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1. 发明申请

US20060169485A1 Rigid-flex wiring board 有权
标题翻译：刚性布线板
公开(公告)号：US20060169485A1
公开(公告)日：2006-08-03
申请号：US10546298
申请日：2004-04-16
申请人： Katsuo Kawaguchi , Hirofumi Futamura
发明人： Katsuo Kawaguchi , Hirofumi Futamura
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K3/4614 , H05K3/462 , H05K2203/1189
摘要： A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.
摘要翻译：挠性刚性布线板具有插入在刚性和柔性基板之间彼此重叠的部分之间的绝缘粘合剂; 并且刚性和柔性基板上的互连电极焊盘通过穿过绝缘粘合剂的导体块彼此电连接，从而在高频带中提供降低的电感，缩短的信号延迟时间，由于信号反映的减少的噪声产生波浪降低，连接可靠性高，线连接自由度高等优点，并且可以以低成本和高收率有利地制造布线基板。

2. 发明申请

US20080107802A1 FLEX-RIGID WIRING BOARD 审中-公开
标题翻译： FLEX-RIGID接线板
公开(公告)号：US20080107802A1
公开(公告)日：2008-05-08
申请号：US11965106
申请日：2007-12-27
申请人： Katsuo Kawaguchi , Hirofumi Futamura , Yukinobu Mikado , Sotarou Ito
发明人： Katsuo Kawaguchi , Hirofumi Futamura , Yukinobu Mikado , Sotarou Ito
IPC分类号： H05K3/00
CPC分类号： H05K3/4691 , H05K1/117 , H05K3/244 , H05K3/323 , H05K3/361 , H05K3/4614 , H05K3/462 , H05K2201/09063 , H05K2201/09481 , H05K2201/096 , H05K2201/09781 , H05K2201/09845 , H05K2203/063 , Y10T29/49126
摘要： In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can be prevented from being delayed, noises can be suppressed, and an excellent electrical connection and connection reliability be assured.
摘要翻译：在由刚性基材形成的刚性基板和由柔性基材形成的柔性基板堆叠接合并彼此电连接的柔性刚性布线板中，柔性基板包括具有互连电极焊盘设置在其至少一个表面上，并且所述刚性基板包括导电层，所述导电层在与所述刚性基板上的所述互连电极焊盘相对的位置的至少一个表面上设置有互连电极焊盘，插入在各自包括至少互连电极焊盘的衬底部分的导电层之间的各向异性导电粘合剂层。在这种柔性刚性布线板中，可以防止高频信号的传输延迟，可以抑制噪声，并且确保良好的电连接和连接可靠性。

3. 发明授权

US09320148B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09320148B2
公开(公告)日：2016-04-19
申请号：US13431091
申请日：2012-03-27
申请人： Yukinobu Mikado , Shunsuke Sakai , Hirofumi Futamura
发明人： Yukinobu Mikado , Shunsuke Sakai , Hirofumi Futamura
IPC分类号： H05K1/02 , H05K1/16 , H05K1/18 , H05K3/46 , H01L23/538 , H01L23/00 , H01L23/498
CPC分类号： H05K1/185 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L2224/12105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01029 , H01L2924/12042 , H01L2924/3511 , H05K1/0271 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2203/0191 , H05K2203/1469 , H01L2924/00
摘要： A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm.
摘要翻译：印刷电路板包括具有延伸穿过芯基板的穿透孔的芯基板，容纳在芯基板的贯通孔中的电子部件，部件和芯基板之间的填充树脂填充间隙，形成第一树脂绝缘层在芯基板的第一表面和与芯基板的第一表面相反的一侧上形成的第二树脂绝缘层和芯基板的第二表面上。填充树脂的弹性模量设定为低于0.2Gpa，热膨胀系数设定为高于100ppm且低于200ppm，芯基材的弹性模量设定为高于30Gpa ，热膨胀系数设定为低于10ppm。

4. 发明申请

US20130020120A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20130020120A1
公开(公告)日：2013-01-24
申请号：US13484381
申请日：2012-05-31
申请人： Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
发明人： Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
IPC分类号： H05K1/11 , H05K3/00 , H05K1/02
CPC分类号： H05K1/183 , H05K3/3452 , H05K3/4691 , H05K3/4697 , H05K2201/09036 , H05K2201/09063 , H05K2201/09127 , H05K2201/09136 , H05K2201/09854 , Y10T29/49128
摘要： A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
摘要翻译：布线基板具有在层叠结构体的第一面侧具有凹部的层叠结构体和位于第一面侧的相反侧的层叠结构体的第二面侧的阻焊层。叠层结构具有形成在该凹部的底部的第一表面侧焊盘和形成在层叠结构的第二表面侧的第二表面侧焊盘，阻焊层具有第一开口部和第二开口所述第一开口部露出所述第二表面侧焊盘，所述第二开口部形成在所述凹部的背面，所述凹部的背面不包括所述第二开口部，表面侧垫

