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1. 发明申请

US20140092338A1 DISPLAY MODULE AND DISPLAY DEVICE 有权
标题翻译：显示模块和显示设备
公开(公告)号：US20140092338A1
公开(公告)日：2014-04-03
申请号：US14113886
申请日：2012-04-23
申请人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号： G02F1/1333 , F21V8/00
CPC分类号： G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译：本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到第一板3和第二板4.电路构件2形成在基膜5上。

2. 发明申请

US20120008064A1 CHIP COMPONENT MOUNTING STRUCTURE, CHIP COMPONENT MOUNTING METHOD AND LIQUID CRYSTAL DISPLAY DEVICE 有权
标题翻译：芯片组件安装结构，芯片组件安装方法和液晶显示设备
公开(公告)号：US20120008064A1
公开(公告)日：2012-01-12
申请号：US13257679
申请日：2009-11-04
申请人： Hiroki Miyazaki
发明人： Hiroki Miyazaki
IPC分类号： G02F1/1335 , H05K1/16 , H05K3/30 , H05K7/00
CPC分类号： H05K3/321 , H01L2224/27334 , H01L2224/75315 , H01L2224/7598 , H01L2224/83851 , H01L2224/97 , H05K3/284 , H05K3/305 , H05K2201/0133 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , H01L2924/00014 , H01L2224/83
摘要： Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substarate.
摘要翻译：提供了一种芯片部件安装结构和芯片部件安装方法，其中当通过各向异性导电膜将多个具有不同高度的芯片部件安装在基板上时，当芯片部件被压接在基板上时发生位置间隙并且能够将芯片部件精确地安装在基板的目标位置; 以及设置有该基板的液晶显示装置。在芯片部件安装结构中，设置有用于通过各向异性导电膜（7）将用于保持与基板（1）压接的芯片部件（2）的取向保持的定位树脂（4）。在芯片部件安装方法中，在用于将经由各向异性导电膜（7）安装到基板（1）的芯片部件（2）的取向的位置固定树脂（4）施加到基板（1））并固化，芯片部件（2）被加热到预定温度，并通过设置在芯片部件（2）上的弹性片（5）以预定压力压制，然后压接到基板（1）一起。液晶显示器设置有这样的基底。

3. 发明授权

US5512111A Aluminum alloy material for shutter of recording medium cassette, process for producing the same, and aluminum alloy shutter made of the same 失效
标题翻译：用于记录介质盒快门的铝合金材料，其制造方法和由其制成的铝合金快门
公开(公告)号：US5512111A
公开(公告)日：1996-04-30
申请号：US227551
申请日：1994-04-14
申请人： Shozo Tahara , Taizo Kimura , Hiroki Miyazaki , Kazuhiro Hanaki
发明人： Shozo Tahara , Taizo Kimura , Hiroki Miyazaki , Kazuhiro Hanaki
IPC分类号： B32B15/08 , C22C21/06 , C22F1/047 , C23C22/24 , G11B23/02 , G11B23/03 , G11B23/033
CPC分类号： C22C21/06
摘要： An aluminum alloy material for the shutter of flat recording medium cassettes. The shutter is light in weight and smoothly slidable, has good corrosion resistance and durability, and protects itself against staining with fingerprints. The aluminum alloy contains 3.0-6.0% Mg (by weight) and one or more than one optional elements of Mn.ltoreq.1.5%, Cr.ltoreq.0.3%, Cu.ltoreq.0.5%, and Ti.ltoreq.0.1%, with the balance being aluminum and inevitable impurities, and has a tensile strength of 310-410 MPa and a yield strength of 250-370 MPa. The aluminum alloy material is formed from a rolled sheet of said aluminum alloy by coating the sheet with a plastic film not thicker than 5 .mu.m. The rolled sheet undergoes intermediate annealing at higher than the recrystallization temperature, final cold rolling, and stabilizing heat treatment.
摘要翻译：一种用于平面记录介质盒的快门的铝合金材料。快门重量轻，平滑滑动，具有良好的耐腐蚀性和耐久性，保护自身免受指纹污染。铝合金含有3.0-6.0％的Mg（重量比）和一种或多于一种的Mn <1.5％，Cr

