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1. 发明授权

US08246153B2 Bubble control unit, liquid ejecting head, and liquid ejecting apparatus 有权
标题翻译：气泡控制单元，液体喷射头和液体喷射装置
公开(公告)号：US08246153B2
公开(公告)日：2012-08-21
申请号：US12548388
申请日：2009-08-26
申请人： Hiroki Miyajima
发明人： Hiroki Miyajima
IPC分类号： B41J2/19
CPC分类号： B41J2/17509 , B41J2/14233 , B41J2002/14419 , B41J2202/07
摘要： Provided is a bubble control unit for a liquid ejecting head which ejects liquid from a nozzle formed on a nozzle surface. The bubble control unit includes a liquid channel through which the liquid is supplied to the nozzle. In the bubble control unit, the liquid channel includes: a first chamber; a second chamber disposed on the upstream side from the first chamber; a first communicating path which has a bubble chamber extending upward from the first chamber, and makes the liquid within the second chamber to flow into the first chamber from a first communicating path inlet of the second chamber; and a second communicating path which is provided with a second communicating path inlet below the first communicating path inlet, separately from the first communicating path inlet, and makes the liquid within the second chamber to flow into the first chamber from the second communicating path inlet.
摘要翻译：提供一种用于从形成在喷嘴表面上的喷嘴喷出液体的液体喷射头的气泡控制单元。气泡控制单元包括液体通道，液体通过该通道供应到喷嘴。在气泡控制单元中，液体通道包括：第一腔室; 第二室，设置在从第一室的上游侧; 第一连通路径，其具有从所述第一室向上延伸的气泡室，并使所述第二室内的液体从所述第二室的第一连通路入口流入所述第一室; 以及第二连通路径，其与第一连通路入口分开设置有位于第一连通路入口下方的第二连通路入口，并使第二室内的液体从第二连通路入口流入第一室。

2. 发明申请

US20050082255A1 Plasma etching method 失效
标题翻译：等离子蚀刻法
公开(公告)号：US20050082255A1
公开(公告)日：2005-04-21
申请号：US10497534
申请日：2002-12-09
申请人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
发明人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
IPC分类号： C23F4/00 , H01L21/00 , H01L21/302 , H01L21/3065 , H01L21/308 , C23F1/00
CPC分类号： H01L21/67069 , H01J37/32623 , H01L21/3065 , H01L21/3081 , H01L21/3083
摘要： An etching method for forming a recess (220) having an opening dimension (R) of millimeter order in an object (212) to be etched such as a semiconductor wafer. A mask (214) having an opening corresponding to the recess (220) is formed on the object (212). The object (212) with the mask (214) is placed in a processing vessel for plasma etching and etched in it using a plasma. The material of the portion around the opening of the mask (214) is the same as the material, for example, silicon of the object (212). Hence, the recess (220) can be so formed as not to form a sub-trench shape (a shape formed by etching the periphery of which is deeper than the center) substantially in the bottom (222).
摘要翻译：一种蚀刻方法，用于在被蚀刻的物体（212）中形成具有毫米级的开口尺寸（R）的凹部（220），例如半导体晶片。在物体（212）上形成具有对应于凹部（220）的开口的面罩（214）。将具有掩模（214）的物体（212）放置在用于等离子体蚀刻的处理容器中，并使用等离子体蚀刻在其中。掩模（214）的开口周围部分的材料与物体（212）的材料（例如硅）相同。因此，凹部（220）可以形成为不形成基本上在底部（222）中形成副沟槽形状（通过蚀刻其周边比中心更深的形状形成的形状）。

