会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • Method and apparatus for providing supplemental cooling to server racks
    • 为服务器机架提供补充冷却的方法和装置
    • US20090046430A1
    • 2009-02-19
    • US12228053
    • 2008-08-07
    • Richard Grant BrewerHae-won ChoiJames HomTien Chih (Eric) LinDouglas E. Werner
    • Richard Grant BrewerHae-won ChoiJames HomTien Chih (Eric) LinDouglas E. Werner
    • H05K7/20
    • H05K7/20736
    • A cooling system includes a re-configurable duct work assembly for a server rack or other electronics enclosure. Heat generating devices are positioned within the electronics enclosure and heat exchangers are coupled to the heat generating devices via the duct work. The duct work is positioned within a plenum between the back of the electronics servers and the heat exchangers. The interior of the electronics enclosure is conceptually segmented into heat zones. The duct work is used to selectively direct heated air to the heat exchangers. In some embodiments, the heated air output from a single heat zone is directed by the duct work to a corresponding single heat exchanger. In other embodiments, the heated air output from a group of adjacent heat zones is combined within a single duct work guide that directs the combined heated air to a corresponding number of adjacent heat exchangers.
    • 冷却系统包括用于服务器机架或其他电子设备外壳的可重构管道工作组件。 热产生装置位于电子设备外壳内,热交换器通过管道工作连接到发热装置。 管道工作位于电子服务器的背面和热交换器之间的集气室内。 电子外壳的内部在概念上分为热区。 管道工作用于选择性地将加热的空气引导到热交换器。 在一些实施例中,从单个加热区域输出的加热空气由管道工作引导到相应的单个热交换器。 在其它实施例中,来自一组相邻加热区域的加热空气输出在单个管道工作导向器内组合,其将组合的加热空气引导到相应数量的相邻热交换器。
    • 8. 发明申请
    • Thermal bus or junction for the removal of heat from electronic components
    • 用于从电子部件去除热量的热母线或接头
    • US20090225515A1
    • 2009-09-10
    • US12381332
    • 2009-03-10
    • James HomRichard Grant BrewerHae-won Choi
    • James HomRichard Grant BrewerHae-won Choi
    • H05K7/20F28D15/00F28F1/10
    • H05K7/20781E05D11/0081E05Y2800/10E05Y2900/132
    • A thermal bus enables the use of multiple separate heat pipe assemblies instead of using a single heat pipe assembly spanning the distance from heat source to cold plate. The use of a thermal bus can decrease the orientation effects as well as decrease the travel length of any single heat pipe assembly. In addition, the use of multiple heat pipe assemblies enables each individual heat pipe assembly to be optimized to meet localized heat transfer characteristics between each heat source, the thermal bus, and the cold plate. Such optimization can include the use of differently sized heat pipes, wick structures within the heat pipe, and working fluid used within the heat pipe. The thermal bus provides an intermediate thermal transfer from one heat pipe assembly serially coupled to another heat pipe assembly, thereby enabling multiple serially coupled heat pipe assemblies to transfer heat from a given heat source to the cold plate at the edge of the electronics board.
    • 热母线可以使用多个单独的热管组件,而不是使用跨过热源到冷板的距离的单个热管组件。 使用热母线可以降低取向效果,并减少任何单个热管组件的行进长度。 此外,使用多个热管组件可使每个单独的热管组件得以优化,以满足每个热源,热母线和冷板之间的局部热传递特性。 这种优化可以包括使用不同尺寸的热管,热管内的芯结构以及在热管内使用的工作流体。 热母线提供从串联耦合到另一热管组件的一个热管组件的中间热传递,从而使得多个串联耦合的热管组件能够将热量从给定的热源传送到电子板的边缘处的冷板。