5. 发明授权

US09258897B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09258897B2
公开(公告)日：2016-02-09
申请号：US13484381
申请日：2012-05-31
申请人： Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
发明人： Teruyuki Ishihara , Hidetoshi Noguchi , Hirofumi Futamura
IPC分类号： H05K1/02 , H05K1/18 , H05K3/34 , H05K3/46
CPC分类号： H05K1/183 , H05K3/3452 , H05K3/4691 , H05K3/4697 , H05K2201/09036 , H05K2201/09063 , H05K2201/09127 , H05K2201/09136 , H05K2201/09854 , Y10T29/49128
摘要： A wiring board has a laminated structure having a recessed portion on a first-surface side of the laminated structure and a solder resist layer on a second-surface side of the laminated structure on the opposite side of the first-surface side. The laminated structure has a first-surface side pad formed in the bottom of the recessed portion and a second-surface side pad formed on the second-surface side of the laminated structure, the solder resist layer has a first opening portion and a second opening portion formed in the solder resist layer, the first opening portion is exposing the second-surface side pad, the second opening portion is formed on a back face of the recessed portion, and the back face of the recessed portion does not include the second-surface side pad.
摘要翻译：布线基板具有在层叠结构体的第一表面侧具有凹部的层叠结构，在层叠结构体的与第一面侧相反一侧的第二面侧的阻焊层。该叠层结构具有形成在该凹部的底部的第一表面侧焊盘和形成在层叠结构的第二表面侧的第二表面侧焊盘，该阻焊层具有第一开口部和第二开口所述第一开口部露出所述第二表面侧焊盘，所述第二开口部形成在所述凹部的背面，所述凹部的背面不包括所述第二表面侧焊盘，表面侧垫

6. 发明申请

US20120250277A1 PRINTED WIRING BOARD 有权
标题翻译：印刷线路板
公开(公告)号：US20120250277A1
公开(公告)日：2012-10-04
申请号：US13431091
申请日：2012-03-27
申请人： Yukinobu MIKADO , Shunsuke Sakai , Hirofumi Futamura
发明人： Yukinobu MIKADO , Shunsuke Sakai , Hirofumi Futamura
IPC分类号： H05K1/14 , H05K1/18 , H05K7/14 , H05K1/02
CPC分类号： H05K1/185 , H01L23/49894 , H01L23/5389 , H01L24/24 , H01L2224/12105 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01029 , H01L2924/12042 , H01L2924/3511 , H05K1/0271 , H05K3/4602 , H05K2201/068 , H05K2201/10674 , H05K2203/0191 , H05K2203/1469 , H01L2924/00
摘要： A printed wiring board includes a core substrate having a penetrating hole extending through the core substrate, an electronic component accommodated in the penetrating hole of the core substrate, a filler resin filling clearance between the component and the core substrate, a first resin insulation layer formed on the component and a first surface of the core substrate, and a second resin insulation layer formed on the component and a second surface of the core substrate on the opposite side of the first surface of the core substrate. The filler resin has elastic modulus which is set to be lower than 0.2 Gpa and thermal expansion coefficient which is set to be higher than 100 ppm and lower than 200 ppm, and the core substrate has elastic modulus which is set to be higher than 30 Gpa, and thermal expansion coefficient which is set to be lower than 10 ppm.
摘要翻译：印刷电路板包括具有延伸穿过芯基板的穿透孔的芯基板，容纳在芯基板的贯通孔中的电子部件，部件和芯基板之间的填充树脂填充间隙，形成第一树脂绝缘层在芯基板的第一表面和与芯基板的第一表面相反的一侧上形成的第二树脂绝缘层和芯基板的第二表面上。填充树脂的弹性模量设定为低于0.2Gpa，热膨胀系数设定为高于100ppm且低于200ppm，芯基材的弹性模量设定为高于30Gpa ，热膨胀系数设定为低于10ppm。

