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    • 2. 发明授权
    • Image processing apparatus, image reading apparatus, image forming apparatus with units to calculate spectral reflectance and relating coefficient and methods therefor
    • 图像处理装置,图像读取装置,具有计算光谱反射率的单位的图像形成装置及其相关系数及其方法
    • US08422084B2
    • 2013-04-16
    • US11806958
    • 2007-06-05
    • Fumio NakayaHirokazu Ichikawa
    • Fumio NakayaHirokazu Ichikawa
    • H04N1/387H04N1/60
    • H04N1/2307H04N1/233
    • There is provided an image processing apparatus includes a spectral reflectance calculation unit that calculates spectral reflectances respectively in plural wavelength ranges, based on intensity of reflected light from an object to be imaged and irradiation intensity of light that the object to be imaged is irradiated with; a determination unit that obtains derivatives of a function represented on the basis of the spectral reflectances calculated by the spectral reflectance calculation unit, and determines a number of eigenvectors, depending on whether the derivatives are positive or negative; a coefficient calculation unit that calculates coefficients where the spectral reflectances are expressed by linear combination of the number of eigenvectors and the coefficients respectively related to the eigenvectors, the number of eigenvectors being determined by the determination unit; and an output unit that outputs the coefficients calculated by the coefficient calculation unit.
    • 提供了一种图像处理装置,包括:分光反射计算单元,其基于来自被成像对象的反射光的强度和照射被摄体的光的照射强度,分别计算多个波长范围的光谱反射率; 确定单元,其获得基于由所述光谱反射率计算单元计算的光谱反射率表示的函数的导数,并且根据所述导数是正还是负来确定特征向量的数量; 系数计算单元,其计算通过特征向量的数量和分别与特征向量相关的系数的线性组合来表示光谱反射率的系数,由确定单元确定的特征向量的数量; 以及输出单元,其输出由系数计算单元计算出的系数。
    • 4. 发明授权
    • Wave soldering bath
    • 波峰焊浴
    • US07988030B2
    • 2011-08-02
    • US11886006
    • 2006-03-07
    • Mitsuo ZenHirokazu Ichikawa
    • Mitsuo ZenHirokazu Ichikawa
    • B23K1/08
    • B23K1/085B23K3/0653
    • In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (10), and the vortex rubs the bottom surface of the bath body.In the present invention, a shielding member (14) is installed between the duct inlet (12) and the bottom surface (13) of the bath body such that the vortex is prevented from affecting the bottom surface.
    • 在传统的波峰焊浴中,位于管道入口下方位置的浴体的底面经熔融焊料侵蚀,并形成有孔,使熔融焊料从孔中溢出。 浴体底面的侵蚀的原因是伴随着叶轮泵(10)旋转而形成在管道入口下方的熔融焊料的涡流(T),并且涡流摩擦浴体的底面。 在本发明中,屏蔽构件(14)安装在浴体的管道入口(12)和底面(13)之间,从而防止涡流影响底面。
    • 5. 发明申请
    • Image processing apparatus, image reading apparatus, image forming apparatus, and methods therefor
    • 图像处理装置,图像读取装置,图像形成装置及其方法
    • US20080137154A1
    • 2008-06-12
    • US11802103
    • 2007-05-18
    • Fumio NakayaHirokazu Ichikawa
    • Fumio NakayaHirokazu Ichikawa
    • H04N1/04
    • H04N1/60
    • An image processing apparatus comprises: a first calculation section that calculates a plurality of spectral reflectances at a plurality of wavelengths based on intensities of light irradiating an object and reflected from the object, the light having a certain spectral energy distribution; a second calculation section that calculates color descriptor values of the object based on the spectral reflectances calculated by the first calculation section; a third calculation section that calculates a set of factors when the color descriptor values are expressed using a linear combination of a predetermined plurality of eigenvectors, factors associated with the respective eigenvectors, and either spectral energy of a reference light or theoretical spectral energy of a virtual light; and an output section that outputs the factors calculated by the third calculation section.
    • 一种图像处理装置,包括:第一计算部,其基于照射物体的光的强度和从物体反射的光,计算多个波长的多个光谱反射率,所述光具有一定的光谱能量分布; 第二计算部,其基于由所述第一计算部计算出的光谱反射率来计算所述对象的颜色描述符值; 第三计算部分,当使用预定的多个特征向量的线性组合,与各个特征向量相关联的因子以及参考光的光谱能量或虚拟的参考光的理论光谱能量来表示颜色描述符值时,计算一组因子 光; 以及输出部,其输出由所述第三计算部计算出的因数。
    • 6. 发明授权
    • Image scanning apparatus
    • 图像扫描装置
    • US07154641B2
    • 2006-12-26
    • US09947370
    • 2001-09-07
    • Hirokazu Ichikawa
    • Hirokazu Ichikawa
    • H04N1/04
    • H04N1/1951H04N1/19505H04N1/19568
    • A one-dimensional image sensor has N number of photosensitive element arrays arranged parallel to the fast scanning direction, N being a positive integer greater than 1. The adjacent N number photosensitive element arrays are separated from one another by a distance equal to the width of D number arrays in the slow scanning direction. If the moving speed of the one-dimensional image sensor in the slow scanning direction is set to M times as high as an ordinary speed, the distance between the adjacent N number photosensitive element arrays expressed in terms of the width of the D number arrays satisfies the following equation: D=M·a/n where a≠nN, n being a positive integer equal to or smaller than N.