3. 发明申请

US20110242166A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS 有权
标题翻译：液体喷射和液体喷射装置
公开(公告)号：US20110242166A1
公开(公告)日：2011-10-06
申请号：US13075135
申请日：2011-03-29
申请人： Hiroki Miyajima , Kimiyasu Otsuki
发明人： Hiroki Miyajima , Kimiyasu Otsuki
IPC分类号： B41J29/38
CPC分类号： B41J2/14072 , B41J2/14274 , B41J2002/14491
摘要： A liquid ejecting head includes a main liquid ejecting head body, in which is formed a liquid flow channel through which a liquid flows, that ejects the liquid from a nozzle opening using a pressurizing unit; a driving board configured so as to supply power to the pressurizing unit; a connector provided at an end portion of the driving board; and a holding member configured so as to hold the driving board in a bent state and erected relative to one end surface of the main liquid ejecting head body. The holding member has a stopping portion that holds an end of the driving board in which the connector is provided, and the configuration is such that the stopping portion prevents the driving board from opening in the direction of the bend.
摘要翻译：液体喷射头包括主液体喷射头主体，其中形成有液体流动的液体流动通道，其使用加压单元从喷嘴开口喷射液体; 驱动板，被构造成向加压单元供电; 设置在所述驱动板的端部的连接器; 以及保持构件，其构造成将所述驱动板保持在弯曲状态并相对于所述主液体喷射头本体的一个端面竖立。保持构件具有保持设置有连接器的驱动板的端部的止动部，并且该结构使得止动部防止驱动板沿弯曲方向打开。

4. 发明申请

US20100053284A1 BUBBLE CONTROL UNIT, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS 有权
标题翻译：泡沫控制单元，液体喷射头和液体喷射装置
公开(公告)号：US20100053284A1
公开(公告)日：2010-03-04
申请号：US12548388
申请日：2009-08-26
申请人： Hiroki Miyajima
发明人： Hiroki Miyajima
IPC分类号： B41J2/19
CPC分类号： B41J2/17509 , B41J2/14233 , B41J2002/14419 , B41J2202/07
摘要： Provided is a bubble control unit for a liquid ejecting head which ejects liquid from a nozzle formed on a nozzle surface. The bubble control unit includes a liquid channel through which the liquid is supplied to the nozzle. In the bubble control unit, the liquid channel includes: a first chamber; a second chamber disposed on the upstream side from the first chamber; a first communicating path which has a bubble chamber extending upward from the first chamber, and makes the liquid within the second chamber to flow into the first chamber from a first communicating path inlet of the second chamber; and a second communicating path which is provided with a second communicating path inlet below the first communicating path inlet, separately from the first communicating path inlet, and makes the liquid within the second chamber to flow into the first chamber from the second communicating path inlet.
摘要翻译：提供一种用于从形成在喷嘴表面上的喷嘴喷出液体的液体喷射头的气泡控制单元。气泡控制单元包括液体通道，液体通过该通道供应到喷嘴。在气泡控制单元中，液体通道包括：第一腔室; 第二室，设置在从第一室的上游侧; 第一连通路径，其具有从所述第一室向上延伸的气泡室，并使所述第二室内的液体从所述第二室的第一连通路入口流入所述第一室; 以及第二连通路径，其与第一连通路入口分开设置有位于第一连通路入口下方的第二连通路入口，并使第二室内的液体从第二连通路入口流入第一室。

5. 发明授权

US07344652B2 Plasma etching method 失效
标题翻译：等离子蚀刻法
公开(公告)号：US07344652B2
公开(公告)日：2008-03-18
申请号：US11487516
申请日：2006-07-17
申请人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
发明人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
IPC分类号： H01L21/00 , B44C1/22
CPC分类号： H01L21/67069 , H01J37/32623 , H01L21/3065 , H01L21/3081 , H01L21/3083
摘要： An etching method for forming a recess (220) having an opening dimension (R) of millimeter order in an object (212) to be etched such as a semiconductor wafer. A mask (214) having an opening corresponding to the recess (220) is formed on the object (212). The object (212) with the mask (214) is placed in a processing vessel for plasma etching and etched in it using a plasma. The material of the portion around the opening of the mask (214) is the same as the material, for example, silicon of the object (212). Hence, the recess (220) can be so formed as not to form a sub-trench shape (a shape formed by etching the periphery of which is deeper than the center) substantially in the bottom (222).
摘要翻译：一种蚀刻方法，用于在被蚀刻的物体（212）中形成具有毫米级的开口尺寸（R）的凹部（220），例如半导体晶片。在物体（212）上形成具有对应于凹部（220）的开口的面罩（214）。将具有掩模（214）的物体（212）放置在用于等离子体蚀刻的处理容器中，并使用等离子体蚀刻在其中。掩模（214）的开口周围部分的材料与物体（212）的材料（例如硅）相同。因此，凹部（220）可以形成为不形成基本上在底部（222）中形成副沟槽形状（通过蚀刻其周边比中心更深的形状形成的形状）。

