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1. 发明授权

US10667638B2 Recipe generation system for cooking device, and cooking device 审中-公开
公开(公告)号：US10667638B2
公开(公告)日：2020-06-02
申请号：US15544010
申请日：2015-12-15
申请人： Hao Sun , Yuanyuan Zhuang
发明人： Hao Sun , Yuanyuan Zhuang
IPC分类号： A47J27/04 , A47J27/08 , A47J27/14 , A47J27/00 , A47J36/32 , A47J36/00
摘要： The present invention discovers a recipe generation system for a cooking appliance and the cooking appliance. The recipe generation system comprises an operation unit; a weight detection unit configured to measure initial weights of various cooking materials sequentially added into the cooking appliance and measure the overall weight of the cooking materials during cooking and finishing cooking; a timing unit; a parameter calculation unit configured to obtain proportions of the cooking materials based on the initial weights of the cooking materials and calculate weight losses of different cooking materials at different time points; and a parameter determination unit. The present invention can determine dish compositions, key cooking elements for forming the dish and cooking procedures by detection and information processing of a series of operations during cooking for use in subsequent cooking procedures.

2. 发明申请

US20180000274A1 RECIPE GENERATION SYSTEM FOR COOKING DEVICE, AND COOKING DEVICE 审中-公开
公开(公告)号：US20180000274A1
公开(公告)日：2018-01-04
申请号：US15544010
申请日：2015-12-15
申请人： Hao SUN , Yuanyuan ZHUANG
发明人： Hao SUN , Yuanyuan ZHUANG
IPC分类号： A47J27/00 , A47J36/00
CPC分类号： A47J27/00 , A47J36/00 , A47J36/321
摘要： The present invention discovers a recipe generation system for a cooking appliance and the cooking appliance. The recipe generation system comprises an operation unit; a weight detection unit configured to measure initial weights of various cooking materials sequentially added into the cooking appliance and measure the overall weight of the cooking materials during cooking and finishing cooking; a timing unit; a parameter calculation unit configured to obtain proportions of the cooking materials based on the initial weights of the cooking materials and calculate weight losses of different cooking materials at different time points; and a parameter determination unit. The present invention can determine dish compositions, key cooking elements for forming the dish and cooking procedures by detection and information processing of a series of operations during cooking for use in subsequent cooking procedures.

3. 发明授权

US09330941B2 Package carrier and manufacturing method thereof 有权
标题翻译：包装载体及其制造方法
公开(公告)号：US09330941B2
公开(公告)日：2016-05-03
申请号：US13469079
申请日：2012-05-10
申请人： Shih-Hao Sun
发明人： Shih-Hao Sun
IPC分类号： H05K3/34 , H01L21/48 , H01L23/498 , H01L21/683 , H01L23/00
CPC分类号： H05K1/181 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2224/32225 , H01L2224/32227 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/83439 , H01L2224/83444 , H01L2224/83455 , H01L2924/00014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/0132 , H01L2924/0133 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K1/186 , Y10T156/10 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
摘要： A manufacturing method of a package carrier is provided. A supporting board having an upper surface which a patterned circuit layer formed thereon is provided. A portion of the upper surface is exposed by the patterned circuit layer. An insulating layer and a conducting layer located at a first surface of the insulating layer are laminated onto the patterned circuit layer. The patterned circuit layer and the exposed portion of the upper surface are covered by the insulating layer. Plural conductive connection structures are formed on the patterned circuit layer. Plural of pads respectively connecting the conductive connection structures and exposing a portion of the first surface of the insulating layer is defined by patterning the conductive layer. The supporting board is removed so as to expose a second surface of the insulating layer. The second surface and a bonding surface of the patterned circuit layer are coplanar.
摘要翻译：提供了一种封装载体的制造方法。提供具有形成在其上的图案化电路层的上表面的支撑板。上表面的一部分被图案化电路层曝光。位于绝缘层的第一表面的绝缘层和导电层被层叠在图案化电路层上。图案化电路层和上表面的露出部分被绝缘层覆盖。在图案化电路层上形成多个导电连接结构。分别连接导电连接结构和暴露绝缘层的第一表面的一部分的多个焊盘通过图案化导电层来限定。移除支撑板以暴露绝缘层的第二表面。图案化电路层的第二表面和接合表面是共面的。