    • 一维图像传感器具有平行于快速扫描方向排列的N个感光元件阵列,N是大于1的正整数。相邻的N数量感光元件阵列彼此分开距离等于 D数字阵列在慢扫描方向。 如果将一维图像传感器在慢扫描方向上的移动速度设定为普通速度的M倍,则以D数列的宽度表示的相邻的N个光敏元件阵列之间的距离满足 以下等式:<?in-line-formula description =“In-line Formulas”end =“lead”?> D = Ma / n <?in-line-formula description =“In-line Formulas”end =“tail “?”,其中a> nN,n是等于或小于N的正整数。
    • 8. 发明授权
    • Process for fabricating electronic devices and image sensor
    • 制造电子设备和图像传感器的过程
    • US5337474A
    • 1994-08-16
    • US889994
    • 1992-05-29
    • Koichi OkaHirokazu Ichikawa
    • Koichi OkaHirokazu Ichikawa
    • H01L21/82H01L27/146H04N1/028H05K3/02
    • H01L27/146Y10T29/4913Y10T29/49144Y10T29/49155Y10T29/49789
    • Input/output areas of device elements are provided at opposite ends of the original substrate, and two function areas are provided between the opposite input/output areas. The original substrate composing a large-size device is cut along lines in such a way that the input/output areas and the function areas are separated from one another. As a result, those portions of the original substrate where no function areas are to be formed are reduced, thereby contributing to effective utilization of the surface of the substrate for increasing the number of sensor substrates that can be yielded from it. The process is improved in the shape and layout of the substrates for electronic devices to be obtained by cutting the large-area device formed on the substrate and it hence is capable of yielding a greater number of electronic device elements from the large-area device.
    • 设备元件的输入/输出区域设置在原始基板的相对端,并且在相对的输入/输出区域之间提供两个功能区域。 构成大尺寸装置的原始基板沿着线切割,使得输入/输出区域和功能区域彼此分离。 结果,原始基板的不会形成功能区域的那些部分被减少,从而有助于有效利用基板的表面以增加可以从其产生的传感器基板的数量。 通过切割形成在基板上的大面积元件可以获得的电子器件用基板的形状和布局的改进,因此能够从大面积的器件产生更多数量的电子器件元件。
    • 9. 发明授权
    • Automatic soldering device and carrier device
    • 自动焊接装置和载体装置
    • US08186563B2
    • 2012-05-29
    • US13146193
    • 2010-01-26
    • Takashi SugiharaTakashi UsubaHirokazu IchikawaToshihiko Mutsuji
    • Takashi SugiharaTakashi UsubaHirokazu IchikawaToshihiko Mutsuji
    • B23K37/04
    • B23K1/0016B23K1/085B23K3/08B23K2101/42B65G37/005H05K3/3468
    • To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion.Conveying hooks 10 that hold the printed circuit board W1 therebetween, conveying chains 15a, 15b that drive so that the conveying hooks 10 are movable from a heater part 4 to a solder bath 5, first frames 9A that guide the conveying chains 15a, 15b along the heater part 4, second frames 9B that guide the conveying chain 15 along the solder bath 5, and an absorbing member 124 that is provided between each of the first frames 9A and each of the second frames 9B and absorbs an expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b are provided. Since the absorbing member 124 absorbs the expansion and contraction based on difference of any thermal expansion between the frames 9A, 9B and the conveying chains 15a, 15b, it is possible to prevent the conveying chains 15a, 15b from being deviated from the frames 9A, 9B. This enables the printed circuit board W1 to be fixed on the predetermined position and to be conveyed to the heater part 4 and the solder bath 5.
    • 为了使电路板固定在预定位置并被输送到焊料处理部分。 将印刷电路板W1保持在其间的输送钩10,输送链条15a,15b,其驱动使得输送钩10能够从加热器部分4移动到焊料槽5;第一框架9A,其引导输送链条15a,15b沿着 加热器部分4,沿着焊料槽5引导输送链条15的第二框架9B和设置在每个第一框架9A和每个第二框架9B之间的吸收构件124,其基于 提供了框架9A,9B和输送链15a,15b之间的任何热膨胀差异。 由于吸收构件124基于框架9A,9B和输送链15a,15b之间的任何热膨胀的差异而吸收膨胀和收缩,因此可以防止输送链15a,15b从框架9A, 9B。 这使得印刷电路板W1能够固定在预定位置并被传送到加热器部分4和焊料槽5。