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2. 发明授权

US08089145B1 Semiconductor device including increased capacity leadframe 有权
标题翻译：包括增加容量引线框的半导体器件
公开(公告)号：US08089145B1
公开(公告)日：2012-01-03
申请号：US12272606
申请日：2008-11-17
申请人： Gwang Ho Kim , Jin Seong Kim , Dong Joo Park , Dae Byoung Kang
发明人： Gwang Ho Kim , Jin Seong Kim , Dong Joo Park , Dae Byoung Kang
IPC分类号： H01L23/48 , H01L23/52 , H01L23/495 , H01L23/02 , H01L29/40 , H01L23/28
CPC分类号： H01L23/49541 , H01L21/4842 , H01L23/3107 , H01L23/49517 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/85 , H01L2224/92 , H01L2224/92247 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/078 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要： In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.
摘要翻译：根据本发明，提供了包括唯一配置的引线框的半导体封装（例如，QFP封装），其尺寸和配置为使半导体封装中的暴露引线的可用数量最大化。更具体地，本发明的半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘。此外，半导体封装包括多个引线。这些引线中的一些以两个同心的行或环提供，其至少部分地绕过管芯焊盘，其他引线包括从半导体封装的封装主体的相应侧表面突出的部分。连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。

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