6. 发明授权

US07141178B2 Plasma etching method 失效
公开(公告)号：US07141178B2
公开(公告)日：2006-11-28
申请号：US10497534
申请日：2002-12-09
申请人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
发明人： Kazuya Nagaseki , Takanori Mimura , Hiroki Miyajima
IPC分类号： H01L21/00 , B44C1/22
CPC分类号： H01L21/67069 , H01J37/32623 , H01L21/3065 , H01L21/3081 , H01L21/3083
摘要： An etching method for forming a recess (220) having an opening dimension (R) of millimeter order in an object (212) to be etched such as a semiconductor wafer. A mask (214) having an opening corresponding to the recess (220) is formed on the object (212). The object (212) with the mask (214) is placed in a processing vessel for plasma etching and etched in it using a plasma. The material of the portion around the opening of the mask (214) is the same as the material, for example, silicon of the object (212). Hence, the recess (220) can be so formed as not to form a sub-trench shape (a shape formed by etching the periphery of which is deeper than the center) substantially in the bottom (222).

7. 发明申请

US20060157698A1 Semiconductor manufacturing system, semiconductor device and method of manufacture 审中-公开
标题翻译：半导体制造系统，半导体器件及制造方法
公开(公告)号：US20060157698A1
公开(公告)日：2006-07-20
申请号：US11274346
申请日：2005-11-16
申请人： Hiroki Miyajima
发明人： Hiroki Miyajima
IPC分类号： H01L21/66 , H01L23/58
CPC分类号： H01L21/67288
摘要： A semiconductor manufacturing system for accurately recognizing the timing of maintenance of the system includes a processing chamber (101) and a movable member (107) moving in and out of the processing chamber (101). The movable member (107) has a sensor (106) for observing a state in the processing chamber (101).
摘要翻译：用于准确地识别系统的维护定时的半导体制造系统包括处理室（101）和移入和移出处理室（101）的可移动构件（107）。可移动部件（107）具有用于观察处理室（101）中的状态的传感器（106）。

8. 发明授权

US08764166B2 Liquid ejecting head and liquid ejecting apparatus 有权
标题翻译：液体喷头和液体喷射装置
公开(公告)号：US08764166B2
公开(公告)日：2014-07-01
申请号：US13075135
申请日：2011-03-29
申请人： Hiroki Miyajima , Kimiyasu Otsuki
发明人： Hiroki Miyajima , Kimiyasu Otsuki
IPC分类号： B41J2/14 , B41J2/16 , B41J2/04 , B41J2/05 , B41J2/45
CPC分类号： B41J2/14072 , B41J2/14274 , B41J2002/14491
摘要： A liquid ejecting head includes a main liquid ejecting head body, in which is formed a liquid flow channel through which a liquid flows, that ejects the liquid from a nozzle opening using a pressurizing unit; a driving board configured so as to supply power to the pressurizing unit; a connector provided at an end portion of the driving board; and a holding member configured so as to hold the driving board in a bent state and erected relative to one end surface of the main liquid ejecting head body. The holding member has a stopping portion that holds an end of the driving board in which the connector is provided, and the configuration is such that the stopping portion prevents the driving board from opening in the direction of the bend.
摘要翻译：液体喷射头包括主液体喷射头主体，其中形成有液体流动的液体流动通道，其使用加压单元从喷嘴开口喷射液体; 驱动板，被构造成向加压单元供电; 设置在所述驱动板的端部的连接器; 以及保持构件，其构造成将所述驱动板保持在弯曲状态并相对于所述主液体喷射头本体的一个端面竖立。保持构件具有保持设置有连接器的驱动板的端部的止动部，并且该结构使得止动部防止驱动板沿弯曲方向打开。