4. 发明授权

US09065691B2 Sliced transmitter front-end 有权
标题翻译：切片变送器前端
公开(公告)号：US09065691B2
公开(公告)日：2015-06-23
申请号：US13610912
申请日：2012-09-12
申请人： Hsiang-Hui Chang , Augusto Marques , Li-Shin Lai , Chih-Hao Sun , George Chien
发明人： Hsiang-Hui Chang , Augusto Marques , Li-Shin Lai , Chih-Hao Sun , George Chien
IPC分类号： H04L25/02 , H04L27/00
CPC分类号： H04L25/02 , H04L27/0002
摘要： An embodiment of the invention provides a sliced transmitter front-end (TX FE). The sliced TX FE includes first TX FE slices and a second TX FE slice that are connected in parallel. As a whole the first TX FE slices contributes a high-gain section to a superimposed gain range of the sliced TX FE. The second TX FE slice has a gain range that constitutes a low-gain section of the superimposed gain range of the sliced TX FE. A minimum gain of the gain range of the second TX FE slice is smaller than a minimum gain of the high-gain section.
摘要翻译：本发明的实施例提供了一个切片发射机前端（TX FE）。分片TX FE包括并行连接的第一TX FE片和第二TX FE片。作为整体，第一TX FE片对切片TX FE的叠加增益范围贡献高增益部分。第二TX FE切片具有构成切片TX FE的叠加增益范围的低增益部分的增益范围。第二TX FE片的增益范围的最小增益小于高增益部分的最小增益。

5. 发明申请

US20150068034A1 MANUFACTURING METHOD OF PACKAGE CARRIER 审中-公开
标题翻译：包装载体的制造方法
公开(公告)号：US20150068034A1
公开(公告)日：2015-03-12
申请号：US14547147
申请日：2014-11-19
申请人： Shih-Hao Sun
发明人： Shih-Hao Sun
IPC分类号： H05K3/42 , H01L21/48
CPC分类号： H05K3/42 , H01L21/447 , H01L21/486 , H01L23/49827 , H01L33/642 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , Y10T29/49165 , H01L2224/0401
摘要： A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities and the through holes. A conductive material filling up the vias is formed to define plural conductive posts. An insulation layer having a top surface and plural blind vias extending from the top surface to the conductive posts is formed on the upper surface. A patterned circuit layer filling up the blind vias, being connected to the conductive posts and exposing a portion of the top surface is formed on the top surface. A solder mask layer is formed on the patterned circuit layer and has plural openings exposing a portion of the patterned circuit layer to define plural pads.
摘要翻译：提供了一种封装载体的制造方法。提供了具有上表面，下表面，位于下表面的多个空腔和穿过绝缘基板并分别与空腔连通的多个通孔的绝缘基板。多个通孔由腔和通孔限定。填充通孔的导电材料形成为限定多个导电柱。在上表面上形成有从上表面延伸到导电柱的顶表面和多个盲孔的绝缘层。填充盲孔的图案化电路层形成在顶表面上，连接到导电柱并暴露顶表面的一部分。在图案化电路层上形成焊料掩模层，并且具有暴露图案化电路层的一部分以限定多个焊盘的多个开口。

