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    • 2. 发明授权
    • Photosensitive resin composition comprising a halogen-free colorant
    • 包含无卤素着色剂的感光树脂组合物
    • US08034531B2
    • 2011-10-11
    • US10535373
    • 2003-11-19
    • Hidetaka OkaJean-Marie Adam
    • Hidetaka OkaJean-Marie Adam
    • G03C1/00C09B47/04C09B62/00C09B67/00
    • H05K3/287G03F7/038G03F7/105H05K1/0269H05K3/0076H05K2203/161
    • The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1,-C4.-Alkyl, R2 is hydrogen or C1,-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1,-C6alkyl, C1,-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1,-C4,-Alkyl or phenyl, R4, is C1,-C4-Alkyl or phenyl and R5 is C1,-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.
    • 本发明涉及一种光敏树脂组合物,其包含a)作为组分(A)的式(I)的绿色着色剂,其中环A,B,C和D被羟基或部分取代,其中R 1是氢 或C 1 -C 4 - 烷基,R 2是氢或C 1 -C 4烷基,n是0,1,2或3,并且环E是未取代的或被C 1 -C 6烷基,C 1 -C 6烷氧基,羟基, NHCOR3,NHSO2,R4或SO2NHR5,其中R3是C1,-C4, - 烷基或苯基,R4是C1,-C4-烷基或苯基,R5是C1,-C4-烷基或苯基,b) (B)碱溶性低聚物或聚合物(反应性或非反应性),c)作为组分(C)可聚合单体,d)作为组分(D)的光引发剂,e)作为组分(E)的环氧化合物, 并且如果需要,f)作为组分(F)在印刷电路板的制造中用作阻焊剂的另外的添加剂,抗蚀剂或电镀抗蚀剂。
    • 3. 发明授权
    • Photosensitive resin composition
    • 感光树脂组合物
    • US07829257B2
    • 2010-11-09
    • US09734635
    • 2000-12-12
    • Hidetaka OkaKazuhiko KunimotoHisatoshi KuraMasaki OhwaJunichi Tanabe
    • Hidetaka OkaKazuhiko KunimotoHisatoshi KuraMasaki OhwaJunichi Tanabe
    • G03C1/00
    • C08F2/50G03F7/031
    • Photosensitive compositions comprising (A) an alkali soluble compound; (B) at least one compound, of formula I or II wherein R1 inter alia is C4-C9cycloalkanoyl, C3-C12alkenoyl, or benzoyl which is unsubstituted or substituted; Ar1 is either C6-C20aryl or C6-C20aryloyl each of which is unsubstituted or substituted; x is 2 or 3; M1 when x is 2, inter alia is a group phenylene or naphthylene, each of which optionally is substituted i.a. by OR3, SR4 or NR5R6; or M1, when x is 3, is a trivalent group, optionally substituted; R3 is for example hydrogen or C1-C12alkyl; C2-C6alkyl which is for example substituted by —OH, —SH, —CN, C3-C6alkenoxy, or —OCH2CH2CN; R4 is for example hydrogen, C1-C12alkyl, C3-C12alkenyl, cyclohexyl, or phenyl which is unsubstituted or substituted; R5 and R6 independently of each other inter alia are hydrogen, C1-C12alkyl, C2-C4hydroxyalkyl, C2-C10alkoxyalkyl, C3-C5alkenyl, C3-C8cycloalkyl, phenyl-C1-C3alkyl, C1-C4alkanoyl, C3-C6alkenoyl, benzoyl or phenyl which is unsubstituted or substituted; and (C) a photopolymerizable compound; exhibit an unexpectedly good performance, in particular in photoresist technology.