4. 发明申请

US20120320290A1 DISPLAY DEVICE 审中-公开
标题翻译：显示设备
公开(公告)号：US20120320290A1
公开(公告)日：2012-12-20
申请号：US13577637
申请日：2010-10-27
申请人： Yasuhiro Hida , Gen Nagaoka , Hiroki Miyazaki
发明人： Yasuhiro Hida , Gen Nagaoka , Hiroki Miyazaki
IPC分类号： G02F1/136 , G02F1/1335
CPC分类号： G02F1/13452 , G02F1/13338
摘要： A display device that can easily attach a connection member to a display panel is provided. This liquid crystal display device (1) includes: a liquid crystal display panel (2) that includes a TFT substrate (10) and a CF substrate (20); a FPC (30) that is electrically connected to the TFT substrate; and a FPC (40) that is electrically connected to the CF substrate. An alignment mark (13) is provided in the TFT substrate. An alignment mark (41) corresponding to the alignment mark (13) is provided in the FPC (40).
摘要翻译：提供了一种可以容易地将连接构件附接到显示面板的显示装置。该液晶显示装置（1）具备包括TFT基板（10）和CF基板（20）的液晶显示面板（2）。与TFT基板电连接的FPC（30）以及电连接到CF基板的FPC（40）。在TFT基板中设置有对准标记（13）。在FPC（40）中设置与对准标记（13）对应的对准标记（41）。

5. 发明授权

US09207477B2 Display module and display device 有权
标题翻译：显示模块和显示设备
公开(公告)号：US09207477B2
公开(公告)日：2015-12-08
申请号：US14113886
申请日：2012-04-23
申请人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
发明人： Hiroki Miyazaki , Motoji Shiota , Takatoshi Kira , Gen Nagaoka , Seiji Muraoka , Makoto Tamaki , Keiji Aota , Yukio Shimizu , Takashi Matsui , Hiroki Nakahama , Hiroki Makino , Minoru Horino
IPC分类号： G02F1/1333 , G02F1/1345 , F21V8/00
CPC分类号： G02F1/133308 , G02B6/0001 , G02F1/1333 , G02F1/13336 , G02F1/13452
摘要： A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.
摘要翻译：本发明的显示模块1包括第一板3，第二板4，基膜5和电路构件2.第一板3和第二板4彼此接合在一起。基膜5设置在第一基板3和第二基板4之间，并且从第一基板3的端部向外延伸。基膜5具有绝缘性，延伸部弯曲到第一板3和第二板4.电路构件2形成在基膜5上。

6. 发明申请

US20120188733A1 SUBSTRATE MOUNTING STRUCTURE, DISPLAY DEVICE EQUIPPED THEREWITH, AND SUBSTRATE MOUNTING METHOD 审中-公开
标题翻译：基板安装结构，其设备显示装置以及基板安装方法
公开(公告)号：US20120188733A1
公开(公告)日：2012-07-26
申请号：US13499109
申请日：2010-05-14
申请人： Hiroki Miyazaki , Gen Nagaoka , Yasuhiro Hida
发明人： Hiroki Miyazaki , Gen Nagaoka , Yasuhiro Hida
IPC分类号： H05K7/06 , B32B37/12 , H05K1/16
CPC分类号： H05K3/323 , H05K2201/10204 , H05K2201/10636 , Y02P70/611 , Y10T156/10
摘要： To provide a substrate mounting structure with which reliability can be improved. This substrate mounting structure includes an ACF (2) disposed on a surface (1a) of a glass substrate (1) and SMDs (3) mounted on the surface (1a) of the glass substrate (1) via the ACF (2) and disposed in an SMD mounting region (10a) on the surface (1a) of the glass substrate (1). Then, dummy components (4) are respectively disposed in a region adjacent to one side of the SMD mounting region (10a) and in a region adjacent to the other side thereof.
摘要翻译：提供可提高可靠性的基板安装结构。该基板安装结构包括经由ACF（2）设置在玻璃基板（1）的表面（1a）上的ACF（2）和安装在玻璃基板（1）的表面（1a）上的SMD（3），以及设置在玻璃基板（1）的表面（1a）上的SMD安装区域（10a）中。然后，虚拟部件（4）分别设置在与SMD安装区域（10a）的一侧相邻的区域中，并且在与其另一侧相邻的区域中。

