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1. 发明申请

US20100265988A1 SUBSTRATE COOL DOWN CONTROL 审中-公开
标题翻译：基板冷却控制
公开(公告)号：US20100265988A1
公开(公告)日：2010-10-21
申请号：US12758206
申请日：2010-04-12
申请人： JACOB NEWMAN , DINESH KANAWADE , HENRY BARANDICA , NIR MERRY
发明人： JACOB NEWMAN , DINESH KANAWADE , HENRY BARANDICA , NIR MERRY
IPC分类号： G01K13/00 , G01J5/00 , G01K7/02 , G01K11/12
CPC分类号： G01K13/00 , G01J5/0003 , G01J5/0007 , G01J5/02 , G01J5/0255 , G01K11/18 , H01L21/67103 , H01L21/67248
摘要： Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.
摘要翻译：提供了精确的基板冷却控制的方法和装置。用于测量衬底温度的装置可包括用于支撑衬底的冷却板; 传感器，当设置在所述冷却板上时，提供对应于所述基板的温度的数据; 以及耦合到所述传感器的计算机，以从所述传感器数据确定所述基板的温度。用于测量衬底的温度的方法可以包括将待冷却的衬底设置到设置有冷却板的腔室，传感器以提供对应于衬底的温度的数据和耦合到传感器的计算机; 在经过预定的第一时间间隔之后感测衬底的第一温度; 将第一温度与预定温度进行比较; 以及确定所述第一温度是否大于，等于或小于所述预定温度。

2. 发明申请

US20130017315A1 METHODS AND APPARATUS FOR CONTROLLING POWER DISTRIBUTION IN SUBSTRATE PROCESSING SYSTEMS 审中-公开
公开(公告)号：US20130017315A1
公开(公告)日：2013-01-17
申请号：US13183921
申请日：2011-07-15
申请人： CANFENG LAI , DAVID EUGENE ABERLE , MICHAEL P. CAMP , HENRY BARANDICA , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , JEFFREY TOBIN , DOUGLAS H. BURNS , LARA HAWRYLCHAK
发明人： CANFENG LAI , DAVID EUGENE ABERLE , MICHAEL P. CAMP , HENRY BARANDICA , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , JEFFREY TOBIN , DOUGLAS H. BURNS , LARA HAWRYLCHAK , PETER I. PORSHNEV
IPC分类号： C23C16/505 , C23C16/52 , H05H1/46
CPC分类号： H01J37/32082 , H01J37/321 , H01J37/32155 , H01J37/32174
摘要： Methods and apparatus for controlling power distribution in a substrate processing system are provided. In some embodiments, a substrate processing system including a process chamber having a substrate support and a processing region disposed above the substrate support; a first conduit disposed above the processing region to provide a portion of a first toroidal path that extends through the first conduit and across the processing region; a second conduit disposed above the processing region to provide a portion of a second toroidal path that extends through the second conduit and across the processing region; an RF generator coupled to the first and second conduits to provide RF energy having a first frequency to each of the first and second conduits; an impedance matching network disposed between the RF generator and the first and second conduits; and a power divider to control the amount of RF energy provided to the first and second conduits from the RF generator.

3. 发明申请

US20130014894A1 METHODS AND APPARATUS FOR CONTROLLING POWER DISTRIBUTION IN SUBSTRATE PROCESSING SYSTEMS 审中-公开
标题翻译：用于控制基板处理系统中功率分配的方法和装置
公开(公告)号：US20130014894A1
公开(公告)日：2013-01-17
申请号：US13190985
申请日：2011-07-26
申请人： CANFENG LAI , DAVID E. ABERLE , MICHAEL P. KAMP , HENRY BARANDICA , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , JEFFREY TOBIN , DOUGLAS H. BURNS , LARA HAWRYLCHAK , PETER I. PORSHNEV
发明人： CANFENG LAI , DAVID E. ABERLE , MICHAEL P. KAMP , HENRY BARANDICA , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , JEFFREY TOBIN , DOUGLAS H. BURNS , LARA HAWRYLCHAK , PETER I. PORSHNEV
IPC分类号： C23F1/08 , C23C16/52 , C23C16/505
CPC分类号： H01J37/32082 , H01J37/321 , H01J37/32155 , H01J37/32174
摘要： Methods and apparatus for controlling power distribution in a substrate processing system are provided. In some embodiments, a substrate processing system including a process chamber having a substrate support and a processing region disposed above the substrate support; a first conduit disposed above the processing region to provide a portion of a first toroidal path that extends through the first conduit and across the processing region; a second conduit disposed above the processing region to provide a portion of a second toroidal path that extends through the second conduit and across the processing region; an RF generator coupled to the first and second conduits to provide RF energy having a first frequency to each of the first and second conduits; an impedance matching network disposed between the RF generator and the first and second conduits; and a power divider to control the amount of RF energy provided to the first and second conduits from the RF generator.
摘要翻译：提供了一种用于控制基板处理系统中的配电的方法和装置。在一些实施例中，衬底处理系统包括具有衬底支撑件的处理室和设置在衬底支架上方的处理区域; 设置在所述处理区域上方以提供延伸穿过所述第一管道并横跨所述处理区域的第一环形路径的一部分的第一管道; 设置在所述处理区域上方的第二导管，以提供延伸穿过所述第二导管并横跨所述处理区域的第二环形路径的一部分; 耦合到所述第一和第二导管的RF发生器，以向所述第一和第二导管中的每一个提供具有第一频率的RF能量; 设置在所述RF发生器与所述第一和第二管道之间的阻抗匹配网络; 以及功率分配器，用于控制从RF发生器提供给第一和第二导管的RF能量的量。

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