显着提高。

9. 发明申请

US20070207840A1 In-vehicle apparatus 有权
标题翻译：车内装置
公开(公告)号：US20070207840A1
公开(公告)日：2007-09-06
申请号：US11706961
申请日：2007-02-16
申请人： Seiji Kurauchi , Toshiaki Kobayashi , Yuichiro Nishioka , Hiroyuki Arai , Hisahiro Tanaka
发明人： Seiji Kurauchi , Toshiaki Kobayashi , Yuichiro Nishioka , Hiroyuki Arai , Hisahiro Tanaka
IPC分类号： H04M1/00
CPC分类号： G11B31/00 , B60R11/02 , B60R11/0247 , B60R11/0264 , B60R2011/008 , B60R2011/0294 , G11B33/027 , H04M1/6091
摘要： An in-vehicle apparatus including: an apparatus body; a front surface of the apparatus body; and a lid configured to open and close the front surface. A microphone directed to the front side of the front surface in the condition where the lid is opened is provided at the front surface of the apparatus body. A gap for communication between the location, where the microphone is provided, of the front surface and the outside is secured between the front surface and the lid in the condition where the front surface of the apparatus body is closed with the lid.
摘要翻译：一种车载设备，包括：设备主体; 设备主体的前表面; 以及构造成打开和关闭前表面的盖子。在打开盖子的状态下，指向前表面前侧的麦克风设置在装置本体的前表面。在装置主体的前表面用盖子关闭的状态下，前表面和外侧之间的麦克风位置之间的通信间隙被固定在前表面和盖子之间。

10. 发明授权

US06677056B2 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film 有权
标题翻译：用于生产锡 - 银合金镀膜的方法，用于具有镀膜的电子部件的锡 - 银合金镀膜和引线框架
公开(公告)号：US06677056B2
公开(公告)日：2004-01-13
申请号：US10274033
申请日：2002-10-21
申请人： Hisahiro Tanaka , Matsuo Masuda
发明人： Hisahiro Tanaka , Matsuo Masuda
IPC分类号： B32B1501
CPC分类号： H01L23/49582 , B32B15/01 , C22C13/00 , C25D3/60 , C25D5/18 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/45099 , H01L2224/48247 , H01L2224/73265 , H01L2224/83439 , H01L2224/85439 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/181 , Y10S428/935 , Y10T428/12708 , Y10T428/12715 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A tin-silver alloy plating film improved in solderability and flex cracking characteristics is provided by producing it by an electroplating process which uses a current having a pulse waveform of a current passing period of not less than 3 ms and not more than 500 ms and a stopping period of not less than 1 ms and not more than 500 ms with a proviso that the stopping period is equal to or shorter than the passing period.
摘要翻译：通过使用电流通过期间不小于3ms且不大于500ms的脉冲波形的电流的电镀工艺制造可提高焊接性和挠曲裂纹特性的锡 - 银合金电镀膜，以及停止期间不小于1ms且不大于500ms，条件是停止期间等于或短于通过期间。

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