7. 发明申请

US20120182697A1 BOARD MODULE AND FABRICATION METHOD THEREOF 有权
标题翻译：板模块及其制造方法
公开(公告)号：US20120182697A1
公开(公告)日：2012-07-19
申请号：US13498761
申请日：2010-05-12
申请人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
发明人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
IPC分类号： H05K7/06 , H05K3/30
CPC分类号： G02F1/13452 , G02F1/13454 , G02F2202/28 , H01L24/16 , H01L24/32 , H01L2924/01004 , H01L2924/07811 , H01L2924/14 , H01L2924/19105 , Y10T29/4913 , H01L2924/00
摘要： Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
摘要翻译：包括在液晶模块（100）中的玻璃基板（110）的突起（111）上的是第一ACF（150a），其表面粘着强度低，连接可靠性高，第二ACF（150b）其具有高的表面粘着强度的组分附着能力。通过这些，在玻璃基板（110）上安装有LSI芯片（130），电子部件（150）等，从而可以在确保连接可靠性的同时实现高速电子部件安装。

8. 发明授权

US09060429B2 Circuit board, substrate module, and display device 有权
标题翻译：电路板，基板模块和显示装置
公开(公告)号：US09060429B2
公开(公告)日：2015-06-16
申请号：US13581542
申请日：2010-11-02
申请人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
发明人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
IPC分类号： G06F3/041 , H05K1/02 , H05K3/32 , H05K3/36
CPC分类号： H05K1/0269 , H05K3/323 , H05K3/361 , H05K2201/0326 , H05K2201/0338 , H05K2201/0391 , H05K2201/09918 , H05K2203/166
摘要： Provided is a circuit board in which visibility of an alignment mark is improved.In a case of manufacturing a substrate module in which a touch panel (20) and an FPC (50) are electrically connected, an alignment mark in the FPC (50) is formed by an opaque metal film, so that visibility is high. Consequently, when an alignment mark (25) in the touch panel (20) is also formed by an opaque metal film, the visibility of the alignment mark (25) also becomes high. By performing alignment using the alignment marks having high visibility, alignment between the touch panel (20) and the FPC (50) can be performed easily with high precision. As a result, the yield of the substrate module increases and modification of an alignment apparatus used for alignment becomes unnecessary, so that the manufacturing cost of the substrate module can be decreased.
摘要翻译：提供了一种改善对准标记的可视性的电路板。在制造触摸面板（20）和FPC（50）电连接的基板模块的情况下，FPC（50）中的对准标记由不透明的金属膜形成，使得可视性高。因此，当触摸面板（20）中的对准标记（25）也由不透明金属膜形成时，对准标记（25）的可视性也变高。通过使用具有高可见度的对准标记进行对准，可以以高精度容易地进行触摸面板（20）和FPC（50）之间的对准。结果，不需要基板模块的成品率的增加和用于对准的对准装置的修改，从而可以降低基板模块的制造成本。

