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    • 3. 发明申请
    • LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 发光装置及其制造方法
    • US20100109026A1
    • 2010-05-06
    • US12266300
    • 2008-11-06
    • Grigory ONUSHKINJin Hyun LeeMyong Soo ChoPun Jae Choi
    • Grigory ONUSHKINJin Hyun LeeMyong Soo ChoPun Jae Choi
    • H01L33/00H01L21/00
    • H01L27/156H01L33/08H01L33/20H01L33/385
    • Provided are a light emitting device and a method of manufacturing the same. The light emitting device includes each of first and second semiconductor stacked structures including first and second conductive type semiconductor layers and an active layer, first and second contacts on tops and bottoms of the first and second semiconductor stacked structures to be connected to the first and second conductive type semiconductor layers, a substrate structure including first and second sides, a first insulation layer on an area where no second contact is formed among a surface of the first and second semiconductor stacked layers, first and second conductive layers connected to the second contacts of the first and second semiconductor stacked structures, first and second wiring layers on the first side of the substrate structure, and first and second external connection terminals connected to the first and second contacts of the first semiconductor stacked structure.
    • 提供一种发光器件及其制造方法。 发光器件包括第一和第二半导体层叠结构中的每一个,包括第一和第二导电类型半导体层和有源层,第一和第二半导体堆叠结构的顶部和底部上的第一和第二触点将被连接到第一和第二 导电型半导体层,包括第一和第二侧的衬底结构,在第一和第二半导体层叠层的表面之间不形成第二接触的区域上的第一绝缘层,与第二和第二侧连接的第一和第二导电层 第一和第二半导体层叠结构,在基板结构的第一侧上的第一和第二布线层,以及连接到第一半导体堆叠结构的第一和第二触点的第一和第二外部连接端子。