6. 发明授权

US08949373B2 Method and system for playing multimedia on virtual desktop, cloud-based system for providing virtual desktop and computer readable storage medium applying the method 有权
标题翻译：在虚拟桌面上播放多媒体的方法和系统，用于提供虚拟桌面的基于云的系统和应用该方法的计算机可读存储介质
公开(公告)号：US08949373B2
公开(公告)日：2015-02-03
申请号：US13323836
申请日：2011-12-13
申请人： Jui-Hao Sun , Yu-Wei Chuang , Feng-Cheng Lin
发明人： Jui-Hao Sun , Yu-Wei Chuang , Feng-Cheng Lin
IPC分类号： G06F15/16 , G06F3/00 , G06F9/44 , H04L29/08
CPC分类号： G06F9/4445 , G06F9/452 , H04L67/26 , H04L67/2823
摘要： A method for playing multimedia on virtual desktop includes the following steps: a cloud-based system receives a virtual desktop request from a client. The cloud-based system provides a virtual desktop to the client through a virtual desktop connection for the client to display. The cloud-based system receives a request of multimedia streaming through the virtual desktop connection for obtaining a target multimedia file to display on the virtual desktop of the client. The cloud-based system obtains the target multimedia file. The cloud-based system builds a PUSH connection with the client and transmits the target multimedia file to the client through the PUSH connection for playing the target multimedia file on the virtual desktop of the client.
摘要翻译：在虚拟桌面上播放多媒体的方法包括以下步骤：基于云的系统从客户端接收虚拟桌面请求。基于云的系统通过虚拟桌面连接向客户端提供虚拟桌面，以供客户端显示。基于云的系统通过虚拟桌面连接接收多媒体流的请求，以获得在客户端的虚拟桌面上显示的目标多媒体文件。基于云的系统获取目标多媒体文件。基于云的系统与客户端建立PUSH连接，并通过PUSH连接将目标多媒体文件传输到客户端，用于在客户机的虚拟桌面上播放目标多媒体文件。

7. 发明授权

US08893379B2 Manufacturing method of package structure 有权
标题翻译：包装结构的制造方法
公开(公告)号：US08893379B2
公开(公告)日：2014-11-25
申请号：US13692971
申请日：2012-12-03
申请人： Shih-Hao Sun , Chang-Fu Chen
发明人： Shih-Hao Sun , Chang-Fu Chen
IPC分类号： H05K3/30 , H01L21/56 , H01L21/48 , H01L23/495 , H01L23/00
CPC分类号： H01L21/563 , H01L21/4821 , H01L21/568 , H01L23/49582 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A manufacturing method of a package structure is provided. In the manufacturing method, a metal substrate having a seed layer is provided. A patterned circuit layer is formed on a portion of the seed layer. A first patterned dry film layer is formed on the other portion of the seed layer. A surface treatment layer is electroplated on the patterned circuit layer with use of the first patterned dry film layer as an electroplating mask. The first patterned dry film layer is removed. A chip bonding process is performed to electrically connect a chip to the surface treatment layer. An encapsulant is formed on the metal substrate. The encapsulant encapsulates the chip, the surface treatment layer, and the patterned circuit layer. The metal substrate and the seed layer are removed to expose a bottom surface of the encapsulant and a lower surface of the patterned circuit layer.
摘要翻译：提供一种封装结构的制造方法。在制造方法中，提供具有种子层的金属基板。在种子层的一部分上形成图案化电路层。第一图案化的干膜层形成在种子层的另一部分上。使用第一图案化干膜层作为电镀掩模，在图案化电路层上电镀表面处理层。去除第一图案干膜层。执行芯片接合工艺以将芯片电连接到表面处理层。在金属基板上形成密封剂。密封剂封装芯片，表面处理层和图案化电路层。除去金属基底和种子层以露出密封剂的底表面和图案化电路层的下表面。

