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    • 5. 发明授权
    • Piezoelectric devices and methods for manufacturing the same
    • 压电器件及其制造方法
    • US08686621B2
    • 2014-04-01
    • US13400583
    • 2012-02-21
    • Hiroki Sekiguchi
    • Hiroki Sekiguchi
    • H01L41/053
    • H03H9/1014H03H9/1035
    • The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.
    • 本公开的目的是提供一种在从晶片切割成单独的片材的切割过程中不太可能被损坏的压电装置,并且可以在晶片处测量而不受相邻的压电装置的影响。 压电装置包括:构成用于存储振动部分的封装的一部分的第一板,具有一对垂直于第一边缘设置的第一边缘和第二边缘; 第二板,其结合到所述第一板,并构成用于存储所述振动部的所述封装的另一部分; 以及用于将第一板和第二板结合在一起的粘合剂。 在每个第一边缘上形成一对城堡,位于与穿过第一板的中心线并且平行于第二边缘的直线对称的位置。 本公开还提供了制造方法。
    • 10. 发明申请
    • PIEOZELECTRIC DEVICES AND METHODS FOR MANUFACTURING THE SAME
    • PIEOZELECTRIC设备及其制造方法
    • US20120212105A1
    • 2012-08-23
    • US13400583
    • 2012-02-21
    • HIROKI SEKIGUCHI
    • HIROKI SEKIGUCHI
    • H01L41/053H01L41/22
    • H03H9/1014H03H9/1035
    • The purpose of the present disclosure is to provide a piezoelectric device that is less likely to be damaged during the cutting process from a wafer into individual pieces, and can be measured at the wafer without being affected by adjacent piezoelectric devices. The piezoelectric device includes: a first plate which constitutes a part of the package for storing the vibrating portion, having a pair of first edges and second edges situated vertically to the first edges; a second plate bonded to the first plate and constitutes another part of the package for storing the vibrating portion; and an adhesive for bonding the first plate and the second plate together. A pair of castellations is formed on each first edge, situated symmetrical to a straight line that passes through a centerline of the first plate and is parallel to the second edge. The present disclosure also provides methods for manufacturing.
    • 本公开的目的是提供一种在从晶片切割成单独的片材的切割过程中不太可能被损坏的压电装置,并且可以在晶片处测量而不受相邻的压电装置的影响。 压电装置包括:构成用于存储振动部分的封装的一部分的第一板,具有一对垂直于第一边缘设置的第一边缘和第二边缘; 第二板,其结合到所述第一板,并构成用于存储所述振动部的所述封装的另一部分; 以及用于将第一板和第二板结合在一起的粘合剂。 在每个第一边缘上形成一对城堡,位于与穿过第一板的中心线并且平行于第二边缘的直线对称的位置。 本公开还提供了制造方法。