9. 发明授权

US08256879B2 Self-sealing unit, liquid ejecting head unit and liquid ejecting apparatus 有权
标题翻译：自密封单元，液体喷射头单元和液体喷射装置
公开(公告)号：US08256879B2
公开(公告)日：2012-09-04
申请号：US12752338
申请日：2010-04-01
申请人： Hiroki Miyajima
发明人： Hiroki Miyajima
IPC分类号： B41J2/175
CPC分类号： B41J2/17596
摘要： A self-sealing unit has a liquid supply route for supplying liquid to a liquid ejecting head. The self-sealing unit includes a pressure chamber on the liquid supply route and a valving element that opens or closes the liquid supply route to supply the liquid. A biasing member biases the valving element to close the liquid supply route. A film is fixed to the body of the self-sealing unit to demarcate the pressure chamber and causes the valving element to open by being displaced toward the pressure chamber side by a negative pressure acting in the pressure chamber. A convex section is positioned between the valving element and a wall surface of the pressure chamber. The distance between the valving element and the wall surface is shorter than that in other areas, away from the valving element and the wall surface such that the convex section supports the film.
摘要翻译：自密封单元具有用于将液体供应到液体喷射头的液体供应路径。自密封单元包括在液体供应路径上的压力室和打开或关闭供应液体的液体供应路线的阀元件。偏置构件偏压阀元件以关闭液体供应路线。将胶片固定在自密封单元的主体上以划分压力室，并通过作用在压力室中的负压向压力室侧移动使阀元件打开。凸形部分位于阀元件和压力室的壁表面之间。阀元件和壁面之间的距离比其它区域的距离远离阀元件和壁表面，使得凸部支撑膜。

10. 发明申请

US20100253752A1 SELF-SEALING UNIT, LIQUID EJECTING HEAD UNIT AND LIQUID EJECTING APPARATUS 有权
标题翻译：自密封单元，液体喷射头和液体喷射装置
公开(公告)号：US20100253752A1
公开(公告)日：2010-10-07
申请号：US12752338
申请日：2010-04-01
申请人： Hiroki MIYAJIMA
发明人： Hiroki MIYAJIMA
IPC分类号： B41J2/175
CPC分类号： B41J2/17596
摘要： A self-sealing unit has a liquid supply route for supplying liquid to a liquid ejecting head. The self-sealing unit includes a pressure chamber on the liquid supply route and a valving element that opens or closes the liquid supply route to supply the liquid. A biasing member biases the valving element to close the liquid supply route. A film is fixed to the body of the self-sealing unit to demarcate the pressure chamber and causes the valving element to open by being displaced toward the pressure chamber side by a negative pressure acting in the pressure chamber. A convex section is positioned between the valving element and a wall surface of the pressure chamber. The distance between the valving element and the wall surface is shorter than that in other areas, away from the valving element and the wall surface such that the convex section supports the film.
摘要翻译：自密封单元具有用于将液体供应到液体喷射头的液体供应路径。自密封单元包括在液体供应路径上的压力室和打开或关闭供应液体的液体供应路线的阀元件。偏置构件偏压阀元件以关闭液体供应路线。将胶片固定在自密封单元的主体上以划分压力室，并通过作用在压力室中的负压向压力室侧移动使阀元件打开。凸形部分位于阀元件和压力室的壁表面之间。阀元件和壁面之间的距离比其它区域的距离远离阀元件和壁表面，使得凸部支撑膜。

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