    • 光敏组合物,其包含(A)碱溶性化合物; (B)至少一种式I或II的化合物,其中R 1特别是C 4 -C 9环烷酰基,C 3 -C 12烯酰基或未取代或取代的苯甲酰基; Ar 1是C 6 -C 20芳基或C 6 -C 20芳酰基,其各自为未取代或取代的; x为2或3; M1当x为2时,特别是亚苯基或亚萘基,其各自任选被取代。 由OR3,SR4或NR5R6; 或M1,当x为3时,为任选取代的三价基团; R3是例如氢或C1-C12烷基; 例如被-OH,-SH,-CN,C 3 -C 6烯氧基或-OCH 2 CH 2 CN取代的C 2 -C 6烷基; R4是例如氢,C1-C12烷基,C3-C12链烯基,环己基或未取代或取代的苯基; R 5和R 6彼此独立地尤其是氢,C 1 -C 12烷基,C 2 -C 4羟烷基,C 2 -C 10烷氧基烷基,C 3 -C 5烯基,C 3 -C 8环烷基,苯基-C 1 -C 3烷基,C 1 -C 4烷酰基,C 3 -C 6烯酰基,苯甲酰基或苯基 未取代或取代; 和(C)可光聚合化合物; 表现出意想不到的良好性能,特别是在光刻胶技术中。
    • 5. 发明授权
    • Photosensitive resin composition
    • 感光树脂组合物
    • US07556843B2
    • 2009-07-07
    • US11818073
    • 2007-06-13
    • Hisatoshi KuraHidetaka OkaMasaki Ohwa
    • Hisatoshi KuraHidetaka OkaMasaki Ohwa
    • G03F7/00C08J3/28
    • C08F2/50B33Y70/00C07D295/112C07D295/135G03F7/0007G03F7/031
    • A photopolymerization process for producing pigmented and non-pigmented articles comprises irradiating with electromagnetic radiation in the range from 190 to 600 nm, or with electron beam or with X-rays a photosensitive composition which can be developed by alkali solution which composition comprises (A) a polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200,000 or less, (B) selected α-aminoalkylphenone compounds as photoinitiators and (C) an ester of a polyol, wherein the polyol is partially or fully esterified with an ethylenically unsaturated carboxylic acid a monomeric, oligomeric or polymeric compound having at least one olefinic double bond.
    • 用于制备着色和非着色物品的光聚合方法包括用190-600nm范围内的电磁辐射或用电子束或X射线照射可由碱溶液显影的感光组合物,该组合物包含(A) 在分子中含有至少一个羧酸基并且分子量为200,000以下的聚合物,(B)作为光引发剂的选择的α-氨基烷基苯酮化合物和(C)多元醇的酯,其中所述多元醇部分或完全酯化 烯键式不饱和羧酸是具有至少一个烯属双键的单体,低聚物或聚合物。
    • 7. 发明申请
    • Heat stable photocurable resin composition for dry film resist
    • 用于干膜抗蚀剂的热稳定的光固化树脂组合物
    • US20050260520A1
    • 2005-11-24
    • US10520701
    • 2003-07-01
    • Hidetaka OkaMasaki OhwaJames Taylor
    • Hidetaka OkaMasaki OhwaJames Taylor
    • G03F7/004G03F7/027G03F7/029G03F7/031G03F7/09G03F7/105G03F7/11G03F7/16H05K3/06H05K3/18G03C1/492
    • G03F7/029G03F7/027G03F7/092G03F7/105G03F7/11G03F7/161Y10S430/111
    • The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μm and optionally laminate a protective film onto the photocursable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20-90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula (I), wherein R1 is a residue selected from (II), R2 is C1-C12 alkyl or phenyl which may be mono-, di- or tri-substituted by C1-C6 alkyl, trifluoromethyl, C1-6 alkoxy, C1-6 alkylthio, halogen and nitro; R3 is hydrogen or C1-C12 alkyl; R4 to R9 independently of one another are hydrogen or C1-C12 alkyl; X is O, S, NH or N—C1-C12-alkyl; (a) to (e) being 100% by weight. The above composition is useful to avoid unfavourable colour generation during the heat lamination.
    • 本发明涉及一种通过将光固化树脂组合物形成在厚度为1-50μm的支撑膜上制备干膜抗蚀剂的方法,并且任选地将保护膜层压到可光固化组合物层上以获得干膜抗蚀剂; 由此可光固化树脂由包含(a)20-90重量%的碱溶性粘合剂低聚物或聚合物的均匀混合物形成; (b)5至60重量%的与组分(a)的低聚物和聚合物相容的一种或多种可光聚合单体; (c)0.01至20重量%的一种或多种光引发剂; (d)0至20重量%的添加剂和/或助剂; 和(e)0.1至10重量%的式(I)的无色三苯甲烷染料,其中R 1是选自(II),R 2 O / 是C 1 -C 12烷基或可以被C 1 -C 1亚烷基取代的苯基, C 1-6烷基,三氟甲基,C 1-6烷氧基,C 1-6烷基硫基,卤素和硝基; R 3是氢或C 1 -C 12烷基; R 3是氢或C 1 -C 12烷基; R 9与R 9彼此独立地是氢或C 1 -C 12烷基; X是O,S,NH或N-C 1 -C 12 - 烷基; (a)至(e)为100重量%。 上述组合物可用于在热层压期间避免不利的颜色产生。