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1. 发明授权

US5331235A Multi-chip semiconductor package 失效
标题翻译：多芯片半导体封装
公开(公告)号：US5331235A
公开(公告)日：1994-07-19
申请号：US866846
申请日：1992-04-10
申请人： Heung S. Chun
发明人： Heung S. Chun
IPC分类号： H01L23/495 , H01L23/16
CPC分类号： H01L23/49575 , H01L23/49524 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/181
摘要： A Multi-chip semiconductor package having the thinnest structure. The package includes a chip set including a first bare chip and a second bare chip which are connected to each other by solder interposed therebetween and a plurality of TAB tapes each having an inner lead and an outer lead, the first bare chip and the second bare chip being provided with a plurality of solder bumps at opposite sides of surfaces thereof facing to each other, each of the inner leads being bonded between each corresponding the solder bump of the first bare chip and each corresponding the solder bump of the second bare chip, and a lead frame bonded to the outer leads of the TAB tapes. The chip set of the multi-chip semiconductor package may be connected to other chip set so that the package has four bare chips. Therefore, the thinnest multi-chip semiconductor package can be achieved and an integration of the package is improved. Also, a chip set is formed by fixing lead frames between two bare chips, to render the chip sets stably and firmly stacked and the pads of each bare chip disposed at desired position.
摘要翻译：具有最薄结构的多芯片半导体封装。所述封装包括芯片组，其包括第一裸芯片和第二裸芯片，所述第一裸芯片和第二裸芯片通过插入其间的焊料彼此连接，以及多个TAB带，每个具有内引线和外引线，所述第一裸芯片和所述第二裸芯片芯片在其表面相对的相对侧设置有多个焊料凸块，每个内引线被接合在第一裸芯片的每个相应的焊料凸块和每个对应的第二裸芯片的焊料凸块之间，以及引线框架，其结合到TAB带的外引线上。多芯片半导体封装的芯片组可以连接到其他芯片组，使得封装具有四个裸芯片。因此，可以实现最薄的多芯片半导体封装，并且提高封装的集成。此外，通过将引线框架固定在两个裸芯片之间形成芯片组，以使芯片组稳定且牢固地堆叠，并且将每个裸芯片的焊盘设置在期望位置。

2. 发明授权

US5352852A Charge coupled device package with glass lid 失效
标题翻译：带玻璃盖的电荷耦合器件封装
公开(公告)号：US5352852A
公开(公告)日：1994-10-04
申请号：US101030
申请日：1993-08-03
申请人： Heung S. Chun
发明人： Heung S. Chun
IPC分类号： H01L23/02 , G11C5/00 , H01L23/04 , H01L27/14 , H01L27/148 , H02G3/08 , H05K5/00
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227
摘要： A charge coupled device package with a glass lid is provided. The package includes a charge coupled device having a plurality of conductive bumps on its bond pads, an insulating tape bonded to the inside of the conductive bumps on the charge coupled device, a plurality of metal lines each connected at an end thereof to each of the conductive bumps and at the outer end thereof to a signal terminal of a circuit board and adapted for transmitting an electric signal of the charge coupled device to the outside, and a glass lid provided with the plurality of metal lines on opposite sides of its lower surface and bonded to an upper surface of the insulating tape on the charge coupled device. The sealing part of a sealing resin is provided between a lower periphery of the glass lid and an upper surface of the charge coupled device. This charge coupled device package reduces the package weight as well as the package thickness and thus achieves the recent trend of lightness and compactness of an integrated camera and video cassette recorder system.
摘要翻译：提供具有玻璃盖的电荷耦合器件封装。该封装包括电荷耦合器件，其在其接合焊盘上具有多个导电凸块，绝缘带结合到电荷耦合器件上的导电凸块的内部;多个金属线，每个金属线在其端部连接到每个导电凸块，并且其外端连接到电路板的信号端子，并用于将电荷耦合器件的电信号传输到外部;以及玻璃盖，其在其下表面的相对侧上设置有多条金属线并且结合到电荷耦合器件上的绝缘带的上表面。密封树脂的密封部分设置在玻璃盖的下周边和电荷耦合器件的上表面之间。该电荷耦合器件封装减少了封装重量以及封装厚度，从而实现了集成照相机和盒式录像机系统的最近的亮度和紧凑性趋势。

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