9. 发明授权

US09007777B2 Board module and fabrication method thereof 有权
标题翻译：板模块及其制造方法
公开(公告)号：US09007777B2
公开(公告)日：2015-04-14
申请号：US13498761
申请日：2010-05-12
申请人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
发明人： Gen Nagaoka , Yasuhiro Hida , Hiroki Miyazaki
IPC分类号： H05K1/00 , H05K1/18 , H05K7/00 , H01L29/18 , H01L33/00 , G09G3/36 , G02F1/1345 , H01L23/00
CPC分类号： G02F1/13452 , G02F1/13454 , G02F2202/28 , H01L24/16 , H01L24/32 , H01L2924/01004 , H01L2924/07811 , H01L2924/14 , H01L2924/19105 , Y10T29/4913 , H01L2924/00
摘要： Affixed to a projection (111) of a glass substrate (110) included in a liquid crystal module (100) are a first ACF (150a), which has low surface tack strength but high connection reliability, and a second ACF (150b), which has high component attaching capability attributed to high surface tack strength. With these, an LSI chip (130), electronic components (150), etc., are mounted on the glass substrate (110), so that high-speed electronic component mounting can be achieved while ensuring connection reliability.
摘要翻译：包括在液晶模块（100）中的玻璃基板（110）的突起（111）上的是第一ACF（150a），其表面粘着强度低，连接可靠性高，第二ACF（150b）其具有高的表面粘着强度的组分附着能力。通过这些，在玻璃基板（110）上安装有LSI芯片（130），电子部件（150）等，从而可以在确保连接可靠性的同时实现高速电子部件安装。

10. 发明授权

US08692968B2 Chip component mounting structure, chip component mounting method and liquid crystal display device 有权
标题翻译：芯片部件安装结构，芯片部件安装方法和液晶显示装置
公开(公告)号：US08692968B2
公开(公告)日：2014-04-08
申请号：US13257679
申请日：2009-11-04
申请人： Hiroki Miyazaki
发明人： Hiroki Miyazaki
IPC分类号： G02F1/1345 , G02F1/13 , H01L21/00 , H05K1/02
CPC分类号： H05K3/321 , H01L2224/27334 , H01L2224/75315 , H01L2224/7598 , H01L2224/83851 , H01L2224/97 , H05K3/284 , H05K3/305 , H05K2201/0133 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , H01L2924/00014 , H01L2224/83
摘要： Provided are a chip component mounting structure and a chip component mounting method, wherein when a plurality of chip components having different heights are mounted on a substrate via an anisotropic conductive film, position gaps which occur when the chip components are pressure-bonded to the substrate are prevented, and the chip components can be accurately mounted to the substrate at target positions; and a liquid crystal display device provided with the substrate. In the chip component mounting structure, a position fixing resin (4) for maintaining the orientation of chip components (2) which are pressure-bonded to a substrate (1) via an anisotropic conductive film (7) is provided. In the chip component mounting method, after the position fixing resin (4) for maintaining the orientation of the chip components (2) which are mounted to the substrate (1) via the anisotropic conductive film (7) is applied to the substrate (1) and cured, the chip components (2) are heated at a predetermined temperature and pressed at a predetermined pressure via an elastic sheet (5) provided on the chip components (2) and, then, pressure-bond to the substrate (1) together. The liquid crystal display is provided with such a substrate.
摘要翻译：提供了一种芯片部件安装结构和芯片部件安装方法，其中当通过各向异性导电膜将多个具有不同高度的芯片部件安装在基板上时，当芯片部件被压接在基板上时发生位置间隙并且能够将芯片部件精确地安装在基板的目标位置; 以及设置有该基板的液晶显示装置。在芯片部件安装结构中，设置有用于通过各向异性导电膜（7）将用于保持与基板（1）压接的芯片部件（2）的取向保持的定位树脂（4）。在芯片部件安装方法中，在用于将经由各向异性导电膜（7）安装到基板（1）的芯片部件（2）的取向的位置固定树脂（4）施加到基板（1））并固化，芯片部件（2）被加热到预定温度，并通过设置在芯片部件（2）上的弹性片（5）以预定压力压制，然后压接到基板（1）一起。液晶显示器设置有这样的基板。

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