7. 发明申请

US20120217049A1 WIRING BOARD WITH BUILT-IN IMAGING DEVICE 审中-公开
标题翻译：具有内置成像装置的接线板
公开(公告)号：US20120217049A1
公开(公告)日：2012-08-30
申请号：US13334152
申请日：2011-12-22
申请人： Nobuhiro HANAI , Takaya ENDO , Hirofumi FUTAMURA
发明人： Nobuhiro HANAI , Takaya ENDO , Hirofumi FUTAMURA
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L2224/16225 , H01L2924/3511 , H05K3/4652 , H05K3/4697 , H05K2201/09127 , H05K2201/10121
摘要： A wiring board with a built-in imaging element including a substrate having an accommodation portion, an imaging device having a light receiver and positioned in the accommodation portion such that the light receiver faces a first surface of the substrate, first insulation layers having an opening portion and formed on the first surface of the substrate such that the light receiver is exposed from the opening portion, and second insulation layers formed on a second surface of the substrate. The first insulation layers include a first insulation layer, the second insulation layers include a second insulation layer, the second insulation layer is positioned at a predetermined tier and has a thermal expansion coefficient which is set lower than that of the first insulation layer at a predetermined tier such that imbalance in thermal expansion and contraction between the first and second insulation layers is substantially offset or mitigated.
摘要翻译：一种具有内置成像元件的布线板，包括具有容纳部分的基板，具有光接收器的成像装置，位于所述容纳部分中，使得所述光接收器面对所述基板的第一表面，所述第一绝缘层具有开口并且形成在基板的第一表面上，使得光接收器从开口部分露出，并且第二绝缘层形成在基板的第二表面上。所述第一绝缘层包括第一绝缘层，所述第二绝缘层包括第二绝缘层，所述第二绝缘层位于预定层，并且具有设定为比所述第一绝缘层的热膨胀系数低的预定的热膨胀系数使得第一和第二绝缘层之间的热膨胀和收缩的不平衡被基本上抵消或减轻。

8. 发明授权

US07655869B2 Flex-rigid wiring board 有权
标题翻译：柔性刚性接线板
公开(公告)号：US07655869B2
公开(公告)日：2010-02-02
申请号：US11965384
申请日：2007-12-27
申请人： Katsuo Kawaguchi , Hirofumi Futamura
发明人： Katsuo Kawaguchi , Hirofumi Futamura
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K3/4614 , H05K3/462 , H05K2203/1189
摘要： A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.
摘要翻译：挠性刚性布线板具有插入在刚性和柔性基板之间彼此重叠的部分之间的绝缘粘合剂; 并且刚性和柔性基板上的互连电极焊盘通过穿过绝缘粘合剂的导体块彼此电连接，从而在高频带中提供降低的电感，缩短的信号延迟时间，由于信号反映的减少的噪声产生波浪降低，连接可靠性高，线连接自由度高等优点，并且可以以低成本和高收率有利地制造布线基板。

9. 发明授权

US07423219B2 Flex-rigid wiring board 有权
标题翻译：柔性刚性接线板
公开(公告)号：US07423219B2
公开(公告)日：2008-09-09
申请号：US10558289
申请日：2005-05-23
申请人： Katsuo Kawaguchi , Hirofumi Futamura , Yukinobu Mikado , Sotarou Ito
发明人： Katsuo Kawaguchi , Hirofumi Futamura , Yukinobu Mikado , Sotarou Ito
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K1/117 , H05K3/244 , H05K3/323 , H05K3/361 , H05K3/4614 , H05K3/462 , H05K2201/09063 , H05K2201/09481 , H05K2201/096 , H05K2201/09781 , H05K2201/09845 , H05K2203/063 , Y10T29/49126
摘要： In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads.
摘要翻译：在由刚性基材形成的刚性基板和由柔性基材形成的柔性基板堆叠接合并彼此电连接的柔性刚性布线板中，柔性基板包括具有互连电极焊盘设置在其至少一个表面上，并且所述刚性基板包括导电层，所述导电层在与所述刚性基板上的所述互连电极焊盘相对的位置的至少一个表面上设置有互连电极焊盘，插入在各自包括至少互连电极焊盘的衬底部分的导电层之间的各向异性导电粘合剂层。

10. 发明授权

US07378596B2 Rigid-flex wiring board 有权
标题翻译：刚性布线板
公开(公告)号：US07378596B2
公开(公告)日：2008-05-27
申请号：US10546298
申请日：2004-04-16
申请人： Katsuo Kawaguchi , Hirofumi Futamura
发明人： Katsuo Kawaguchi , Hirofumi Futamura
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K3/4614 , H05K3/462 , H05K2203/1189
摘要： A flex-rigid wiring board has an insulative adhesive interposed between portions, lapping over each other, of the rigid and flexible substrates; and the interconnecting electrode pads on the rigid and flexible substrates are electrically connected to each other through a conductor lump penetrating the insulative adhesive, thereby providing lowered inductance in the high-frequency band, shortened signal-delay time, reduced noise generation due to signal reflected-wave, reduced drop impact, high connection reliability and high freedom of wire connection, and the wiring board can advantageously be manufactured with a reduced cost and a high yield.
摘要翻译：挠性刚性布线板具有插入在刚性和柔性基板之间彼此重叠的部分之间的绝缘粘合剂; 并且刚性和柔性基板上的互连电极焊盘通过穿过绝缘粘合剂的导体块彼此电连接，从而在高频带中提供降低的电感，缩短的信号延迟时间，由于信号反映的减少的噪声产生波浪降低，连接可靠性高，线连接自由度高等优点，并且可以以低成本和高收率有利地制造布线基板。

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