8. 发明申请

US20140317907A1 MANUFACTURING METHOD OF PACKAGE STRUCTURE 审中-公开
标题翻译：包装结构的制造方法
公开(公告)号：US20140317907A1
公开(公告)日：2014-10-30
申请号：US14324232
申请日：2014-07-06
申请人： Shih-Hao Sun
发明人： Shih-Hao Sun
IPC分类号： H05K13/00
CPC分类号： H05K13/00 , H01L23/13 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/16225 , H01L2224/16227 , H01L2924/12041 , H01L2924/15788 , H05K1/0207 , H05K1/185 , Y10T29/49002 , Y10T29/49126 , Y10T29/49146 , H01L2924/00
摘要： A manufacturing method of a package structure is provided. A substrate having an upper surface and a lower surface opposite to each other and an opening communicating the surfaces is provided. An electronic device is configured in the opening. An adhesive layer and a patterned metal layer located on the adhesive layer are laminated on the lower surface and expose a bottom surface of the electronic device. A heat-dissipating column is formed on the bottom surface exposed by the adhesive layer and the patterned metal layer and connects the patterned metal layer and the bottom surface. A first and a second laminated structures are laminated on the upper surface of the substrate and the patterned metal layer, respectively. The first laminated structure covers the upper surface of the substrate and a top surface of the electronic device. The second laminated structure covers the heat-dissipating column and the patterned metal layer.
摘要翻译：提供一种封装结构的制造方法。提供具有彼此相对的上表面和下表面的基板以及连通表面的开口。电子设备配置在开口中。位于粘合剂层上的粘合剂层和图案化的金属层层压在下表面上并暴露电子器件的底表面。在由粘合层和图案化金属层露出的底面上形成散热柱，并连接图案化的金属层和底面。第一和第二层压结构分别层叠在基板的上表面和图案化的金属层上。第一层压结构覆盖基板的上表面和电子设备的顶表面。第二层压结构覆盖散热柱和图案化的金属层。

9. 发明授权

US08669142B2 Method of manufacturing package structure 有权
标题翻译：制造包装结构的方法
公开(公告)号：US08669142B2
公开(公告)日：2014-03-11
申请号：US13906355
申请日：2013-05-31
申请人： Shih-Hao Sun
发明人： Shih-Hao Sun
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A manufacturing method of a package structure is provided. A seed layer is formed on a upper surface of a metal substrate. A patterned dry film layer is formed on a lower surface of the metal substrate and the seed layer. A portion of the seed layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a circuit layer on the portion of the seed layer exposed by the patterned dry film layer. A chip is bonded to and electrically connected to the circuit layer. A molding compound is formed on the metal substrate. The molding compound encapsulates the chip, the circuit layer and the portion of the seed layer. A portion of the metal substrate and a portion of the seed layer are removed so as to expose a portion of the molding compound.
摘要翻译：提供一种封装结构的制造方法。种子层形成在金属基板的上表面上。在金属基板的下表面和种子层上形成图案化的干膜层。种子层的一部分被图案化的干膜层曝光。图案化的干膜层用作电镀掩模，以在由图案化的干膜层暴露的种子层的部分上电镀电路层。芯片被接合并电连接到电路层。在金属基材上形成模塑料。模塑料封装芯片，电路层和种子层的部分。去除金属基材的一部分和种子层的一部分，以暴露部分模塑料。

10. 发明申请

US20140041922A1 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：包装及其制造方法
公开(公告)号：US20140041922A1
公开(公告)日：2014-02-13
申请号：US13615698
申请日：2012-09-14
申请人： Shih-Hao Sun
发明人： Shih-Hao Sun
IPC分类号： H05K1/11 , H05K3/42
CPC分类号： H05K3/42 , H01L21/447 , H01L21/486 , H01L23/49827 , H01L33/642 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , Y10T29/49165 , H01L2224/0401
摘要： A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities and the through holes. A conductive material filling up the vias is formed to define plural conductive posts. An insulation layer having a top surface and plural blind vias extending from the top surface to the conductive posts is formed on the upper surface. A patterned circuit layer filling up the blind vias, being connected to the conductive posts and exposing a portion of the top surface is formed on the top surface. A solder mask layer is formed on the patterned circuit layer and has plural openings exposing a portion of the patterned circuit layer to define plural pads.
摘要翻译：提供了一种封装载体的制造方法。提供了具有上表面，下表面，位于下表面的多个空腔和穿过绝缘基板并分别与空腔连通的多个通孔的绝缘基板。多个通孔由腔和通孔限定。填充通孔的导电材料形成为限定多个导电柱。在上表面上形成有从上表面延伸到导电柱的顶表面和多个盲孔的绝缘层。填充盲孔的图案化电路层形成在顶表面上，连接到导电柱并暴露顶表面的一部分。在图案化电路层上形成焊料掩模层，并且具有暴露图案化电路层的一部分以限定多个焊盘的多个开口。

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